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ThinkP ad W700, W700ds, W701, and W701ds Har dwar e Maint enance Manual.
Before using this information and the pr oduct it supports, be sur e to read the gener al information under Appendix A “Notices” on page 209 . Ninth Edition (March 2013) © Copyright Lenovo 2008, 2013.
Contents About this manual . . . . . . . . . . . iii Chapter 1. Safety information . . . . . . 1 General safety . . . . . . . . . . . . . . . . 1 Electrical safety . . . . . . . . . . . . . . . 2 Safety inspection guide . . . . . . . . . . . . 3 Handling devices that ar e sensitive t o electr ostatic discharge .
1060 P alm rest or palm r est with ngerprint reader . . . . . . . . . . . . . . . . . . 75 1070 Digitizer pen case assembly . . . . . . . 78 1080 Bluetooth daughter card (BDC-2.1) for W701 and W701ds . . . . . . . . . . . . . . . 79 1090 Keyboar d .
About this manual This manual contains service and r eference information for the following ThinkPad ® pr oducts. ThinkPad W700 and W700ds MT 2752, 2753, 2754, 2757, 2758, 2762, and 2763 ThinkPad W701 and W701ds MT 2500, 2541, 2542, 2543, 2544, 4323, and 4326 Use this manual along with the advanced diagnostic tests to tr oubleshoot pr oblems.
iv ThinkPad W700, W700ds, W701, and W701ds Har dware Maint enance Manual.
Chapter 1. Safety information This chapter presents following safety information that you need t o be familiar with before you service a ThinkPad Notebook.
Electrical safety Observe the following rules when working on electrical equipment. Important: Use only appr oved t ools and test equipment. Some hand t ools have handles covered with a soft mat erial that does not insulat e you when working with live electrical currents.
• If an electrical accident occurs: – Use caution; do not become a victim yourself. – Switch off power . – Send another person to get medical aid. Safety inspection guide The purpose of this inspection guide is t o assist you in identifying potentially unsafe conditions.
1. Use product-specic ESD pr ocedures when they e xceed the requir ements noted here. 2. Make sur e that the ESD prot ective devices you use have been certied (ISO 9000) as fully effective. When handling ESD-sensitive parts: • K eep the parts in pr otective packages until they ar e insert ed into the product.
DANGER DANGER DANGER DANGER DANGER DANGER Chapter 1 . Safety information 5.
DANGER 6 ThinkPad W700, W700ds, W701, and W701ds Har dware Maintenance Manual.
PERIGO PERIGO PERIGO Chapter 1 . Safety information 7.
PERIGO PERIGO PERIGO PERIGO PERIGO 8 ThinkPad W700, W700ds, W701, and W701ds Har dware Maintenance Manual.
DANGER DANGER DANGER DANGER DANGER Chapter 1 . Safety information 9.
DANGER DANGER DANGER VORSICHT VORSICHT 10 ThinkPad W700, W700ds, W701, and W701ds Har dware Maint enance Manual.
VORSICHT VORSICHT VORSICHT VORSICHT VORSICHT VORSICHT Chapter 1 . Safety information 11.
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Chapter 1 . Safety information 13.
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Chapter 1 . Safety information 15.
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Laser compliance statement (multilingual tr anslations) The laser compliance stat ements in this section are pr ovided in the following languages: • English • Ar abic • Br azilian P ortuguese Chapter 1 .
• F r ench • German • Hebr ew • Japanese • K orean • Spanish • T r aditional Chinese 18 ThinkPad W700, W700ds, W701, and W701ds Har dware Maint enance Manual.
Chapter 1 . Safety information 19.
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Chapter 1 . Safety information 21.
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Chapter 1 . Safety information 23.
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Chapter 2. Important service information This chapter pr esents following important service information that applies t o all machine types supported by this manual: • “Str ategy for r eplacing FRU.
Attention: The setup congur ation on the computer you ar e servicing may have been cust omized. Running Automatic Congur ation may alter the settings. Not e the curr ent conguration settings (using the View Conguration option); then, when service has been completed, verify that those settings remain in effect.
• The HMM will have the 4-digit MT and 3-digit C TO model only (Example: 1829-C TO). Again, CMVs ar e custom models and are not found in the HMM. General Announce V ariant (GA V) This is a standard model (x ed conguration). GA Vs are announced and offer ed to all customers.
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Chapter 3. Gener al check out This chapter pr esents following information: • “What to do rst” on page 29 • “Checkout guide” on page 30 – “Diagnostics using PC-Doctor for Dos” on .
Before checking pr oblems with the computer , determine whether the damage is covered under the warr anty by referring to the following list: The following are not covered under warr anty: • L CD pa.
On the BIOS Setup Utility screen, pr ess F9, Enter , F10, and then Enter . Note: When you initializ e the computer congur ation, some devices ar e disabled, such as the serial port. If you test one of these devices, you will need t o enable it by using Congur ation utility for DOS.
Diagnostics Interactive T ests • Run Normal T est • Run Quick T est • CPU/Coprocessor • Systemboar d • Video Adapt er • Fixed Disks • Diskette Drives • Other Devices • ThinkPad Devic.
Lenovo ThinkV antage T oolbo x (L enovo System T oolbox) Lenovo ThinkV antage ® T oolbo x (Lenovo System T oolbo x in Windows Vista ® and Windows ® XP) is a diagnostic progr am that works through the Windows oper ating system.
T able 1. FRU tests FRU Applicable t est System boar d 1. Diagnostics ➙ CPU/Coprocessor . 2. Diagnostics ➙ Systemboar d . 3. If the docking station or the port replicat or is attached to the ThinkP ad Not ebook, detach it. 4. Place the computer on a horizontal surface, and run Diagnostics ➙ ThinkPad Devices ➙ HDD Active P rotection T est .
T able 1. FRU tests (continued) FRU Applicable t est T r ackP oint or pointing device If the T r ackP oint does not work, check the congur ation as specied in the BIOS Setup Utility . If the T r ackpoint is disabled, select Automatic to enable it.
Note: Output voltage of pin no.2 of the ac adapter may differ ent fr om the one you are servicing. 3. If the voltage is not corr ect, replace the ac adapter . 4. If the voltage is acceptable, do the following: • Replace the system boar d. • If the problem persists, go t o “FRU tests” on page 33.
Checking the backup battery Do the following: 1. P ower off the computer , and unplug the ac adapter fr om it. 2. T urn the computer upside down. 3. Remove the battery pack (see “1010 Battery pack” on page 68). 4. Remove the backup battery (see “1100 Backup battery” on page 82).
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Chapter 4. Related ser vice information This chapter pr esents following information: • “Restoring the factory cont ents by using Pr oduct Recovery discs” on page 39 • “Restoring the fact or.
The recovery disc set consists of the user instructions and the following set of DVDs t o rest ore the comput er to the original factory congur ation. Operating System Recovery Disc (one disc) This disc rest ores the Microsoft ® Windows oper ating system.
Note: Aft er restoring a drive to the factory default settings, you might need to r einstall some device drivers. P asswords As many as thr ee passwor ds may be needed for any ThinkP ad Notebook: the power -on passwor d (POP), the har d-disk passwor d (HDP), and the supervisor password (SVP).
4. T urn on the computer and wait until the POS T ends. After the POS T ends, the passwor d pr ompt does not appear . The POP has been r emoved. 5. Reinstall the backup battery and the battery pack. (B) If an SVP has been set and is known by the service technician: 1.
Screen blank mode If the time set on the “T urn off monitor” timer in the operating system e xpires, the L CD backlight turns off. T o put the computer into scr een blank mode, do as follows: 1. Pr ess Fn+F3. A panel for selecting a power plan (in Windows XP , power scheme) appears.
Note: If the comput er enters the hibernation mode while it is docked to the ThinkP ad Advanced Dock or ThinkP ad Advanced Mini Dock, do not undock it before r esuming normal operation. If you do undock it and then try to r esume normal oper ation, you will get an err or message, and you will have t o restart the syst em.
Note: F or a device not supported by diagnostic codes in the ThinkP ad Notebooks, see the manual for that device. Numeric err or codes T able 2. Numeric error codes Symptom or error FRU or action, in sequence 0175 Bad CRC1, stop POST task—The EEPROM checksum is not corr ect.
T able 2. Numeric error codes (continued) Symptom or error FRU or action, in sequence 0196 Security hardwar e removed 1. Ent er BIOS Setup Utility by entering supervisor password, and select Passwor d ➙ Security Chip ➙ Clear Security Chip to clear this error .
T able 2. Numeric error codes (continued) Symptom or error FRU or action, in sequence 0260 System timer error . 1. Char ge the backup battery for more than 8 hours by connecting the ac adapter . 2. Replace the backup battery and run BIOS Setup Utility to r eset the time and date.
T able 2. Numeric error codes (continued) Symptom or error FRU or action, in sequence 1810 Hard disk partition layout err or . 1. If the Access P redesktop Area has been previously disabled, then go to the BIOS Setup Utility by pressing F1 to open the BIOS Setup Utility .
T able 2. Numeric error codes (continued) Symptom or error FRU or action, in sequence 2110 Read err or on HDD0 (Main har d disk drive) 1. Reseat the hard disk drive. 2. Main har d disk drive. 3. Syst em boar d. 2112 Read err or on HDD1 (Ultr abay har d disk drive) 1.
Beep symptoms T able 4. Beep symptoms Symptom or error FRU or action, in sequence One beep and a blank, unreadable, or ashing L CD. 1. Reseat the L CD connector . 2. L CD assembly . 3. Ext ernal CRT . 4. Syst em boar d. One long and two short beeps, and a blank or unreadable L CD.
• This policy applies to all ThinkP ad Not ebooks pur chased on 1 January, 2008 or later . • Lenovo will not provide replacement if the L CD is within specication as we cannot guar antee that any replacement L CD will have z ero pix el defects.
i. PC C ards 4. T urn on the comput er . 5. Determine whether the problem has been solved. 6. If the pr oblem does not r ecur , r econnect the r emoved devices one at a time until you nd the failing FRU. 7. If the pr oblem remains, r eplace the following FRUs one at a time (do not replace a nondefective FRU): a.
Chapter 5. Installing and conguring RAID This chapt er presents following information about attaching SA T A devices and conguring RAID for this product. Important notices for setting RAID: Before you install and congur e RAID , make sur e of the current RAID setting on the computer you ar e servicing.
2. During the startup, when a pr ompt t o pr ess Ctrl+I t o ent er the Congur ation Utility is displayed on the screen, pr ess and hold the Ctrl k ey, and press the I key . 3. The screen for Int el Matrix Stor age Manager option ROM is displayed. Select “Cr eate RAID V olume” and press Enter .
Chapter 6. Status indicators This chapter presents the system status indicators that show the status of the comput er . 11 1 2 3 4 5 6 7 8 9 10 12 13 8 9 10 © Copyright Lenovo 2008, 2013 55.
T able 7. Status indicators Indicator Meaning 1 Wireless LAN status Green: The wir eless featur e (802.11 standar d) is on, and the r adio link is ready for use.
T able 7. Status indicators (continued) Indicator Meaning 9 AC power status Green: The computer is connected to the ac power supply . 10 Sleep (standby) status Green: The comput er is in sleep (standby) mode. Blinking green: The comput er is entering sleep (standby) mode or hibernation mode, or is resuming normal operation.
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Chapter 7. Fn key combinations The following table shows the function of each combination of Fn with a function key . T able 8. Fn key combinations Key combination Description Fn+F1 Reserved.
T able 8. Fn key combinations (continued) Key combination Description F or Windows Vista and Windows XP: Switch a display output location • External monitor (CRT display) • Computer display and e .
T able 8. Fn key combinations (continued) Key combination Description Fn+End The computer display becomes dimmer . The purpose of this method is to change the brightness level t emporarily . On Windows Vista, the default brightness level is loaded after sleep (standby), hibernation, r eboot, or detaching or attaching an ac adapt er .
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Chapter 8. FRU r eplacement notices This chapt er pr esents notices relat ed t o r emoving and replacing parts. Read this chapter carefully befor e replacing any FRU.
Retaining serial numbers This section includes the following descriptions: • “Rest oring the serial number of the system unit” on page 64 • “Retaining the UUID” on page 64 • “Reading o.
When you replace the syst em boar d, you must set the UUID on the new syst em board as follows: 1. Install the LENOVO ThinkP ad Hardwar e Maintenance Diskette V ersion 1.76 or later , and restart the computer . 2. F r om the main menu, select 4. Assign UUID .
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Chapter 9. Removing and replacing a FRU This chapter pr esents dir ections and drawings for use in r emoving and replacing a FRU . Be sure t o observe the following general rules: 1. Do not try t o service any computer unless you have been trained and certied.
a b • T o store the second scr een in its slot, press the scr een inside till it stops. T ak e your hand away and make sur e that the scr een is rmly locked in the slot. Unless you do this, the second screen might accidentally slide out. Note: Befor e st oring the second screen, place the scr een at position of 0 degree.
If ThinkV antage T oolbo x or Lenovo System T oolbo x is not installed in the comput er , the customer should download this pr ogram before a non-physically damaged batt ery pack is r eplaced. Note that a physically damaged battery pack is non-warr anty replacement.
1030 Serial Ultrabay Enhanced device Notes: Y ou can install either a Serial Ultrabay Enhanced device or a Serial Ultr abay Slim device in the Serial Ultrabay Enhanced bay .
• Do not drop the hard disk drive or apply any physical shock to it. The hard disk drive is sensitive to physical shock. Improper handling can cause damage and permanent loss of data. • Befor e removing the drive, have the user make a backup copy of all the information on it if possible.
T able 12. Removal steps of HDD cover , HDD and HDD rubber rails or SSD and st orage converter (continued) Note: Mount ed number of the har d disk drive depends on the models. In models with RAID features, two hard disk drives that have same FRU no. must be used in slot 0 ( a ) and in slot 1 ( b ).
• “1010 Battery pack” on page 68 T able 13. Removal steps of DIMM slot cover and DIMM Note: Loosen the scr ews 1 , but do not remove them. 1 2 F or ThinkP ad W700 and W700ds: 3 3 4 Chapter 9 .
T able 13. Removal steps of DIMM slot cover and DIMM (continued) Note: If only one DIMM is used on the computer you ar e servicing, the card must be installed in SL O T -0 ( a ), but not in SL OT -1 ( b ). b a When installing: Insert the notched end of the DIMM into the socket.
T able 13. Removal steps of DIMM slot cover and DIMM (continued) When installing: Insert the notched end of the DIMM into the socket. P ress the DIMM rmly, and pivot it until it snaps int o the place. Make sure that it is rmly xed in the slot and does not move easily .
T able 14. Removal steps of palm rest (continued) 2 3 3 4 5 When installing: When you attach the palm r est, do as follows: 76 ThinkPad W700, W700ds, W701, and W701ds Har dware Maint enance Manual.
T able 15. Installation of the palm rest 1. A ttach the color sensor connector 1 and the ngerprint reader connector 2 rmly to the system board. Some models have only the ngerprint r eader connect or . 2 1 2. Attach the palm r est as shown in this gure.
T able 15. Installation of the palm rest (continued) 3. P ush the front side of the palm r est 4 and the ar eas marked 5 until it clicks int o place. 4 5 5 4. Close the L CD cover and turn the computer over . Then fasten the four screws t o secur e the palm rest.
T able 16. Removal steps of digitiz er pen case assembly Step Screw (quantity) Color T or que 1 M2 × 3.5 mm, wafer-head, nylon-coated (1) Silver 0.181 Nm (1.
T able 17. Removal st eps of BDC-2.1 for W701 and W701ds 1 2 Step Screw (quantity) Color T or que 1 M2.5 × 5 mm, wafer-head, nylon-coated (1) Silver 0.
T able 18. Removal steps of keyboard (continued) Step Icon Screw (quantity) Color T or que 1 M2 × 17 mm, wafer -head, nylon-coated (1) Black 0.181 Nm (1.85 kgfcm) Lift the keyboar d a little in the direction shown by arr ow 2 , and then detach the connect or 3 .
1100 Backup battery DANGER Use only the battery specied in the parts list for your computer . Any other battery could ignite or explode. F or access, remove these FRUs in or der: • “1010 Batter.
T able 19. Removal steps of backup batt ery (continued) F or ThinkP ad W701 and W701ds: 2 1 When installing: Make sur e that the battery connect or is attached rmly .
T able 20. Removal steps of numeric keypad 1 2 Step Screw (quantity) Color T or que 1 M2 × 3.5 mm, wafer-head, nylon-coated (1) Silver 0.181 Nm (1.85 kgfcm) Slide the keypad a little in the dir ection shown by arrow 3 .
T able 20. Removal steps of numeric keypad (continued) 4 When installing: Make sur e that the keypad edges 1 are under the frame as shown in this gur e.
T able 20. Removal steps of numeric keypad (continued) 2 a Note: For ThinkP ad W701 and W701ds, make sure that the cable 3 is under the fr ame as shown in this gur e.
T able 21. Removal st eps of DIMM slot cover and DIMM under keyboard Note: L oosen the screw 1 , but do not remove it. 1 2 1 1 2 Note: If only one DIMM is used on the comput er you ar e servicing, the card must be installed in the lower slot. Chapter 9 .
T able 21. Removal steps of DIMM slot cover and DIMM under keyboard (continued) When installing: Insert the notched end of the DIMM into the socket. P ress the DIMM rmly, and pivot it until it snaps int o the place. Make sure that it is rmly xed in the slot and does not move easily .
T able 22. Removal steps of keyboard bezel for W700 and W700ds (continued) 2 4 3 4 3 When installing: Make sure that all the claws ar e attached rmly . When installing: Make sure that the connect or cable is r outed as shown in this gur e. Chapter 9 .
T able 23. Removal steps of speaker assembly for W700 and W700ds 2 1 1 1 Step Screw (quantity) Color T or que 1 M2 × 3.5 mm, small-head, nylon-coated (3) Silver 0.181 Nm (1.85 kgfcm) T able 24. Removal steps of keyboard bezel for W701 and W701ds F or ThinkP ad W701 and W701ds: 1 1 1 1 Step Screw (quantity) Color T or que 1 M2.
T able 24. Removal steps of keyboard bezel for W701 and W701ds (continued) Note: Loosen the scr ews 2 , but do not remove them. 2 2 3 Chapter 9 . Removing and replacing a FRU 91.
T able 24. Removal steps of keyboard bezel for W701 and W701ds (continued) 5 4 5 4 When installing: Make sure that all the claws ar e attached rmly . When installing: Make sure that the connect or cable is r outed as shown in this gur e. T able 25.
T able 25. Removal steps of speaker assembly for W701 and W701ds (continued) 1 M2 × 3.5 mm, small-head, nylon-coated (3) Silver 0.181 Nm (1.85 kgfcm) 1140 Wireless USB adapt er or Intel T urbo Memory.
T able 26. Removal steps of Wireless USB adapt er or Intel T urbo Memory Minicard (continued) 2 2 1 Step Screw (quantity) Color T or que 2 M2 × 3 mm, thin-head, nylon-coated (2) Silver 0.
• “1060 P alm r est or palm rest with ngerprint reader” on page 75 • “1090 Keyboar d” on page 80 • “1120 DIMM slot cover and DIMM under keyboar d for W701 and W701ds” on page 86 • “1130 Keyboard bez el and speaker assembly” on page 88 T able 27.
T able 27. Removal steps of PCI Express Mini Card for wireless LAN/WiMAX for W700 and W700ds (continued) • In models with wireless LAN car d that has two antenna connectors, plug the gray cable into the jack labeled MAIN , and the black cable int o the jack labeled AUX on the car d.
T able 28. Removal steps of PCI Express Mini Card for wireless LAN/WiMAX for ThinkPad W701 and W701ds (continued) When installing: • In models with wireless LAN car d that has two antenna connectors, plug the gray cable into the jack labeled MAIN , and the black cable int o the jack labeled AUX on the car d.
T able 29. Removal steps of Intel T urbo Memory Minicard 1 1 2 Step Screw (quantity) Color T or que 1 M2 × 3 mm, thin-head, nylon-coated (2) Silver 0.
• “1040 Hard disk drive (HDD) cover , HDD and HDD rubber r ails or solid stat e drive (SSD) and st orage converter” on page 70 • “1060 P alm r est or palm rest with ngerprint reader” on.
T able 30. Removal st eps of CPU thermal device/fan for W700 and W700ds (continued) 5 6 T able 31. Installation of the CPU thermal device/fan for W700 and W700ds When installing: • Before you attach the fan assembly t o the comput er , apply thermal gr ease, at an amount of 0.
T able 32. Removal steps of CPU thermal device/fan for W701 and W701ds F or ThinkP ad W701 and W701ds: Note: L oosen the scr ews 1 , 2 , and 3 , but do not remove them. When you attach the fan, secure the scr ews in order as shown in this gure. 1 2 3 Attention: Do not handle the fan r oughly .
T able 33. Installation of the CPU thermal device/fan for W701 and W701ds When installing: • Before you attach the fan assembly t o the comput er , apply thermal gr ease, at an amount of 0.
T able 34. Removal steps of VGA thermal device/fan (continued) 1 2 3 4 5 F or ThinkPad W700ds and W701ds: 6 7 Attention: Do not handle the fan r oughly . Improper handling of the fan can cause dist ortion or deformation and imperfect contact with components.
T able 34. Removal steps of VGA thermal device/fan (continued) 6 7 T able 35. Installation of the VGA thermal device/fan in ThinkPad W700 and W700ds When installing: • Before you attach the fan assembly t o the comput er , apply thermal gr ease, at an amount of 0.
T able 36. Installation of the VGA thermal device/fan and thermal putty in ThinkP ad W701 and W701ds When installing: • Before you attach the fan assembly to the computer , attach new thermal putty on the video card as shown as a in this gur e. a a • Apply thermal grease, at an amount of 0.
T able 37. Removal steps of CPU Rotate the head of the scr ew in the dir ection shown by arr ow 1 to r elease the lock; then remove the CPU 2 . 2 a b 1 When installing: Place the CPU on the CPU socket a , and then rotat e the head of the screw in the direction shown by arrow b to secur e the CPU .
• “1120 DIMM slot cover and DIMM under keyboar d for W701 and W701ds” on page 86 • “1130 Keyboard bez el and speaker assembly” on page 88 T able 38. Removal steps of video card 1 1 2 Step Screw (quantity) Color T or que 1 M2 × 3.5 mm, shoulder type, nylon-coated (2) Black 0.
T able 38. Removal steps of video card (continued) a 1210 HDD I/O sub car d F or access, remove these FRUs in or der: • “1010 Battery pack” on page 68 • “1040 Hard disk drive (HDD) cover , H.
T able 39. Removal steps of HDD I/O sub card for W700 and W700ds (continued) 1 M2 × 3.5 mm, small-head, nylon-coated (2) Silver 0.181 Nm (1.85 kgfcm) 2 M2.5 × 5 mm, wafer-head, nylon-coated (1) Silver 0.392 Nm (4 kgfcm) F or models with 34-mm Expr essCard/Smart Card slot: 1 1 1 2 Step Screw (quantity) Color T or que 1 M2 × 3.
T able 39. Removal steps of HDD I/O sub card for W700 and W700ds (continued) 1 1 1 1 2 Step Screw (quantity) Color T or que 1 M2 × 3.5 mm, small-head, nylon-coated (4) Silver 0.181 Nm (1.85 kgfcm) 2 M2.5 × 5 mm, wafer-head, nylon-coated (1) Silver 0.
T able 40. Removal steps of HDD I/O sub card for W701 and W701ds (continued) 1 1 3 2 Step Screw (quantity) Color T or que 1 M2 × 14 mm, small-head, nylon-coated (2) Silver 0.181 Nm (1.85 kgfcm) 2 M2 × 3.5 mm, small-head, nylon-coated (1) Silver 0.181 Nm (1.
T able 40. Removal steps of HDD I/O sub card for W701 and W701ds (continued) Step Screw (quantity) Color T or que 1 M2 × 14 mm, small-head, nylon-coated (2) Silver 0.181 Nm (1.85 kgfcm) 2 M2 × 3.5 mm, small-head, nylon-coated (1) Silver 0.181 Nm (1.
1220 L CD unit and L CD cable cap F or access, remove these FRUs in or der: • “1010 Battery pack” on page 68 • “1040 Hard disk drive (HDD) cover , HDD and HDD rubber r ails or solid stat e d.
T able 41. Removal st eps of L CD unit for W700 and W700ds (continued) 3 3 3 3 4 4 5 Step Screw (quantity) Color T or que 3 M2.5 × 9 mm, wafer-head, nylon-coated (4) Black 0.392 Nm (4 kgfcm) 4 M2 × 10 mm, wafer-head, nylon-coated (2) Black 0.181 Nm (1.
T able 41. Removal st eps of L CD unit for W700 and W700ds (continued) 7 7 When installing: 1. Rout e the ant enna cables along the cable guides and secure them with the tapes. As you r oute the cables, make sure that they are not subjected t o any tension.
T able 42. Removal st eps of L CD unit for W701 and W701ds (continued) 1 1 2 2 Step Screw cap Screw (quantity) Color T or que 1 — M2.5 × 9 mm, wafer -head, nylon-coat ed (2) Black 0.392 Nm (4 kgfcm) 2 M2.5 × 9 mm, wafer -head, nylon-coat ed (2) Black 0.
T able 42. Removal st eps of L CD unit for W701 and W701ds (continued) 5 5 5 5 6 6 7 Step Screw (quantity) Color T or que 5 M2.5 × 9 mm, wafer-head, nylon-coated (4) Black 0.392 Nm (4 kgfcm) 6 M2 × 12 mm, wafer-head, nylon-coated (2) Black 0.181 Nm (1.
T able 42. Removal st eps of L CD unit for W701 and W701ds (continued) 10 10 When installing: 1. Rout e the ant enna cables along the cable guides and secure them with the tapes. As you r oute the cables, make sure that they are not subjected t o any tension.
T able 43. Removal steps of structure frame 1 1 Step Screw (quantity) Color T or que 1 Hex stud, nylon-coat ed (4) Silver 0.392 Nm ( 4 kgfcm) 2 2 2 3 Step Screw (quantity) Color T or que 2 M2.5 × 5 mm, wafer-head, nylon-coated (3) Silver 0.392 Nm (4 kgfcm) 3 M2 × 3.
T able 43. Removal steps of structure frame (continued) 4 4a 4a 4 4 4 5 5 6 When installing: Make sur e that the connector is attached rmly, and that the cable is rout ed as in the gur e above. Note: Step 4a is only for ThinkPad W700 and W700ds.
1240 ODD switch sub car d for W700 and W700ds F or access, remove these FRUs, in or der: • “1010 Battery pack” on page 68 • “1040 Hard disk drive (HDD) cover , HDD and HDD rubber r ails or s.
1250 Audio and card reader I/O card F or access, remove these FRUs, in or der: • “1010 Battery pack” on page 68 • “1040 Hard disk drive (HDD) cover , HDD and HDD rubber r ails or solid stat .
T able 45. Removal steps of audio and card reader I/O card (continued) 2 3 4 When installing: Make sur e the connector is attached rmly . 1260 System board and base cover Note: When you r eplace following syst em boards, you also need to r eplace FRUs listed in the following table.
• If you put a syst em board down, be sur e to put it only on a padded surface such as an ESD mat or conductive corrugated material. After r eplacing the system boar d, run PC-Doctor for DOS to make sure that HDD Active Pr otection still functions. The pr ocedure is as follows: 1.
d Acceleromet er chip for the HDD Active P rot ection System™ e ICH (I/O Controller Hub) Upper side of the system board: a d b c Bottom side of the system board: e Chapter 9 .
F ollowing components soldered on the top side of the syst em board are extr emely sensitive. When you service the syst em board, avoid any kind of rough handling.
T able 46. Removal steps of system board and base cover 1 1 1 2 Step Screw (quantity) Color T or que 1 M2 × 3.5 mm, wafer-head, nylon-coated (3) Silver 0.
Note: Applying labels to the base cover The new base cover FRU is shipped with a kit containing labels of sever al kinds. When you r eplace the base cover , you need to apply the following labels: 7 Pr oduct label 6 Homologation label F ollowing labels need t o be peeled off fr om the old base cover , and need to be put on the new base cover .
F or the location of each label, r efer the following gure: F or ThinkPad W701 and W701ds: 1 2 3 6 7 5 4 2010 L CD front bez el (L CD cover kit) F or access, remove this FRU: • “1010 Battery pack” on page 68 T able 47. Removal steps of L CD front bezel 1 1 1 1 1 1 Step Screw cap Screw (quantity) Color T or que 1 M2.
T able 47. Removal steps of L CD front bezel (continued) Close the L CD cover . Detach the L CD rear cover a little as shown in step 3 of this gur e, and detach the rear edge of the L CD rear cover 4 .
T able 48. Removal steps of inverter car d for W700 and W700ds F or ThinkP ad W700 and W700ds: 1 1 3 2 Step Screw (quantity) Color T or que 1 M2 × 3.5 mm, wafer-head, nylon-coated (2) Black 0.
T able 49. Removal steps of inverter car d for W701 and W701ds F or ThinkP ad W701 and W701ds: 1 3 2 1 1 Step Screw (quantity) Color T or que 1 M2 × 3 mm, wafer -head, nylon-coated (3) Black 0.181 Nm (1.85 kgfcm) When installing: Make sure that the connectors are attached rmly .
T able 50. Removal steps of int egrated camera 1 When installing: Make sure that the connector is attached rmly . 2 2 3 Step Screw (quantity) Color T or que 1 M2 × 3.
2040 Bluetooth daughter car d (BDC-2.1) for W700 and W700ds F or access, remove these FRUs in or der: • “1010 Battery pack” on page 68 • “2010 L CD front bez el (L CD cover kit)” on page 129 T able 51. Removal steps of BDC-2.1 1 2 Step Screw (quantity) Color T or que 1 M2 × 3.
• “2040 Bluetooth daught er car d (BDC-2.1) for W700 and W700ds” on page 134 T able 52. Removal steps of L CD panel, hinges, and L CD cable Step 1 to 5 is only for ThinkPad W700 and W700ds.
T able 52. Removal steps of L CD panel, hinges, and L CD cable (continued) 5 4 4 4 4 Step Screw (quantity) Color T or que F or ThinkPad W700 and W701 4 M2.5 × 5 mm, wafer-head, nylon-coated (4) Silver 0.392 Nm (4 kgfcm) F or ThinkPad W700ds and W701ds 4 M2.
T able 52. Removal steps of L CD panel, hinges, and L CD cable (continued) 6 M2.5 × 3.5 mm, wafer -head, nylon-coated (6) Black 0.392 Nm (4 kgfcm) 8 8 8 8 8 8 9 9 Step Screw (quantity) Color T or que 8 M2 × 3 mm, wafer -head, nylon-coated (6) Black 0.
T able 52. Removal steps of L CD panel, hinges, and L CD cable (continued) 11 11 9 9 10 10 10 10 Step Screw (quantity) Color T or que 10 M2 × 3 mm, wafer-head, nylon-coated (6) Black 0.181 Nm (1.85 kgfcm) 12 13 When installing: Make sure that the L CD cable is attached rmly .
• “2010 L CD front bez el (L CD cover kit)” on page 129 • “2020 Inverter card” on page 130 • “2030 Integr ated camer a” on page 132 • “2040 Bluetooth daught er car d (BDC-2.1) for W700 and W700ds” on page 134 • “2050 L CD panel, hinges, and L CD cable” on page 134 T able 53.
T able 53. Removal st eps of second L CD bezel (second L CD cover kit) (for ThinkP ad W700ds and W701ds) (continued) 6 2070 Second L CD panel (for ThinkP ad W700ds and W701ds) F or access, remove thes.
T able 54. Removal steps of second L CD panel (for ThinkP ad W700ds and W701ds) 1 2 3 4 2080 Second L CD cable assembly (for ThinkP ad W700ds and W701ds) F or access, remove these FRUs in or der: • .
• “2010 L CD front bez el (L CD cover kit)” on page 129 • “2020 Inverter card” on page 130 • “2030 Integr ated camer a” on page 132 • “2040 Bluetooth daught er car d (BDC-2.
T able 55. Removal steps of second L CD cable assembly (for ThinkP ad W700ds) (continued) 6 6 5 Chapter 9 . Removing and replacing a FRU 143.
T able 56. Removal steps of second L CD cable assembly (for ThinkP ad W701ds) F or ThinkP ad W701ds: 1 2 144 ThinkPad W700, W700ds, W701, and W701ds Hardware Maint enance Manual.
T able 56. Removal steps of second L CD cable assembly (for ThinkP ad W701ds) (continued) 3 3 3 4 5 6 Step Screw (quantity) Color T or que 3 M2.5 × 4.5 mm, wafer -head, nylon-coated (3) Silver 0.392 Nm (4 kgfcm) 4 M2.5 × 7 mm, wafer-head, nylon-coated (1) Silver 0.
T able 56. Removal steps of second L CD cable assembly (for ThinkP ad W701ds) (continued) 8 8 7 2090 Second L CD hinges and second L CD r ear cover (second L CD cover kit) (for ThinkP ad W700ds and W7.
• “1130 Keyboard bez el and speaker assembly” on page 88 • “1140 Wir eless USB adapter or Intel T urbo Memory Minicar d” on page 93 • “1150 PCI Express Mini Car d for wireless LAN/WiMA.
T able 57. Removal steps of second L CD hinges and second L CD rear cover (second L CD cover kit) (for ThinkPad W700ds and W701ds) (continued) 2 3 4 4 3 Step Screw (quantity) Color T or que 3 M2.
T able 57. Removal steps of second L CD hinges and second L CD rear cover (second L CD cover kit) (for ThinkPad W700ds and W701ds) (continued) b b a c c 2100 Wireless LAN antenna assembly and wireless.
T able 58. Removal steps of wireless LAN ant enna assembly and UWB antenna 1 1 1 1 2 2 Step Screw (quantity) Color T or que 1 M2 × 3.5 mm, wafer-head, nylon-coated (4) Silver 0.181 Nm (1.85 kgfcm) 4 4 4 4 4 4 3 When installing: As you route the cables, make sure that they ar e not subject ed to any tension.
T able 58. Removal steps of wireless LAN antenna assembly and UWB antenna (continued) a b b • F or models with a damaged wireless USB ant enna installed, remove the damage antenna and should NOT replace it. • F or models with a non-damaged wireless USB antenna installed, leave it installed in the comput er .
152 ThinkPad W700, W700ds, W701, and W701ds Hardware Maint enance Manual.
Chapter 10. L ocations This chapter pr esents the location of ThinkP ad W700, W700ds, W701, and W701ds features and hardwar e. F ront view (for ThinkP ad W700 and W701) 1 ThinkLight 2 Integr ated camer a (for some models) 3 Status indicators Note: F or the description of each indicator , see Chapt er 6 “S tatus indicat ors” on page 55.
13 Security keyhole 14 Serial Ultrabay Enhanced latch 15 Serial Ultr abay Enhanced device eject lever 16 Serial Ultrabay Enhanced 17 Digitizer pen 18 RJ-11 (modem) connector 19 USB (Universal serial b.
F ront view (for ThinkP ad W700ds and W701ds) 1 ThinkLight 2 Integr ated camer a (for some models) 3 Status indicators Note: F or the description of each indicator , see Chapt er 6 “Status indicators” on page 55.
18 Digitizer pen 19 RJ-11 (modem) connector 20 USB (Universal serial bus) connectors 21 Digitizer pad 22 V olume control buttons 23 ThinkV antage button 21 22 23 14 15 16 17 18 19 20 Rear view 1 Status indicators Note: F or the description of each indicator , see Chapt er 6 “S tatus indicat ors” on page 55.
5 Universal serial bus (USB) 2.0 connectors (for W700 and W700ds) USB 3.0 connector (upper connector) and USB/eSA T A combo connect or (lower connect or) (for W701 and W701ds) 6 IEEE 1394 connector 7 .
1 2 3b 3a 4 5 6 7 8 9 10 158 ThinkPad W700, W700ds, W701, and W701ds Hardware Maint enance Manual.
Chapter 11. P arts list This section contains following lists of the service parts. • “Overall” on page 160 • “L CD FRUs forThinkP ad W700” on page 184 • “L CD FRUs for ThinkPad W700ds.
Overall 1 3 4 5 6 7 8 9 10 11 12 13 14 15 d 25 24 23 21 20 19 18 17 16 31 30 29 27 26 28 22 32 b c a 2 160 ThinkPad W700, W700ds, W701, and W701ds Hardware Maint enance Manual.
T able 59. P arts list—Overall No. FRU FRU no. CRU ID a - d See “” on page . 1 L CD unit (see “L CD FRUs forThinkP ad W700” on page 184, “L CD FRUs for ThinkP ad W700ds” on page 188, “L CD FRUs for ThinkP ad W701” on page 189, or “L CD FRUs for ThinkP ad W701ds” on page 193.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 8 Video card for MXM3.0 N10E-GLM • 2500-CT O , 3Ax, 3Bx, 2Ex, 3Dx, 3Fx, 3Gx, 3Hx, 5Cx, 5Dx, 3Lx, 2Cx, 3Rx, 3Sx, 3Tx, 3Ux • 2541-.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 9 2-GB DDR3-1066 SDRAM SO-DIMM (PC3-8500) car d • 2500-CT O • 2541-CT O • 2542-CT O • 2543-CT O • 2544-CT O • 4323-CT O .
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 10 System board assembly, MXM-support, non- TPM for W700 • 2752-CT O , F8x, F9x • 2753-CT O • 2754-CT O • 2757-CT O • 2758.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 10 System board assembly, MXM-support, non- TPM for W701ds • 2500-CT O , 3Ex • 2541-CT O • 2542-CT O • 2543-CT O • 2544-CT.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 14 DVD-RAM/RW drive, 12.7 mm • 2752-CT O , E7x, EPx, EQx, ERx, ESx, ETx, EVx, EWx, FBx, FCx, FDx, E4x, F3x, F6x, F7x, FGx, FHx, F .
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 14 Blu-r ay combo drive, 12.7 mm • 2500-CT O , 22x, 3Dx, 3Ex, 3Fx, 2Ax, 2Bx, 3Vx, 3Xx, 3Yx, 3Zx, 42x, 43x, 44x, 45x, 46x, 47x, 48x.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID Note: When you r eplace the HDD or HDDs used in the models with RAID mode, be sure to install HDDs that have same FRU No.s both in HDD slot 0 and in slot 1. 20 SA T A hard disk drive, 250 GB, 9.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID Note: When you r eplace the HDD or HDDs used in the models with RAID mode, be sure to install HDDs that have same FRU No.s both in HDD slot 0 and in slot 1. 20 SA T A hard disk drive, 320 GB, 9.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID Note: When you r eplace the HDD or HDDs used in the models with RAID mode, be sure to install HDDs that have same FRU No.s both in HDD slot 0 and in slot 1. 20 SA T A hard disk drive, 500 GB, 9.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID Note: When you r eplace the HDD or HDDs used in the models with RAID mode, be sure to install HDDs that have same FRU No.s both in HDD slot 0 and in slot 1. 20 SA T A hard disk drive, 160 GB, 9.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID Note: When you r eplace the HDD or HDDs used in the models with RAID mode, be sure to install HDDs that have same FRU No.s both in HDD slot 0 and in slot 1. 20 SA T A har d disk drive, 250 GB, 9.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID Note: When you r eplace the HDD or HDDs used in the models with RAID mode, be sure to install HDDs that have same FRU No.s both in HDD slot 0 and in slot 1. 20 SA T A hard disk drive, 320 GB, 9.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID Note: When you r eplace the HDD or HDDs used in the models with RAID mode, be sure to install HDDs that have same FRU no.s both in HDD slot 0 and in slot 1. 20 SA T A hard disk drive, 500 GB, 9.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID — SA T A solid state drive, 80 GB, 9 mm • 2752-CT O , MTx • 2753-CT O • 2754-CT O • 2757-CT O • 2758-CT O , Mpx • 2762.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID — SA T A solid state drive, 128 GB, 9 mm, F ull Disk Encryption (FDE) • 2752-CT O • 2753-CT O • 2754-CT O • 2757-CT O • .
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 22 Intel T urbo Memory Minicar d, 4GB (half size) • 2752-CT O , ESx, ETx, EUx, EVx, EWx, F4x, F7x, FLx, N3x, N4x • 2753-CT O •.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 23 CPU assembly, Intel Core 2 Duo mobile processor T 9600 (2.8 GHz), E-0 • 2752-CT O • 2753-CT O • 2754-CT O • 2757-CT O • 2758-CT O • 2762-CT O • 2763-CT O 42W8290 N 23 CPU assembly, Intel Core 2 Duo mobile processor T 9800 (2.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 23 CPU assembly, Int el Cor e 2 Extreme mobile processor X 9100 (3.06 GHz), E-0 • 2752-CT O • 2753-CT O • 2754-CT O • 2757-CT O • 2758-CT O • 2762-CT O • 2763-CT O 42W8291 N 23 CPU assembly, Int el Core 2 Extreme mobile processor QX 9300 (2.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 24 Intel T urbo Memory Minicar d, 4GB (half size) • 2752-CT O • 2753-CT O • 2754-CT O • 2757-CT O • 2758-CT O • 2762-CT .
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 25 Intel Centrino Ultimate-N 6300 • 2500-CT O , 24x, 2Xx, 3Ax, 3Bx, 3Cx, 2Ex, 2Gx, 2Lx, 2Mx, 3Gx, 3Hx, 3Jx, 3Kx, 5Cx, 5Dx, 5Ex, 5F.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 28 34-mm Expr essCard/Smart Card slot for W701 and W701ds • 2500-CT O , 3Bx, 2Gx, 5Gx, 5Hx • 2541-CT O , 4Hx, 4Kx, 2Qx, 2Tx, 4Lx.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID 30 P alm r est assembly with ngerprint reader , color sensor , and digitizer for W700 and W700ds • 2752-CT O , E7x, ERx, ESx, E.
T able 59. P arts list—Overall (continued) No. FRU FRU no. CRU ID — T elephone cable, RoHS 91P6967 * — Thermal gr ease 91P8835 N — ThinkP ad W700 Mini Dock 2.0 60Y4105 * — AC adapt er (see “ A C adapt ers” on page 197 .) L CD FRUs forThinkP ad W700 In ThinkP ad W700, there are following types of L CDs.
3 4 5 6 8 10 4 1 7 9 2 T able 60. P arts list—17.0-in. WX GA+ TFT No. FRU FRU no. CRU ID 1 L CD cover kit W700 43Y9790 N 2 L CD bez el 45N6048 N Chapter 11 .
T able 60. Parts list—17.0-in. WXGA+ TFT (continued) No. FRU FRU no. CRU ID 3 L CD panel, 17.0-in. WXGA+ • 2752-CT O , F6x, F7x, MCx, FLx • 2753-CT O • 2754-CT O • 2757-CT O , FPx • 2758-CT O , L Yx, MWx • 2762-CT O • 2763-CT O 42T0540 N 3 L CD panel, 17.
T able 61. Parts list—17.0-in. WUXGA TFT (continued) No. FRU FRU no. CRU ID 6 Integr ated camer a • 2752-CT O , EQx, ERx, ESx, ETx, EVx, E4x, F5x, F8x, F9x, F Ax, FGx, FHx, F Jx, FKx, MDx, MEx, MF.
L CD FRUs for ThinkP ad W700ds 3 4 8 7 6 2 1 14 13 11 12 10 9 15 5 188 ThinkPad W700, W700ds, W701, and W701ds Hardware Maint enance Manual.
T able 62. P arts list—17.0-in. WUXGA TFT and 10.6-in. WXGA TFT second screen No. FRU FRU no. CRU ID 1 L CD cover kit for W700ds 45N3888 N 2 L CD fr ont bez el 45N6048 N 3 L CD panel, 17.
3 4 5 6 9 1 0 4 1 8 7 2 T able 63. P arts list—17.0-in. WX GA+ TFT No. FRU FRU no. CRU ID 1 L CD cover kit for W701 60Y4915 N 2 L CD bez el 60Y4917 N 190 ThinkPad W700, W700ds, W701, and W701ds Hard.
T able 63. Parts list—17.0-in. WXGA+ TFT (continued) No. FRU FRU no. CRU ID 3 L CD panel, 17.0-in. WXGA+ • 2500-CT O , 3Ax, 3Gx, 5Cx • 2541-CT O , 2Qx, 5Jx, 58x • 2542-CT O , 58x • 2543-CT O • 2544-CT O • 4323-CT O • 4326-CT O 42T0785 N 3 L CD panel, 17.
T able 64. Parts list—17.0-in. WUXGA TFT (continued) No. FRU FRU no. CRU ID 6 Integr ated camer a • 2500-CT O , 22x, 3Bx, 2Ex, 2Gx, 2Lx, 2Mx, 3Dx, 3Fx, 3Hx, 5Dx, 3Lx, 3Mx, 5Gx, 2Ax, 3Rx, 3Sx, 3Tx,.
L CD FRUs for ThinkP ad W701ds 3 4 9 8 6 2 1 14 12 13 11 10 15 5 7 Chapter 11 . Parts list 193.
T able 65. P arts list—17.0-in. WUXGA TFT and 10.6-in. WXGA TFT second screen No. FRU FRU no. CRU ID 1 L CD cover kit for W701ds 60Y4916 N 2 L CD fr ont be zel for W701ds 60Y4917 N 3 L CD panel, 17.
T able 66. P arts list—K eyboard (continued) Language P/N CRU ID Danish 42T3215 42T3279 42T3149 Dutch 42T3223 42T3287 42T3157 Finnish, Swedish 42T3230 42T3294 42T3164 F rench 42T3217 42T3281 42T3151 German 42T3218 42T3282 42T3152 Greek (U .
T able 67. Parts list—Miscellaneous parts (continued) FRU P/N CRU ID • M2.5 × 7 mm (black), wafer head (8) • M2.5 × 9 mm (black), wafer head (20) • M3 × 3 mm (black), wafer head (5) • Hex.
T able 67. Parts list—Miscellaneous parts (continued) FRU P/N CRU ID • Battery latch knob • Battery latch spring • Wireless LAN knob sheet System miscellaneous parts for W700 and W700ds: • (.
T able 69. Parts list—3-pin ac adapters FRU P/N CRU ID 3-pin (170 W , 20 V) adapter (models C T O, xxA, xxB, xxC, xxG, xxH, xxK, xxM, xxT , xxV) 42T5285 3-pin (170 W , 20 V) adapter (models C T O, x.
T able 71. P arts list—3-pin power cords (1.0 m) (continued) Region P/N CRU ID Switzerland • models -CT O , xxG 42T5044 42T5129 T aiwan • models -CT O , xxV 42T5071 42T5156 U.K., China (Hong K ong S.A.R.) • models -CT O , xxB, xxG, xxH 42T5035 42T5120 T able 72.
Recovery discs Windows XP P rofessional (32 bit) DVDs Windows XP P rofessional (32 bit) DVDs ar e available as the operating syst em in the following models, however , Windows XP P rofessional is not .
T able 73. P arts list—Windows XP Professional (32 bit) recovery DVDs (continued) Language P/N CRU ID T urkish 58Y0110 Windows XP P rofessional (64 bit) DVDs Windows XP P rofessional (64 bit) DVDs a.
T able 75. P arts list—Windows Vista Business (32 bit) DVDs (continued) Language P/N CRU ID German 58Y0022 Greek 58Y0021 Hebrew 58Y0023 Hungarian 58Y0025 Italian 58Y0026 Japanese 58Y0921 Kor ean 58Y.
T able 76. P arts list—Windows Vista Business (64 bit) DVDs Language P/N CRU ID Czech 58Y0044 Danish 58Y0045 English 58Y0066 English (modem-disabled) 58Y0065 English, Finnish, and Swedish (in Sweden.
Windows Vista Ultimat e (64 bit) DVDs Windows Vista Ultimat e (64 bit) is pr einstalled as the oper ating system in the following models: • 2752-C T O, 3Cx, 63x, 64x, ESx, ETx, EVx • 2753-C T O, 6Xx, MHx • 2754-C T O • 2757-C T O • 2758-C T O, 5Ex, 5Hx, 5Jx, M5x • 2762-C T O • 2763-C T O T able 78.
T able 79. Parts list—Windows 7 Pr ofessional (64 bit) recovery DVDs Language P/N CRU ID Brazilian P ortuguese 58Y3753 Czech 58Y3756 Danish 58Y3757 Dutch 58Y3768 English 58Y3781 English (for India) .
• 2544-C T O • 4323-C T O, 33x, 34x, 35x, 36x, 37x, 38x, 39x • 4326-C T O, 4Dx, 4Ex, 4Fx, 4Gx T able 80. Parts list—Windows 7 Pr ofessional (64 bit) recovery DVDs Language P/N CRU ID Brazilian.
Common service tools T able 81. P arts list—Common service tools T ool P/N Screwdriver kit 95F3598 1/4" drive spinner handle 1650840 1/4" Sq. t o 1/4" he x t orx adapt er 93F2838 TR7- TR-10 tamper resistant t orx bits 00P6967 Removal tool antenna RF connector 08K7159 USB 2.
208 ThinkPad W700, W700ds, W701, and W701ds Hardware Maint enance Manual.
Appendix A. Notices Lenovo may not offer the pr oducts, services, or features discussed in this document in all countries. Consult your local Lenovo repr esentative for information on the pr oducts and services curr ently available in your area.
T r ademarks The following terms are tr ademarks of L enovo in the Unit ed Stat es, other countries or both: Active Pr otection System Lenovo Rescue and Recovery ThinkLight ThinkP ad ThinkV antage T r.
.
Part Number: 43Y9442_08 Printed in (1P) P/N: 43Y9442_08 *1P43Y9442_08*.
Ein wichtiger Punkt beim Kauf des Geräts Lenovo 2758MXU (oder sogar vor seinem Kauf) ist das durchlesen seiner Bedienungsanleitung. Dies sollten wir wegen ein paar einfacher Gründe machen:
Wenn Sie Lenovo 2758MXU noch nicht gekauft haben, ist jetzt ein guter Moment, um sich mit den grundliegenden Daten des Produkts bekannt zu machen. Schauen Sie zuerst die ersten Seiten der Anleitung durch, die Sie oben finden. Dort finden Sie die wichtigsten technischen Daten für Lenovo 2758MXU - auf diese Weise prüfen Sie, ob das Gerät Ihren Wünschen entspricht. Wenn Sie tiefer in die Benutzeranleitung von Lenovo 2758MXU reinschauen, lernen Sie alle zugänglichen Produktfunktionen kennen, sowie erhalten Informationen über die Nutzung. Die Informationen, die Sie über Lenovo 2758MXU erhalten, werden Ihnen bestimmt bei der Kaufentscheidung helfen.
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Jedoch ist die eine der wichtigsten Rollen, die eine Bedienungsanleitung für den Nutzer spielt, die Hilfe bei der Lösung von Problemen mit Lenovo 2758MXU. Sie finden dort fast immer Troubleshooting, also die am häufigsten auftauchenden Störungen und Mängel bei Lenovo 2758MXU gemeinsam mit Hinweisen bezüglich der Arten ihrer Lösung. Sogar wenn es Ihnen nicht gelingen sollte das Problem alleine zu bewältigen, die Anleitung zeigt Ihnen die weitere Vorgehensweise – den Kontakt zur Kundenberatung oder dem naheliegenden Service.
