Benutzeranleitung / Produktwartung SI5327 des Produzenten Silicon Laboratories
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Rev. 0.5 6/11 Copyright © 2011 by Silicon Labo rato ries Si53xx-RM A NY -F REQUENCY P RECISION C LOCKS Si5316, Si5319, Si5322, Si5323, Si5324, Si5325, Si5326, Si5327, Si536 5, Si5366, Si5367, Si5368,.
Si53xx-RM 2 Rev. 0.5.
Si53xx-RM Rev. 0.5 3 T ABLE OF C ONTENT S Section Page 1. Any-Frequency Precision Clock Pr oduct Family Overview . . . . . . . . . . . . . . . . . . . . . . 12 2. Narrowband vs. Wideba nd Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Si53xx-RM 4 Rev. 0.5 6.3.1. Manual Clock Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 6.3.2. Automatic Clock Selection (Si5322, Si5323, Si5365, Si5366) . . . . . . . . . . .
Si53xx-RM Rev. 0.5 5 and Si5375 Free Run Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 7.5.1. Fr ee Run Mode Programm ing Procedur e . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Si53xx-RM 6 Rev. 0.5 8.2.1. LVPECL TQFP Ou tput Signal Format Restrict ions at 3.3 V (Si5367, Si5368, Si5369) . . . . . . 107 8.2.2. Typical Output Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Si53xx-RM Rev. 0.5 7 L IST OF F IGURES Figure 1. Si5316 Any-Frequency Ji tter Attenuator Block Di agram . . . . . . . . . . . . . . . . . . . . . 17 Figure 2. Si5319 Any-Frequency Jitter Attenuating Clock Multiplier Blo ck Diagram . . . . . . . . 18 Figure 3.
Si53xx-RM 8 Rev. 0.5 Figure 43. Differential Output Example Requiring Attenuatio n . . . . . . . . . . . . . . . . . . . . . . . 108 Figure 44. Typical CMOS Output Circuit (Tie CKOUTn+ and CKOU Tn– Together) . . . . . . . 108 Figure 45. CKOUT Structure .
Si53xx-RM Rev. 0.5 9 Figure 88. RF Generator, Si532 6, Si5324; No Jitter (For Reference) . . . . . . . . . . . . . . . . . . 165 Figure 89. RF Generator, Si532 6, Si5324 (50 Hz Jitter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 Figure 90.
Si53xx-RM 10 Rev. 0.5 L IST OF T ABLES Table 1. Product Selection Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Table 2. Product Selection Gu ide (Si5322/25/65/67) . . . . . . . . . . . . . . . .
Si53xx-RM Rev. 0.5 11 Table 42. Digital Hold History Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 Table 43. Digital Hold History Averaging Time . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Si53xx-RM 12 Rev. 0.5 1. Any-Frequency Precision Clock Produ ct Family Overview Silicon Laboratories Any-Fr equency Precision Clock products provide ji tter attenuation and clock multiplication/ clock division for applications requir i ng sub 1 ps rms jitter perfor mance.
Si53xx-RM Rev. 0.5 13 A wide range of settings are available, but they are a su bset of the frequen cy plans supported by the Si5323 and Si5366 jitter-attenuating clock multip liers. The Si5325 and Si5367 ar e microprocesso r-controlled clock m ultipliers that can be controlled via an I 2 C or SPI interface.
Si53xx-RM 14 Rev. 0.5 T able 1. Prod uct Selection Guide Part Number Control Number of Input s and Outputs Input Frequency (MHz) * Output Frequency (MHz) * RMS Phase Jitter ( 1 2k H z – 2 0M H z ) PLL Bandwi d th Hitless Switching Free Run Mode Package Si5315 Pin 1PLL, 2 | 2 0.
Si53xx-RM Rev. 0.5 15 T able 2. Product Sel ection Guide (Si5322/25/65/67) Device Clock Input s Clock Output s P Control Max Input Freq (MHz) 1 Max Output Frequenc y (MHz) Jitter Generatio n (12 kHz – 20 MHz) LOS Hitless Switching FOS Alarm LOL Alarm FSYNC Realignment 36 Lead 6 mm x 6 mm QFN 100 Lead 14 x 14 mm TQFP 1.
Si53xx-RM 16 Rev. 0.5 2. Narrowband vs. W ideband Overview The narrowband (NB) devices of fer a nu mb er of features and cap abilities th at are not available with the wideband (WB) devices, as outlin.
Si53xx-RM Rev. 0.5 17 3. Any-Frequency Clock Family Members 3.1. Si5316 The Si5316 is a low jitter , precision jitter attenu ator fo r high-speed c ommunicatio n systems , including OC -48, OC - 192, 10G Ethernet, and 10G Fibre Channe l.
Si53xx-RM 18 Rev. 0.5 3.2. Si5319 The Si5319 is a jitter-attenuating pr ecision M/N cloc k multiplier for applications requiring sub 1 ps jitter performance. The Si5 319 accepts one clock input ranging from 2 kHz to 710 MHz and generates one clock output ranging from 2 kHz to 945 MHz and sele ct frequencies to 1.
Si53xx-RM Rev. 0.5 19 3.3. Si5322 The Si5322 is a low jitter , prec ision cl ock multiplier for applications requir ing clock multiplication without jitter attenuation . The Si5322 accepts dual cloc k inputs rangi ng from 19.44 to 707 MHz and generates two frequency- multiplied clock output s ranging from 19.
Si53xx-RM 20 Rev. 0.5 3.4. Si5323 The Si5323 is a jitter-attenuating prec ision clock multiplier for high-speed communication systems, including SONET OC-48/OC-192, Ethernet, Fibre Chann el, and br oadcast vid eo (HD SDI, 3G SDI).
Si53xx-RM Rev. 0.5 21 3.5. Si5324 The Si5324 is a jitter-attenuating pre cis ion clock multiplier for ap plications requiring sub 1 ps jitter performance. The Si5324 accept s dual clock input s ranging from 2 kHz to 710 MHz and generates two independent, synchronous clo ck outputs ranging from 2 kHz to 94 5 MHz and select frequencies to 1.
Si53xx-RM 22 Rev. 0.5 3.6. Si5325 The Si5325 is a low jitter , prec ision cl ock multiplier for applications requir ing clock multiplication without jitter attenuation.
Si53xx-RM Rev. 0.5 23 3.7. Si5326 The Si5326 is a jitter-attenua ting precis ion clock multiplier for applications requiring sub 1 p s jitter performa nce. The Si5326 accept s dual clock input s ranging from 2 kHz to 710 MHz and generates two independent, synchronous clo ck outputs ranging from 2 kHz to 94 5 MHz and select frequencies to 1.
Si53xx-RM 24 Rev. 0.5 3.8. Si5327 The Si5327 is a jitter-attenuating pre cis ion clock multiplier for ap plications requiring sub 1 ps jitter performance. The Si5327 accept s dual clock input s ranging from 2 kHz to 710 MHz and generates two independent, synchronous clock output s ranging from 2 kHz to 808 MHz .
Si53xx-RM Rev. 0.5 25 3.9. Si5365 The Si5365 is a low jitter , prec ision cl ock multiplier for applications requir ing clock multiplication without jitter attenuation. The Si5365 accept s four clock input s ranging from 19.44 MHz to 707 MHz and generates five frequency-mu ltiplied clock out puts ranging from 19.
Si53xx-RM 26 Rev. 0.5 3.10. Si5366 The Si5366 is a jitter-attenuating prec ision clock multiplier for high-speed communication systems, including SONET OC-4 8/OC- 192 , Ethe rnet, a nd F ibre Chan nel.
Si53xx-RM Rev. 0.5 27 3.1 1. Si5367 The Si5367 is a low jitter , prec ision cl ock multiplier for applications requir ing clock multiplication without jitter attenuation .
Si53xx-RM 28 Rev. 0.5 3.12. Si5368 The Si5368 is a jitter-attenuating precision clock mult iplier for applications requ iring sub 1 p s rms jitter performanc e. The Si5368 accepts four clock inputs ranging from 2 kHz to 710 MHz and generates five independent, synchronous clo ck outputs ranging fr om 2 kHz to 945 MHz and select frequencies to 1.
Si53xx-RM Rev. 0.5 29 3.13. Si5369 The Si5369 is a jitter-attenuating precision clock mult iplier for applications requ iring sub 1 p s rms jitter performanc e. The Si5369 accepts four clock inputs ranging from 2 kHz to 710 MHz and generates five independent, synchronous clo ck outputs ranging fr om 2 kHz to 945 MHz and select frequencies to 1.
Si53xx-RM 30 Rev. 0.5 3.15. Si5374 The Si5374 is a hig hly in tegr ated , 4- PLL jit ter-at tenu ating precision clock multiplier for applications requiring sub 1 ps jitter perfor mance.
Si53xx-RM Rev. 0.5 31 3.16. Si5375 The Si5375 is a hig hly in tegr ated , 4- PLL jit ter-at tenu ating precision clock multiplier for applications requiring sub 1 ps jitter performance. Each of the DSPLL® clock multip li er engines accept s an input clock ranging fr om 2 kHz to 710 MHz and gen erates an output clock rangin g from 2 kHz to 808 MHz.
Si53xx-RM 32 Rev. 0.5 4. Device S pecifications The following t ables are intended to si mplify device selection. The specific ations in the individual device data sheets t ake precede nce over this document. Refer to the re spective device data sheet for devices not listed in th e tables below .
Si53xx-RM Rev. 0.5 33 T able 4. DC Ch aracteristics Parameter Sy mbo l T est Condition Si5316 Si5322 Si5324 Si5325 Si5365 Si5366 Si5367 Si5368 Min T yp Max Uni ts Supply Current (Independent o f Supply V oltage) I DD L VPECL Format 622.08 MH z Out All CKOUT’s Enabled — 251 279 mA — 394 435 mA L VPECL Format 622.
Si53xx-RM 34 Rev. 0.5 Output Clocks (CKOUTn—See “8.2. Output Clock Drivers” for Conf iguring Output Drivers for L VPECL/CML/L VDS/CMOS) Common Mode V OCM L VPECL 100 load line-to-line V DD – 1.42 —V DD – 1.25 V Differential Output Swing V OD L VPECL 100 load line-to-line 1 1.
Si53xx-RM Rev. 0.5 35 Output Drive Current (CMOS driv- ing into CKO VOL for output low or CKO- VOH for output high. CKOUT+ and CKOUT - shorted externally) CKO IO CMOS Driving into CKO- VOL for output low or CKO VOH for out- put high. CKOUT+ and CKOUT– shorted externa lly .
Si53xx-RM 36 Rev. 0.5 Input Mid Current I IMM Se e note 2 –2 — 2 µA Input High Current I IHH See note 2 —— 2 0 µ A L VCMOS Out put Pins Output V oltage Low V OL I O =2m A V DD =1 . 6 2V —— 0 .
Si53xx-RM Rev. 0.5 37 T able 5. DC Ch aracteristics—Microprocessor Devices (Si5324 , Si5325, Si5367, Si5368) Parameter Symbol T est Conditio n Min T yp M ax Units I 2 C Bus Lines (SDA, SCL) Input V oltage Low V ILI2C — — 0.25 x V DD V Input V oltage High V IHI2C 0.
Si53xx-RM 38 Rev. 0.5 Figure 18. SPI Timing Diagra m T able 7. DC Ch aracteristics—Narrowband Devices (Si53 16, Si5319, Si5323, Si5366, Si5368) Parameter Symbol T est Condition Min T yp M ax Unit Si.
Si53xx-RM Rev. 0.5 39 Figure 19. Frame Synchronization T iming CLKOUT _2 CLKIN_4* FSYNC_ALIGN FSYN COUT* * CLKIN _2 and CLKI N_4 ar e the ac tive i nput c lock and f rame sync p air in this example t FSSU t FSH t 1/f FSYNC Fixed number of CLKOUT _2 clock cy cles.
Si53xx-RM 40 Rev. 0.5 T able 8. AC Characteristics—All De vices Parameter Symbol T est Condit ion Si5316 Si5322 Si5324 Si5325 Si5365 Si5366 Si5367 Si5368 Min T yp Max Unit s Input Frequency CKN F 19.38 — 710 MHz 19.43 — 707.35 MHz 0.
Si53xx-RM Rev. 0.5 41 LV C M O S P i n s Input Capacitance C in —— 3p F Minimum Rese t Pulse Width t RSTMN 1—— µ s Reset to Micropro- cesso.
Si53xx-RM 42 Rev. 0.5 Device Ske w Output Clock Skew , see Section 7.7.4 t SKEW of CKOUT_n to of CKOUT_m, CKOUT_n and CKOUT_m at same frequency and signal format PHASE OFFSET = 0 SQICAL .
Si53xx-RM Rev. 0.5 43 Output Phase Change due to T emperature V ari- ation t TEMP Max phase changes from –40 to +85 °C — 300 500 ps Jitter T olera nce J TOL See "5.2.3. Jitter T olerance" on page 49 .
Si53xx-RM 44 Rev. 0.5 T able 9. Jitter Generation (Si5316, Si5324, Si5366, Si5368) Parameter Symbol T est Condition 1,2,3,4,5 Min T yp Max GR-253 S p ec Unit Measurement Filter (MHz) DSPLL Bandwid th 2 Jitter Gen OC-1 92 J GEN 0.02–80 120 Hz — 4.2 6.
Si53xx-RM Rev. 0.5 45 T able 1 1. Thermal Charact eristics Parameter Symbol T est Condition Devices V alue Unit Thermal Resistance Jun ction to Ambient JA S till Air Si5316, Si5319, Si5322, Si5323.
Si53xx-RM 46 Rev. 0.5 5. DSPLL (All Devices) All members of the Any-Freq uency Precision Clocks family incorporate a phase-locked loop (PLL) that utilizes Silicon Laboratories' third generation DSPLL technology to eliminate jitter , noise, and the need for external VCXO and loop filter component s found in discrete PLL implem entations.
Si53xx-RM Rev. 0.5 47 5.1. Clock Multiplication Fundamental to th ese pa rt s is a clock multiplication circuit th at is simplified in Figur e 21. By having a large range of dividers an d multipliers, ne arly any outp ut frequency c a n be created from a fixed input fr equency .
Si53xx-RM 48 Rev. 0.5 5.2. PLL Performance All members of the Any-Freq uency Precision Clock family of devices provide extremely low jitter generat ion, a well- controlled jitter transfer function, a nd high ji tter tolerance.
Si53xx-RM Rev. 0.5 49 5.2.3. J itter T oleran ce Jitter tolerance is defined as the maximum peak-to-pea k sinusoidal jitter tha t can be present o n the incoming clock before the DSPLL lose s lock. The tolerance is a function of the jitter fr equency , bec ause tolerance improves for lower input ji tter frequency .
Si53xx-RM 50 Rev. 0.5 6. Pin Control Part s (Si5316, Si5322, Si5323 , Si5365, Si5366) These part s provide high-performance clo ck multiplication wit h simple pin control. Many of the control inp uts are three levels: High, Low , and Medium. High and Low ar e standar d voltage levels determined by the supply volt age: V DD and Ground.
Si53xx-RM Rev. 0.5 51 The Si5316 can accept a CKIN1 in put at a dif ferent freq uency tha n the CKIN2 input. The freq uency of one input clock can be 1x, 4x, or 32x the frequency of the other input clock. The output frequency is always e qual to the lower of the two clock inputs and is set via the FRQSEL [ 1:0] pins.
Si53xx-RM 52 Rev. 0.5 6.1.2. Clock M ultiplica t io n (S i5322, Si5323, Si5365, Si5366) These part s provide flexible freq uency plans for SONET , DA T AC OM , an d inte rw or kin g be tw ee n th e two ( T able 16, T able 17, an d T able 18 respectively).
Si53xx-RM Rev. 0.5 53 7L L H M 19.4 4 1 19. 44 19.44 0.008 8L L H H 2 3 8.88 38. 88 0. 008 9L M L L 4 77. 76 77.76 0.008 10 LMLM 8 155.52 155.52 0.008 1 1 LMLH 8 x (255/238) 166.63 166.63 NA 12 LMML 8 x (255/237) 167.33 167.33 NA 13 LMMM 8 x (255/236) 168.
Si53xx-RM 54 Rev. 0.5 28 MLLM 77.7 6 1/4 19.44 1 9.44 0.008 29 MLLH 1/2 38.88 3 8.88 0.008 30 MLML 1 77. 76 77.76 0.008 31 MLMM 2 155.52 155.52 0.008 32 MLMH 2 x (255/238) 166.63 166.63 NA 33 MLHL 2 x (255/237) 167.33 167.33 NA 34 MLHM 2 x (255/236) 168.
Si53xx-RM Rev. 0.5 55 56 HLLL 167.33 237/255 155.52 155.52 NA 57 MMHM 1 167.33 167.33 NA 58 HLLM 4 x (237/255) 622.08 622.08 NA 59 MHML 4 669.33 669.33 NA 60 HLLH 168.04 236/255 155.52 155.52 NA 61 MMHM 1 168.04 168.04 NA 62 HLML 4 x (236/255) 622.
Si53xx-RM 56 Rev. 0.5 82 HHLH 669.33 1/4 x 237/255 155.52 155.52 NA 83 HMML 1/4 167.33 167.33 NA 84 HHML 237/255 622.08 622.08 NA 85 HMMH 1 669.33 669.33 NA 86 HHMM 672.16 1/4 x 236 /255 155.52 155.52 NA 87 HMML 1/4 168.04 168.04 NA 88 HHMH 236/255 622.
Si53xx-RM Rev. 0.5 57 T able 17. Dat acom Clock Multiplication Settings (FRQTBL = M, CK_CONF = 0) Setting FRQSEL[3:0] WB f IN (MHz) Mult Factor f OUT * (MHz) 0L L L L 15.625 2 31.25 1L L L M 46 2 . 5 2 LLLH 81 2 5 3L L M L 16 250 4L L M M 25 17/4 106.
Si53xx-RM 58 Rev. 0.5 34 MLHM 125 10/8 x 66/64 161.13 35 MLHH 10/8 x 66/64 x 255/238 172.64 36 MMLL 10/8 x 66 /64 x 255/237 173.37 37 MMLM 5x6 6 / 6 4 6 4 4 . 5 3 38 MMLH 5 x 66/64 x 255/23 8 690.57 39 MMML 5 x 66/64 x 255/23 7 693.48 40 MMMM 156.
Si53xx-RM Rev. 0.5 59 69 HLML 173.37 4/5 x 64/66 x 237/255 125 70 HLMM 64/66 x 23 7/255 156 .25 71 HLMH 237/255 161.13 72 HLHL 4 x 237/255 644.53 73 MHMM 46 9 3 . 4 8 74 HLHM 176.1 2/3 x 64/66 x 238/255 106.25 75 HLLL 64/66 x 23 8/255 159.3 75 76 HLLM 238/255 164.
Si53xx-RM 60 Rev. 0.5 102 HHML 693.48 1/5 x 64/66 x 237/255 125 103 HHMM 1/4 x 64/66 x 237/255 156.25 104 HHMH 1/4 x 237/255 161.13 105 H MML 1/4 173.37 106 HHHL 237/255 64 4.53 107 HMMM 16 9 3 . 4 8 108 HHHM 704.38 1/6 x 64/66 x 238/255 106.
Si53xx-RM Rev. 0.5 61 T able 18. SONET to Dat acom Clock Multiplication Settings Setting FRQSEL[3 :0] WB f IN (MHz) Mult Factor f OUT * (MHz) 0 LLLL 0.008 31 25 25 1 LLLM 6480 51.84 2 LLLH 53125/8 53.125 3 LLML 15625/2 62.5 4 LLMM 53125/4 106.25 5 LLMH 15625 125 6 LLHL 7 8125/4 156.
Si53xx-RM 62 Rev. 0.5 30 MLML 62.500 2 125 31 MLMM 4 250 32 MLMH 74.176 91/25 0 27 33 MLHL 1 74.17582 34 MLHM 91 x 1 1/250 x 4 74.25 35 MLHH 74.250 4/1 1 27 36 MMLL 4 x 250/1 1 x 91 74.17582 37 MMLM 1 74.25 38 MMLH 77.760 10625/7776 106.25 39 MMML 3125/1944 125 40 MMMM 15625 /7776 156.
Si53xx-RM Rev. 0.5 63 52 MHHM 155.520 15625/15552 156.25 53 MHHH 31875/31 104 159.375 54 HLLL 15625/15552 x 66/6 4 161.13 55 HLLM 31875/31 104 x 66/64 164.36 56 HLLH 15625/155 52 x 66/ 64 x 255/238 172.64 57 HLML 31875 /31 104 x 66/ 64 x 255/238 176.1 58 HLMM 10625/7776 212.
Si53xx-RM 64 Rev. 0.5 6.1.3. CKOUT3 and CKOUT4 (Si5365 and Si5366) Submultiples of th e output frequency on CKOUT1 and CKOUT2 can be produced on the CKOUT3 and CKOUT4 outputs using the DIV34 [1:0] cont rol pins as shown in T able 19.
Si53xx-RM Rev. 0.5 65 6.2. PLL Self-Calibration An internal self-calibrati on (ICAL) is performed before op eration to optimize loop paramete rs and jitter performance.
Si53xx-RM 66 Rev. 0.5 T able 20. Si5316 , Si5322, and Si5323 Pins and Reset Pin # Si5316 Pin Name Si5322 Pin Name Si5323 Pin Name Must Reset af ter Changing 2 N/A FRQTBL FRQTBL Y e s 1 1 RA TE 0 N/A R.
Si53xx-RM Rev. 0.5 67 6.3. Pin Control Input Clock Control This section describes the clock select ion capabilities (manual input selection, automatic input selection, hitless switching, and revertive sw itching). When switching between two clocks, LOL may temporarily go high if the two clocks differ in frequency by more than 100 ppm.
Si53xx-RM 68 Rev. 0.5 6.3.2. Automati c Clock Selecti on (Si5322, Si5323, Si5365, Si5366) The AUT OSEL input pin set s the input clock selection mode as shown in T a ble 24.
Si53xx-RM Rev. 0.5 69 At power-on or rese t, the va lid CKINn with the highest priority (1 being the highest priority) is auto matically selected. If no valid CKINn is av ailable, the device suppre sses the output clocks and waits for a valid CKINn signal.
Si53xx-RM 70 Rev. 0.5 6.4. Digit al Hold/VCO Freeze All Any-Frequency Pr ecision Clo ck devices featur e a hold over or VCO free ze mode, wh ereby the DSPL L is locked to a digital value. 6.4.1. Narro wband Digi ta l Hold (S i5316, Si5323 , Si5366) If an LOS or FOS condition exists on the selected input clock, the device enters digit al hold.
Si53xx-RM Rev. 0.5 71 6.6. Output Phase Adjust (Si5323, Si5366) Overall device skew (CKINn to CKOUT_n phase delay) is controllable via th e INC and DEC input pins . A positive pulse applied at the INC pin incr eases the de vice skew by 1/f OSC , one period of the DCO ou tput clock .
Si53xx-RM 72 Rev. 0.5 6.6.5. Disa bling FS_O UT (Si5366 ) The FS_OUT maybe disabled via the DBLFS pin, see T abl e 29. The additional state (M) prov ided allows for FS_OUT to drive a CMOS load while th e other clock outputs use a dif ferent signal format as specified by the SFOUT[1:0] pins.
Si53xx-RM Rev. 0.5 73 6.8. PLL Byp ass Mode The device support s a PLL bypa ss mode in which the select ed input clock is fed di rectly to all enabled output buffers, byp assing the DSPLL. In PLL bypass mode, the i nput and output clocks will be at the same frequency .
Si53xx-RM 74 Rev. 0.5 6.9.3. FSYNC Align Alarm (Si5366 and CK_CONF = 1 and FRQTBL = L) At power-up or an y time after the PLL h as lost lock an d relocked , the dev ice automa tically per forms a re alignmen t of FS_OUT us ing the curre ntly active sync in put.
Si53xx-RM Rev. 0.5 75 6.9.5.1. PLL Lock Detect (Si5316, Si5323, Si5366) The PLL lock detection algorithm indicates the lock st atus on the LOL out put pin. The algo rithm works by continuously moni toring the phase of the input clock in relation to the phase of the feed back clock.
Si53xx-RM 76 Rev. 0.5 7. Microprocessor Controlled Part s (Si5 319, Si5324, Si5325, Si5326, Si5327, Si5367, Si5368, Si5 369, Si5374, Si5375) The devices in this family provide a ri ch set of cloc k multiplication/clock divi sion options, loop bandwidth selections, output clock phase adjustment, and device control options.
Si53xx-RM Rev. 0.5 77 Because there is only one DCO and all of the outp uts must be frequencies that are in teger divisions of the DCO frequency , there a re restrictions on the r atio of one output frequency to anot her output frequ ency .
Si53xx-RM 78 Rev. 0.5 Figure 26. Narrowband PLL Divider Settings (Si5319, Si5324, Si5326, Si5327, Si536 8, Si5369, Si5374, Si5375) T able 35. Narrowband Frequency Limit s Signal Frequency Limit s CKINn 2 kHz–710 MHz f 3 2 kHz–2 MHz f OSC 4.85–5.
Si53xx-RM Rev. 0.5 79 The output divide r , NC1, is the product of a high-sp eed divider (N1_HS) a nd a low-speed divider ( N1_LS). Similarly , the fe edback divider N2 is the product of a h igh-speed divider N2_HS and a low-spee d divider N2_LS.
Si53xx-RM 80 Rev. 0.5 calibration and will appear afte r the self-calibration routine is completed. The SQ_ICAL bit is self-clearing after a successful ICAL. After a su ccessful self-calibration ha s been perform ed with a va lid input clock, it is not ne cessary to rein itiate a self- calibration for subseq uent losses of input clock.
Si53xx-RM Rev. 0.5 81 7.3. Input Clock Confi gurations (Si5367 and Si5368) The device support s two input clock configurations based on CK_CONFIG_REG .
Si53xx-RM 82 Rev. 0.5 Figure 28. Si5367, Si5368, and Si5369 Input Clock Selection 7.4.1. Manual Clock Selec tion (Si5324, Si5325, Si5326, Si5367, Si5 368 , Si5369, Si5374) Manual control of input clock selection is available by setting the AUT OSEL_REG [1:0] register bit s to 00.
Si53xx-RM Rev. 0.5 83 If the selected clock enters an a larm condition, the PLL enters digit al hold mode. The CKSEL_REG [1:0] c ontrols are ignored if auto matic clock selection is enabled .
Si53xx-RM 84 Rev. 0.5 7.4.2.2. De tailed Automatic Clock S elect ion Description (Si5367, Si5368, Si5369) The prioritization of clock input s for automatic switching is shown in T able 41.
Si53xx-RM Rev. 0.5 85 7.5. Si5319, Si5324, Si5326, Si5327, Si5368, Si 5369, Si5374 and Si 5375 Free Run Mode Figure 29. Free Run Mode Block Diagram CKIN2 has an extra mux with a p ath to the crystal os cillator output. When in Free Run mode, CKIN2 is sacrif iced (Si5326, Si5368, Si5369, Si537 4).
Si53xx-RM 86 Rev. 0.5 7.5.3. Free Run Referen ce Frequency Constraint s All crystals and external oscillato rs must lie within these two bands Not every crystal will work; they should be te.
Si53xx-RM Rev. 0.5 87 7.6. Digit al Hold All Any-Frequency Pr ecision Clock devices feature a hold over mode, whereby the DSPLL is locked to a digital value.
Si53xx-RM 88 Rev. 0.5 If a highly stable reference, such as an oven-contro lled crystal oscillator (OCXO) is supplied at XA/XB, an extremely stable digital hold can be achieved. If a crystal is supplied at the XA/XB port , the digit al hold stability will be limited by the stability of the crystal.
Si53xx-RM Rev. 0.5 89 7.6.2. History Settings for Lo w Bandwid th Devices (Si532 4, Si5327, Si5369, Si5374) Because of the extraordinar ily low lo op bandwidt h of the Si5324, Si5369 and Si537 4, it is recommended that the values for both history registers b e increased for longer histories.
Si53xx-RM 90 Rev. 0.5 7.7. Output Phase Adjust (Si5326, Si5368) The device has a highly accurate, digita lly controlled device s kew capability . For more informatio n on Output Phase Adjustments, se e both DSPLL sim and the respective dat a sheets. Both can be do wnloaded by going to www .
Si53xx-RM Rev. 0.5 91 Before writing a new FLA T [14:0] valu e, the FLA T_V ALID bit must be set to 0 to hold the existing FLA T [1 4:0] value while the new value is being written. Once the new value is written, set FLA T_V ALID = 1 to enable its use.
Si53xx-RM 92 Rev. 0.5 Figure 32. Frame Sync Frequencies T able 44. CKIN3/CKIN4 Frequency Selec tion (CK_CONF = 1) CKLNnRA TE [2:0] CKINn Frequency (kHz) Divisor 000 2 –4 1 001 4 –8 2 010 8–16 4 01 1 16–32 8 100 32–64 16 101 64–128 32 1 10 128–256 64 1 1 1 256–5 12 128 CKIN3 CKIN4 CLKIN3RATE Clock select DCO, 4.
Si53xx-RM Rev. 0.5 93 The NC5_LS divider uses CKOUT2 as its clock inpu t to derive FS_OUT . The limits for the NC5_LS divider are NC5_LS = [1, 2, 4, 6, …, 2 19 ] f CKOUT2 < 710 MHz Note that wh en in fram e synchronizat i on rea lign m en t m o de , w rite s t o NC5_LS are controlled by FPW_V ALID .
Si53xx-RM 94 Rev. 0.5 For cases where phase skew is required, see Section “7.7 . Outp ut Phase Adjust (Si53 26, Si5368)” fo r more det ails on controlling the sync input to sync output phase skew via the FSYNC_SKEW [16:0] bits. See Sectio n “8.2.
Si53xx-RM Rev. 0.5 95 7.9. Output Clock Driver s (Si5319, Si5324, Si5325, Si5326, Si5327 , Si5367, Si5368, Si5369, Si5374, Si5375) The device includes a flexible output driver structure th at can drive a variety of l oads, including L VPECL, L VDS, CML, and CMOS forma ts.
Si53xx-RM 96 Rev. 0.5 7.10. PLL Byp ass Mode (Si 5319, Si5324, Si5325, Si 5326, Si5327, Si5367, Si5368, Si5369, Si5374, Si5375) The device support s a PLL bypass mode in which the select ed input clock is fe d directly to t he output buffers, bypassing the DSPLL.
Si53xx-RM Rev. 0.5 97 7.1 1.1.2. Standard LOS (Si5319, Si5324, Si 5326, Si5327, Si5368, Si5369, Si5374, Si5375 ) T o facilitate automatic hitless switching, the LOS trigger time can be signi ficantly reduced by us ing the default LOS option (LOSn_EN = 1 1).
Si53xx-RM 98 Rev. 0.5 Both the FOS re ferenc e and the F OS monit ored clock m ust be divided down to the same clock rate and this clock rate must be be twe en 1 0 MH z a nd 27 MHz. As ca n b e see n in Fi gu re 33 , th e va lu es for P an d Q m ust be selec ted so that the FOS comparison occurs at the same frequen cy .
Si53xx-RM Rev. 0.5 99 7.1 1.3. C1B, C2B (Si5319, Si5324, Si 5325, Si5326, Si5327 , Si5 37 4 , Si53 75 ) A LOS condition causes the associated LOS1_INT or LOS2_INT read only register bit to b e set. A LOS condition on CKIN_1 will also be reflected onto C1B if CK1_BAD_PIN = 1.
Si53xx-RM 100 Rev. 0.5 7.1 1.6. C1B, C2B, C3B, ALRM OUT (Si5368 [CK_CONFIG_REG = 1]) The generation of ala rms on the C1B, C2B, C3B, and ALRMOUT output s is a function of the input clock configuration, and th e frequency offset alar m enable as shown in T able 53.
Si53xx-RM Rev. 0.5 101 7.1 1.9. Device Interrupts Alarms on internal real-time st atus bit s such as LOS1_I NT , FOS1_INT , etc. cause their associated interrupt f lags ( LOS1_FLG , FOS1_FLG , et c.) to be set and held. The inte rrupt flag bits can be individually maske d or unmasked with respect to the output in terrupt pin.
Si53xx-RM 102 Rev. 0.5 7.13. I 2 C Serial Microprocessor Interface When configured in I 2 C co ntrol mode (CMODE = L), the control interface to the device is a 2-wire bus for bidirectional communication . The bus consists of a bidire ctional serial data line (SDA) and a serial clock in put (SCL).
Si53xx-RM Rev. 0.5 103 7.14. Serial Microprocessor Interface (SPI) When configured in SPI control mode (CMODE = H), the co ntro l interface to the de vice is a 4-wire inter face modeled af ter commonly available micr ocontroller and serial peripheral devices.
Si53xx-RM 104 Rev. 0.5 Figure 36. SPI Write/Set Address Command Figure 37. SPI Read Command 7.14.1. Default Device Configuration For ease of manufacture and b ench testing of the device, the default register settin gs have been chosen to place the device in a fully-f unctio nal mode with an easily-obser vable output clock.
Si53xx-RM Rev. 0.5 105 8. High-S peed I/O 8.1. Input Clock Buffers Any-Frequency Precision Clock device s provide dif ferential input s for the CKINn clock input s. These inputs are internally biased to a common mode volt age and can be driven by either a single- ended or dif ferential source.
Si53xx-RM 106 Rev. 0.5 Figure 40. CML/L VDS T ermination (1.8, 2.5, 3.3 V) Figure 41. CMOS T ermination (1.8, 2.5 , 3.3 V) 40 k C C ± CKIN _ CKIN + V ICM 300 100 Si53xx CML/ LVDS Driver 4.
Si53xx-RM Rev. 0.5 107 8.2. Output Clock Drivers The output clocks can be conf igured to be compatible with L VPECL, CML, L VDS, or CMOS as shown in T able 56. Unused output s can be lef t unconnecte d. For micropro cessor-controlled devices, it is recommended to write “disable” to SFOUTn to disa ble the output buf fer and reduce power .
Si53xx-RM 108 Rev. 0.5 Figure 43. Differential Output Example Requiring Attenuation Figure 44. T ypical CMOS Output Circuit (T ie CKOUTn+ and CKOUTn– T ogether) Unused output drivers should be powe red down, per T able 57, or left floating. The pin-controlled p arts ha ve a DBL2_BY pin that can be used to disable CKOUT2.
Si53xx-RM Rev. 0.5 109 Figure 45. CKOUT Structure 8.2.3. T ypica l Clock Outp ut Scope Shot s T able 58. Output Format Measurement s 1,2 Name SFOUT Pin SFOUT Code Single Vpk–pk Diff Vpk–pk Vo c m R e s e r v e d H H ———— LV D S H M 7 . 3 5 .
Si53xx-RM 110 Rev. 0.5 8.3. T ypical Scope Shot s for SFOUT Options Figure 46. sfout_2, CMOS Figure 47. sfout_3, lowSwingL VDS.
Si53xx-RM Rev. 0.5 111 Figure 48. sfout_5, L VPECL Figure 49. sfout_6, CML.
Si53xx-RM 112 Rev. 0.5 Figure 50. sfout_7, L VDS.
Si53xx-RM Rev. 0.5 113 8.4. Cryst al/Reference Clock Interfaces (Si5 316, Si5319, Si 5323, Si5324, Si5326, Si5327, Si5366, Si5368, Si5369 , Si5374, and Si5375) All devices other than the Si5 374 and Si5375 can use an ex ternal crystal or extern al clock as a reference.
Si53xx-RM 114 Rev. 0.5 Figure 53. Differential External Reference Input Exampl e (Not for Si5374 or Si5375) Figure 54. Differential OSC Reference Input Example for Si5374 and Si5375 LVDS, LVPECL, CML, et c. 0.01 F 1.2 V 0.6 V Si53xx XA XB 10 k 100 0.
Si53xx-RM Rev. 0.5 115 8.5. Three-Level (3 L) Input Pins (No External Resistors) Figure 55. Three Level Input Pins Parameter Symbol Min Max Input V oltage Low Vill — .
Si53xx-RM 116 Rev. 0.5 8.6. Three-Level (3 L) Input Pins (With External Resistors) Figure 56. Three Level Input Pins Any resist or pack may be used. The Panasonic EXB-D10C183J is an example. PCB layout is not critical. Resistor packs are on ly needed if the leakage current of the external driver exce eds the listed current s.
Si53xx-RM Rev. 0.5 117 9. Power Supply These devices incorporate an on-chip voltage regulator to po wer the device from su pply voltages o f 1.8, 2.5, or 3.3 V . Intern al core circuitry is driven from the output of this regulator while I/O circuitry uses the ext ernal supply voltage directly .
Si53xx-RM 118 Rev. 0.5 10. Packages and Ordering Guide Refer to the respective dat a sheet for your device pa ckaging and ordering infor mation..
Si53xx-RM Rev. 0.5 119 A PPENDIX A—N ARROWBAND R EFERENCES Resonator/External Clock Selection T able 59 shows the 1 14.285 MHz third overtone crystals that have been approve d for use with the Si53xx jitter attenuating clocks. In some applications, a crystal wi th frequencies other than 1 14.
Si53xx-RM 120 Rev. 0.5 Fundamental Mode Cryst als For cost sensitive applications that do not have the most demanding jitter requir ements, all of the narrow band devices can use fundament al mode crystals that are in the lowest fr equency band ranging fr om 37 to 41 MHz (corresponding to RA TE = LL).
Si53xx-RM Rev. 0.5 121 A PPENDIX B—F REQUENCY P LANS AND J ITTER P ERFORMANC E (Si5316, Si5319, Si5323, S I 5324, Si5326, Si5327, Si5366, Si5368, Si 5369, Si5374, Si5375) Introduction To achieve the.
Si53xx-RM 122 Rev. 0.5 Figure 61 shows similar results and ties them to RMS jitter values. It also help s to illustrate one potential remedy for solutions with low f3. Note th at 38.88 MHz x 5 = 194. 4 MHz. In this case, an FPGA was used to multiply a 38.
Si53xx-RM Rev. 0.5 123 Reference vs. Output Frequency Because of internal coupling, outpu t frequencies that are an integer multiple (or close to an integer multiple) of the XA/XB reference frequency (eit her internal or external) sh ould be avoided. Figure 62 illu strates this by showing a 38.
Si53xx-RM 124 Rev. 0.5 High Reference Frequency When selecting a refer ence frequency , with all other things being equ al, the higher the refere nce frequency , the lower the output jitter .
Si53xx-RM Rev. 0.5 125 Figure 64. Jitter vs. Reference Frequency (2 of 2) All phase noise numbers ar e in fs, RMS External Referenc e Frequency: 37 41 55 61 109 12 5.
Si53xx-RM 126 Rev. 0.5 A PPENDIX C—T YPICAL P HASE N OISE P LOT S Introduction The following are some typical phase noise plot s. The cl ock inp ut source is a Rohde and Schwarz mo del SML03 RF Generator . Except as noted, the ph ase noise analysis eq uipment is the Ag ilent E50 52B.
Si53xx-RM Rev. 0.5 127 Figure 66. 155.52 MHz In; 622.08 MHz Out; Loop BW = 7 Hz, Si5324.
Si53xx-RM 128 Rev. 0.5 Figure 67. 19.44 MHz In; 156.25 MHz Out; Loop BW = 80 Hz.
Si53xx-RM Rev. 0.5 129 Figure 68. 19.44 MHz In; 156.25 MHz Out; Loop BW = 5 Hz, Si5324.
Si53xx-RM 130 Rev. 0.5 Figure 69. 27 MHz In; 148.35 MHz Out; Light T race BW = 6 Hz; Dark T race BW = 1 10 Hz, Si5324.
Si53xx-RM Rev. 0.5 131 Figure 70. 61.44 MHz In; 491.52 MHz Out; Loop BW = 7 Hz, Si5324.
Si53xx-RM 132 Rev. 0.5 Figure 71. 622.08 MHz In; 672.16 MHz Out; Loop BW = 6.9 kHz.
Si53xx-RM Rev. 0.5 133 Figure 72. 622.08 MHz In; 672.16 MHz Out; Loop BW = 100 Hz.
Si53xx-RM 134 Rev. 0.5 Figure 73. 156.25 MHz In; 155.52 MHz Out.
Si53xx-RM Rev. 0.5 135 Figure 74. 78.125 MHz In; 644.531 MHz Out T able 63. Jitter V alues for Figure 74 Jitter Bandwid th 644.531 MHz Jitter (RMS) Broadband, 1 kHz to 10 MHz 223 fs OC-48, 12 kHz to 2.
Si53xx-RM 136 Rev. 0.5 Figure 75. 78.125 MHz In; 690.569 MHz Out T able 64. Jitter V al ues for Figure 75 Jitter Bandwid th 690.569 MHz Jitter (RMS) Broadband, 1 kHz to 10 MHz 244 fs OC-48, 12 kHz to .
Si53xx-RM Rev. 0.5 137 Figure 76. 78.125 MHz In; 693.493 MHz Out T able 65. Jitter V al ues for Figure 76 Jitter Bandwid th 693.493 MHz Jitter (RMS) Broadband, 1 kHz to 10 MHz 243 fs OC-48, 12 kHz to .
Si53xx-RM 138 Rev. 0.5 Figure 77. 86.685 MHz In; 173.371 MHz and 693.493 MHz Out T able 66. Jitter V al ues for Figure 77 Jitter Bandwid th 173.371 MHz Jitter (RMS) 693.
Si53xx-RM Rev. 0.5 139 Figure 78. 86.685 MHz In; 173.371 MHz Out.
Si53xx-RM 140 Rev. 0.5 Figure 79. 86.685 MHz In; 693.493 MHz Out.
Si53xx-RM Rev. 0.5 141 Figure 80. 155.52 MHz and 156.25 MHz In; 622.08 MHz Out T able 67. Jitter V al ues for Figure 80 Jitter Bandwid th 155.52 MHz Input Jitter (RMS) 156.
Si53xx-RM 142 Rev. 0.5 Figure 81. 10 MHz In; 1 GHz Out.
Si53xx-RM Rev. 0.5 143 Digit al Video (HD-SDI) Phase noise equip ment: Agilent model JS50 0. Jitter Band Jitter Brick W all, 10 Hz to 20 MHz 2.42 ps, RMS Peak-to-pe ak 14.
Si53xx-RM 144 Rev. 0.5 A PPENDIX D—A LARM S TRUCTURE Figure 82. Si5324 and Si5326 Alarm Diagram in out Sticky Write 0 to clear LOS_IN T LOSX_FLG LOSX_MSK in out Sticky Write 0 to clear LOL_I NT LOL_.
Si53xx-RM Rev. 0.5 145 Figure 83. Si5368 Alarm Diagram (1 of 2) in out Sticky Write 0 to clear LOS_INT LOSX_FLG LOSX_MSK in out Sticky Write 0 to clear LOL_INT LOL_FLG LOL_MSK in out Sticky Write 0 to.
Si53xx-RM 146 Rev. 0.5 Figure 84. Si5368 Alarm Diagram (2 of 2) LOS Detector FOS Detector FOS3_EN LOS3_EN LOS3_IN T C3B E CK_BAD_POL LOS Detector FOS Detector FOSI_EN LOSI_EN LOS1_INT C1B E 1 0 LOS De.
Si53xx-RM Rev. 0.5 147 A PPENDIX E—I NTERNAL P ULLUP , P ULLDOWN BY P IN T ables 68–79 sh ow which 2-Level CMOS pins ha ve pullups or pulldowns. Note the valu e of the pullup/pulldo wn resistor is typically 75 k .
Si53xx-RM 148 Rev. 0.5 T able 70. Si5323 Pullup/Down Pin # Si5323 Pull? 1R S T U 2F R Q T B L U , D 9 AUTOSEL U, D 11 R AT E 0 U , D 14 DBL2_BY U, D 15 RA TE 1 U, D 19 DEC D 20 INC D 21 CS_CA U, D 22 BWSEL0 U, D 23 BWSEL1 U, D 24 FRQSEL0 U, D 25 FRQSEL1 U, D 26 FRQSEL2 U, D 27 FRQSEL3 U, D 30 SF OUT1 U, D 33 SF OUT0 U, D T able 71.
Si53xx-RM Rev. 0.5 149 T able 72. Si5325 Pullup/Down Pin # Si5325 Pull? 1R S T U 21 CS_CA U, D 22 SCL D 24 A0 D 25 A1 D 26 A2_SS D 27 SDI D 36 CMODE U, D T able 73.
Si53xx-RM 150 Rev. 0.5 T able 74. Si5327 Pullup/Down Pin # Si5327 Pull? 1R S T U 11 R AT E 0 U , D 15 RA TE 1 U, D 21 C S U, D 22 SCL D 24 A0 D 25 A1 D 26 A2_SS D 27 SDI D 36 CMODE U, D T able 75.
Si53xx-RM Rev. 0.5 151 T able 76. Si5366 Pullup/Down Pin # Si5366 Pull? 3R S T U 4F R Q T B L U , D 13 CS0_C3A D 20 FS_SW D 21 FS_ALIGN D 22 AUT OSEL U, D 32 RA TE 0 U, D 37 DBL2_BY U, D 42 RA TE 1 U,.
Si53xx-RM 152 Rev. 0.5 T able 77. Si5367 Pullup/Down Pin # Si5367 Pull? 3R S T U 13 CS0_C3A D 57 CS1_C 4A U, D 60 SCL D 68 A0 D 69 A1 D 70 A2_SSB D 71 SDI D 90 CMODE U, D T able 78.
Si53xx-RM Rev. 0.5 153 T able 79. Si5369 Pullup/Down Pin # Si5368 Pull? 3R S T U 13 CS0_C3A D 21 FS_ALIGN D 32 RA TE 0 U, D 42 RA TE 1 U, D 57 CS1_C 4A U, D 60 SCL D 68 A0 D 69 A1 D 70 A2_SSB D 71 SDI D 90 CMODE U, D T able 80 .
Si53xx-RM 154 Rev. 0.5 A PPENDIX F—T YPICAL P ERFORMANCE : B YP ASS M ODE , PSRR, C ROSST ALK , O UTPUT F ORMAT J ITTER This appendix is divided into the following four sections: Bypass Mode Per formance Power Supply Noise Rejection Crosstalk Output Format Jitter Byp ass: 622.
Si53xx-RM Rev. 0.5 155 Power Supply Noise Rejection P o we r Su ppl y N oise t o Output T ran sfe r Func t ion -1 0 5 -1 0 0 -9 5 -9 0 -8 5 -8 0 -7 5 -7 0 -6 5 -6 0 1 10 100 10 00 kHz dB 38.
Si53xx-RM 156 Rev. 0.5 Clock Input Crosstalk Result s: T est Co nditions Jitter Ban d 155. 52 MHz in, 622 MHz out, For reference, No crosstalk 155.521 M Hz in, 622.084 MHz out, No crosst alk 155.521 MHz in, 622.084 MHz out, 155.52 MHz Xt alk, 99 Hz loop Bandwidth 155.
Si53xx-RM Rev. 0.5 157 Clock Input Crosst alk: Phase Noise Plot s Dark blue — No crosst alk Light blue — With cros st a lk, low bandwid th Y ellow — With crosst alk, high bandwidt h Red — With crosst alk, in digit al hold 15 5. 5 21 M H z i n, 622 .
Si53xx-RM 158 Rev. 0.5 Clock Input Crosst alk: Det ail View Dark blue — No crosst alk Light blue — With cros st a lk, low bandwid th Y ellow — With crosst alk, high bandwidt h Red — With crosst alk, in digit al hold 155 . 521 M H z i n , 622 .
Si53xx-RM Rev. 0.5 159 Clock Input Crosst alk: Wide band Comp arison Jitter Band Jitter , w/ Xtlk Jitter , no Xtlk OC-48, 12 kHz to 20 MHz 303 fs RMS 422 fs RMS OC-192, 20 kHz to 80 MHz 316 fs RMS 366 fs RMS Broadband, 800 Hz to 80 MHz 3 40 fs RMS 1,010 fs RMS 155 .
Si53xx-RM 160 Rev. 0.5 Clock Input Crosst alk: Output of Rohde and Sc hwartz RF R ohde a nd S c hwa r z : 15 5 .5 2 1 M H z - 120 - 110 - 100 -9 0 -8 0 -7 0 -6 0 10 0 100 0 O ffs e t F r e q u e n c y.
Si53xx-RM Rev. 0.5 161 Jitter vs. Output Format: 19.44 MHz In, 622.08 MHz Out S pectrum Analyzer: Agilent Model E444OA T able 81. Out put Format vs. Jitter Bandwid th L VPECL Jitter (RMS) L VDS Jitter.
Si53xx-RM 162 Rev. 0.5 A PPENDIX G—N EAR I NTEGER R ATIOS T o provide more d etails and to provide boundarie s with respect to the “Referen ce vs. Output Frequency” issue described in Append ix B on page 121, the following stu dy was performed and is presen ted below .
Si53xx-RM Rev. 0.5 163 Figure 86. ±200 ppm, 10 ppm Step s Figure 87. ±2000 ppm, 50 ppm Step s 3 8 .8 8 M Hz Exte r na l XA -XB Re fe r e n c e 0 200 400 600 800 1000 1200 155. 49 155. 5 155. 51 155. 52 155. 53 155. 54 155. 55 I nput Fre que nc y ( M H z ) RM S j i tter , fs Input Frequency 3 8 .
Si53xx-RM 164 Rev. 0.5 A PPENDIX H—J ITTER A TTENUATION AND L OOP BW The following illustrates the effects of dif ferent loop BW values on the jitter attenuation of the Any-Frequency devices. Th e jitter cons ists of sine wave m odulation a t va rying frequencies.
Si53xx-RM Rev. 0.5 165 Figure 88. RF Generator , Si5326, Si 5324; No Jitter (For Reference) Figure 89. RF Generator , Si5326, Si5324 (50 Hz Jitter) 622. 08 M Hz i n, 622. 08 M H z out -1. 80E + 02 -1. 60E + 02 -1. 40E + 02 -1. 20E + 02 -1. 00E + 02 -8.
Si53xx-RM 166 Rev. 0.5 Figure 90. RF Generator , Si5326, Si5324 (100 Hz Jitter) Figure 91. RF Generator , Si5326, Si5324 (500 Hz Jitter) 622. 08 M Hz i n, 622. 08 M H z out -1. 80E + 02 -1. 60E + 02 -1. 40E + 02 -1. 20E + 02 -1. 00E + 02 -8. 00E + 01 -6.
Si53xx-RM Rev. 0.5 167 Figure 92. RF Generator , Si5326, Si5324 (1 kHz Jitter) Figure 93. RF Generator , Si5326, Si5324 (5 kHz Jitter) 622. 08 M Hz i n, 622. 08 M H z out -1. 80E + 02 -1. 60E + 02 -1. 40E + 02 -1. 20E + 02 -1. 00E + 02 -8. 00E + 01 -6.
Si53xx-RM 168 Rev. 0.5 Figure 94. RF Generator , Si5326, Si5324 (10 kHz Jitter) 622. 08 M Hz i n, 622. 08 M H z out -1. 80E + 02 -1. 60E + 02 -1. 40E + 02 -1. 20E + 02 -1. 00E + 02 -8. 00E + 01 -6. 00E + 01 -4. 00E + 01 -2. 00E + 01 0. 00E + 00 1. 00E + 02 1.
Si53xx-RM Rev. 0.5 169 A PPENDIX I—Si5374 AND Si5375 PCB L AYOUT R ECOMMENDATIONS The following is a set of recom mendations and guidelines fo r printed circuit boar d layout with the Si5374 and Si5374 devices.
Si53xx-RM 170 Rev. 0.5 Figure 96. Ground Plane and Reset These fou r re si s to rs force the common RE S ET conne cti on away fr om th e BGA foo t pri n.
Si53xx-RM Rev. 0.5 171 The following is a set of recom mendations and guidelines fo r printed circuit boar d layout with the Si5374 and Si5374 devices. Beca use the four DSPLLs are in close phys ical and electrica l proximity to one another , PCB layout is critical to achieving the highest levels of jitter perfo rmance.
Si53xx-RM 172 Rev. 0.5 Figure 98. OSC_P , O SC_N Rout ing OSC_P , OSC_N Av o id placi ng the OCS_ P and OSC _N sign a ls on the sa m e la yer as th e cl ock out put s . Ad d gr ounde d gua r d tra ces sur r oundi ng th e OSC_P and OSC_ N sig n a ls.
Si53xx-RM Rev. 0.5 173 A PPENDIX J—Si5374 AND Si5375 C ROSST ALK While the four DSPLLs of the Si537 4 and Si5375 are in close physical an d electrical proximity to on e another , crosstalk interfer ence between the DSPLL s is minimal.
Si53xx-RM 174 Rev. 0.5 Figure 99. Si5374, Si5375 DSPLL A.
Si53xx-RM Rev. 0.5 175 Figure 100. Si5374, Si5375 DSPLL B.
Si53xx-RM 176 Rev. 0.5 Figure 101. Si5374, Si5375 DSPLL C.
Si53xx-RM Rev. 0.5 177 Figure 102. Si5374, Si5375 DSPLL D.
Si53xx-RM 178 Rev. 0.5 D OCUMENT C HANGE L IST Revision 0.3 to Revision 0.4 Updated AC S pecifications in T able 8, “AC Characteristics—All Devices” Added Si5365, Si5366, Si53 67, and Si5368 operation at 3.3 V Updated Section “7 .8 .
Si53xx-RM Rev. 0.5 179 N OTES :.
Si53xx-RM 180 Rev. 0.5 C ONT ACT I NFORMATION Silicon La boratories Inc. 400 West Cesar Chavez Austin, TX 78701 T el: 1+(512) 416-8 500 Fax: 1+(512) 416 -9669 T oll Free: 1 +(877) 444-3032 Please visit the Silico n Labs T echnical Supp ort web page: https://www .
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