Benutzeranleitung / Produktwartung MZ-R50 des Produzenten Sony
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MICROFILM MZ-R50 SERVICE MANUAL POR T ABLE MINIDISC RECORDER SPECIFICA TIONS US Model Canadian Model AEP Model UK Model E Model A ustralian Model T our ist Model Model Name Using Similar Machanism NEW MD Machanism T ype MT -MZR-50-143 Optical Pick-up T ype KMS-280A US and foreign parts licensed Dolby Laboratories Licensing Corporation.
– 2 – Specifications ........................................................................... 1 1. SER VICING NO TE ....................................................... 3 2. GENERAL Location and Function of Controls .........................
– 3 – SECTION 1 SER VICING NO TE When repairing this device with the po wer on, if you remov e the main board or open the upper panel assembly , this de vice stops working.
– 4 – SECTION 2 GENERAL This section is e xtracted from instruction manual..
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– 20 – SECTION 3 DISASSEMBL Y Note : Follow the disassembly procedure in the numerical order given. 3-1. UPPER P ANEL ASSY , BO TT OM P ANEL ASSY REMO V AL r T he equipment can be removed using the follo wing procedure.
– 21 – 3-3. MECHANISM DECK (MT -MZR50-143) REMO V AL 3-2. MAIN BO ARD REMO V AL 8 7 LCD flexible board (Main board CN803) 1 Screws (M1.4 toothed lock) 5 Flat cable (24 core) (Main board CN801) 3 O.
– 22 – 3-4. OPTICAL PICK-UP ASSY , REC BO ARD REMO V AL 3-5. CL V BO ARD REMO V AL 3 6 Optical pick-up assy 2 Screws (M1.4x3.0 locking) 5 Screw REC board 1 OP flexible board 4 MD flexible board 3 2 Remove solder CLV board 1 Screws (M1.
– 23 – 3-6. BA TTER Y CASE ASSY REMO V AL 3-7. PO WER BO ARD , SWITCH BO ARD REMO V AL 3 3 4 1 Battery case assy Chassis (Main) ass y 2 Screws (M1.4 precision pan) 5 4 4 3 Remove solder 2 Remove solder Power board Switch board Battery case assy 1 Screws (M1.
– 24 – 3-8. SWITCH UNIT (WITH JOG DIAL) REMO V AL 3 5 2 Switch unit (with JOG dial) Ornamental belt assy 4 Screws (1.7) 1 Screw (Precision) Chassis (Main) assy Holder (dial).
– 25 – SECTION 4 TEST MODE [Operations When T est Mode is Set] When the test mode is set, the LCD will display as follows. • The LCD performs the following repeatedly . R OM version displayed / all lit / all of f • The display can be held and checked by pressing P key .
– 26 – [Serv o Mode] • Set the test mode, press the + key , and set the servo mode using the V OLUME + and – keys. • When the servo mode is set, the optical pickup will move to the outer circumference or inner circumference if the + key or = key is pressed.
– 27 – • Adjusting Method Note : There is basically no display for individual adjustment items. Only such upper position titles as SER V O, A UDIO, etc.
– 28 – [A udio Mode] • Set the test mode, press the + ke y , and set the audio mode using the V OLUME + and – keys. • T o set other modes, refer to “Structure of T est Mode”.
– 29 – [Mecha Mode] • Set the test mode, press the + key , and set the mecha mode using the V OLUME + and – keys. • T o set other modes, refer to “Structure of T est Mode”.
– 30 – * Display during MO automatic adjustment 4. If the automatic adjustment results are OK, the following will be displayed. 5. If the automatic adjustment results are NG, the following will be displayed. * When the mode number is 039, 057 and the focus bias value is NG, the following will be displayed No.
– 31 – 5-4. DD 2.8V Adjustment Connection : Adjusting Method : 1. Connect the digital voltmeter to test point TP8507 (+2.8V) and TP8505 (AGND) on power board. 2. Adjust the R V801 for 2.8V reading on the digital voltmeter . Connection point and adjustment location : POWER board SECTION 5 ADJUSTMENTS 5-1.
– 32 – 5-5. Laser P ower Chec k Connection : Adjusting Method : 1. Set the servo mode of the test mode (Mode : 000). 2. Press the ” ke y , and set the laser power adjustment mode (Mode : 020) using the volume + and – keys. 3. Press the = key and move the optical pickup to the inner most circumference.
– 33 – 5-7. Low Reflection CD T raverse Adjustment Connection : Adjusting Method : 1. Set the servo mode of the test mode (Mode : 000). 2. Press the ” ke y , and set the low reflection CD playback adjust- ment mode (Mode : 040) using the volume + and – keys.
– 34 – Adjustment Location : CN501 IC501 C504 C510 IC503 AP5500 (RF) AP574 (LDIO) AP5430 (RF) AP5117 (VCC) AP5500 (RF) AP574 (LDIO) AP5430 (RF) AP51 17 (VCC) SP543 TP5980 (TE) TP5980 (TE) [MAIN BO.
– 35 – Pin No. Pin name I/O Description 1 MNT 0 O T raverse count signal output. 2 MNT 1 O T rack jump detect output. 3 MNT 2 – Not used (Open). 4 MNT 3 – Not used (Open). 5 SWDT I Inputs write data signal from system controller (IC801). 6 SCLK I Inputs serial clock signal from system controller (IC801).
– 36 – Pin No. Pin name I/O Description 56 A V SS – Ground terminal. 57 PDO – Not used (Open). 58 PCO O Decoder PLL master clock PLL phase comparison output. 59 FILI I Decoder PLL master clock PLL filter input. 60 FILO O Decoder PLL master clock PLL filter output.
– 37 – Pin No. Pin name I/O Description 1 CLCS O Chip select output to real time clock (IC804). 2 XRST O Reset output. L : Reset 3 WRPWR O Laser power switching signal output. 4 TX O Write data transfer timing output. 5 SENSE I Internal status (SENSE) input.
– 38 – Pin No. Pin name I/O Description 51 A VREF I A/D converter reference voltage input. 52 A V DD – A/D converter power supply terminal. 53 AM3 MNT I AC adaptor or EXT battery detection input. L : EXT battery 54 TEMP I T emp meter (IC803) input.
– 39 – – 40 – – 42 – – 41 – – 43 – 6-2. BLOCK DIA GRAM • Signal path. E : PB a : REC N : MIC 6-3. CIRCUIT BO ARDS LOCA TION MZ-R50 REC board CLV board MAIN board POWER board SWIT.
– 49 – – 50 – – 52 – – 51 – MZ-R50 6-5. SCHEMA TIC DIA GRAM – MAIN (1/3) SECTION – r Refer to page 61 f or IC Block Diagram. Note: • All capacitors are in µ F unless otherwise noted. pF: µµ F 50 WV or less are not indicated except for electrolytics and tantalums.
– 55 – – 56 – – 53 – – 54 – MZ-R50 r Refer to page 62 f or IC Block Diagrams. 6-6. SCHEMA TIC DIA GRAM – MAIN (2/3) SECTION – Note: • All capacitors are in µ F unless otherwise noted. pF: µµ F 50 WV or less are not indicated except for electrolytics and tantalums.
– 57 – – 58 – – 60 – – 59 – MZ-R50 Note: • All capacitors are in µ F unless otherwise noted. pF: µµ F 50 WV or less are not indicated except for electrolytics and tantalums. • All resistors are in Ω and 1 / 4 W or less unless otherwise specified.
– 6 1 – MZ-R50 r IC BLOCK DI A GRAMS – MAIN (1/3) SECTION – IC501 CXA2523AR-T4 48 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 27 24 23 22 21 20 18 17 16 15 14 13 11 12 10 9 8 7 6 5 4.
– – 62 – IC804 DS1302Z IC806 MB3800PNF IC506 MPC18A20VM r IC BLOCK DI A GRAMS – MAIN (2/3) SECTION – 21 22 23 24 25 26 27 28 29 30 16 17 18 19 20 2 3 5 4 6 7 8 9 10 1 11 12 13 14 15 CONTROL .
– – 6 3 – IC802 RS5RJ29261 IC807 AK93C45 A V -L 2 3 5 4 6 7 8 1 OSC VSS CE VD IN VD OUT EXT V OUT VDD LX VLX LIMITER SOFT S T A R T VREF 1 VREF 2 VFM ± + ± + ± + DO 3 DI 2 SK 1 CS 5 GND 6 NC .
– – 6 4 – IC303 AK4515-VQ r IC BLOCK DI A GRAM – MAIN (3/3) SECTION – 21 22 24 25 26 27 2 3 5 4 6 7 8 9 10 1 13 14 15 16 17 18 19 20 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 ADC.
– 65 – SECTION 7 EXPLODED VIEWS NOTE : • -XX, -X mean standardized parts, so they may hav e some difference from the original one. • Color indication of Appearance Parts Example : KNOB, BALANC.
– 66 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 51 X-4949-116-1 CASE ASSY , BATTER Y 52 1-782-709-11 WIRE (FLA T TYPE) (22 CORE) 53 A-3293-759-A SWITCH BOARD, COMPLETE 54 3-335-797-91 SCREW (M1.
– 67 – 101 1-667-210-11 MD FLEXIBLE BOARD 102 4-963-883-01 SCREW (M1.4), PRECISION PAN 103 A-3293-756-A CL V BOARD, COMPLETE 104 1-667-690-11 CL V FLEXIBLE BOARD 105 3-338-645-31 WASHER (0.
– 68 – NOTE : • Due to standardization, replacements in the parts list may be dif ferent from the parts specified in the diagrams or the components used on the set. • -XX, -X mean standardized parts, so they may have some dif ference from the original one.
– 69 – C220 1-107-823-11 CERAMIC CHIP 0.47uF 10% 16V C221 1-109-982-11 CERAMIC CHIP 1uF 10% 10V C222 1-162-957-11 CERAMIC CHIP 220PF 5% 50V C223 1-117-919-11 T ANT AL. CHIP 10uF 20% 6.3V C224 1-165-128-11 CERAMIC CHIP 0.22uF 16V C225 1-162-964-11 CERAMIC CHIP 0.
– 70 – C829 1-109-982-11 CERAMIC CHIP 1uF 10% 10V C830 1-110-569-11 T ANT AL. CHIP 47uF 20% 6.3V C831 1-104-852-11 T ANT AL. CHIP 22uF 20% 10V C833 1-164-156-11 CERAMIC CHIP 0.1uF 25V C834 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C835 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C836 1-162-964-11 CERAMIC CHIP 0.
– 71 – Q810 8-729-905-35 TRANSISTOR 2SC4081-R Q811 8-729-927-62 TRANSISTOR UMX1 Q901 8-729-042-81 TRANSISTOR FZT788BTC Q902 8-729-026-53 TRANSISTOR 2SA1576A-T106-QR Q903 8-729-029-14 TRANSISTOR DTC144EUA-T106 Q904 8-729-042-81 TRANSISTOR FZT788BTC Q910 8-729-905-35 TRANSISTOR 2SC4081-R < RESISTOR > R101 1-218-867-11 RES,CHIP 6.
– 72 – R802 1-216-851-11 MET AL CHIP 330K 5% 1/16W R803 1-216-857-11 MET AL CHIP 1M 5% 1/16W R816 1-216-851-11 MET AL CHIP 330K 5% 1/16W R817 1-216-851-11 MET AL CHIP 330K 5% 1/16W R818 1-216-857-11 MET AL CHIP 1M 5% 1/16W R820 1-218-887-11 RES,CHIP 47K 0.
– 73 – L804 1-414-410-21 INDUCTOR 10uH L805 1-414-410-21 INDUCTOR 10uH < TRANSISTOR > Q803 8-729-807-52 TRANSISTOR 2SD1623-T Q804 8-729-822-62 TRANSISTOR 2SB1302-T Q805 8-729-905-35 TRANSISTOR 2SC4081-R Q888 8-729-029-14 TRANSISTOR DTC144EUA-T106 < RESISTOR > R801 1-216-789-11 MET AL CHIP 2.
– 74 – MZ-R50 9-923-258-11 Son y Corporation P ersonal A&V Products Compan y 97L0290-1 Printed in Japan © 1997.12 Published b y Quality Engineering Dept.
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