Benutzeranleitung / Produktwartung MX-E500 des Produzenten Sony
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MZ-E500 AEP Model UK Model A ustr alian Model E Model SERVICE MANUAL POR T ABLE MINIDISC PLA YER SPECIFICA TIONS Model Name Using Similar Mechanism NEW MD Mechanism T ype MT -MZE500-174 Optical Pick-u.
— 2 — 1. SER VICING NO TE ···················································· 3 2. GENERAL ·································································· 4 3.
— 3 — * Replacement of CXD2671-203GA (IC601) used in this set requires a special tool. When repairing this device with the po wer on, if you remov e the main board, this device stops w orking. In this case, you work without the de vice stopping by f astening the hook of the Open/Close detection switch (S809).
— 4 — SECTION 2 GENERAL LOCA TION AND FUNCTION OF CONTROLS This section is extr acted from instruction manual. . x VOL +/– x X 1 N > . N > VOL+ VOL– 2 .
— 5 — r Disassemble the unit in the order as sho wn below . Note : Follo w the disassembly procedure in the numerical order gi ven. 3-1. “P ANEL BLOCK ASSY , UPPER”,“HOLDER ASSY” 3-2.
— 6 — 3-3. BRA CKET ASSY 3-4. MAIN BO ARD Brack et assy 1 Screws (1.7) Projections 2 5 Case (rear) 2 Lid, battery case Main board 6 Remov e the soldrin g Case (battery) 6 Remov e the soldering 3 Screws (1.
— 7 — 3-5. OPTICAL PICK-UP BLOCK Optical pick-up b lock (LCX-4E) 3 Screw (M 1.4) 5 4 Spring, thrust deten t 2 Gear (SA) 1 W asher.
— 8 — Remote control LCD • Press and hold do wn X to hold the current display while the ke y is being pressed. 4-2-3. How to release the TEST MODE When method 1 was used: T urn of f the power and open the solder bridge on T AP601 on the main board.
— 9 — 2. During each test, press and hold do wn > N ke y or . key for a while to mo ve the optical pickup on the sled outer or inner perimeter . 3. Each test item is assigned with a three-digit item number . T he 100th place is a major item, 10th place is a middle item, and unit place is a minor item.
— 10 — 4-6-2. Self-diagnostic mode 1. Set the TEST MODE. 2. W ith all the LCD display segments blinking on the set, press DISPLA Y key and the Self-diagnostic mode is entered. 3. Hereinafter , each time > N key is pr essed, the reference information display changes as follo ws: • Press .
— 11 — 4-8. KEY CHECK MODE 4-8-1. Outline of the function This mode is used to check to make sure that each of the ke ys (including the slide switch) on the set operates normally .(The 1 kHz signal is outputted from the L and R channels of head phones) 4-8-2.
— 12 — 5-4. MANU AL PO WER ADJUSTMENTS 5-4-1. Adjustment sequence The adjustments should be alwa ys perf ormed in the follo wing sequence: 1 Vc PWM Duty (L) adjustment (item No.:762) r 2 Vc PWM Duty (H) adjustment (item No.:763) r 3 VLL PWM Duty adjustment (item No.
— 13 — 3. Press X key to write the adjustment v alue. The adjustment completion display appears as follows. LCD display 5-4-5.Electrical offset adjustment method Note: Doing adjustment by the state that a disc does not enter . 1. Confirm the power v oltage is 1.
— 14 — 3. If NG in the overall CD adjustments, return to Reset NV and perform from the electrical of fset adjustment again. LCD display XXX: NG item No. 4. If OK through the overall CD adjustments, then perform ov erall MO adjustments. LCD display 5.
— 15 — Contents Trac king servo ON ABCD gain adjustment KF gain adjustment RF gain adjustment FCS gain adjustment TRK gain adjustment READ GR V adjustment 1 R GR V setting • servo OFF SLED mov e.
— 16 — r W A VEFORMS 1 IC501 1 TE 2 3 IC501 ed (RF) IC501 rs (FE) Approx. 12 mVp-p Approx. 1.2 Vp- p Approx. 10 mVp-p Note on Schematic Dia gram: MAIN SECTION • All capacitors are in µ F unless otherwise noted. pF: µµ F 50 WV or less are not indicated except f or electrolytics and tantalums.
MZ-E500 — 17 — — 18 — 6-1. BLOCK DIA GRAM SI0 SCK0 S00 XCS NV 217 12 160 161 9 3 194 195 221 XRF RST PDS1 XCS NV SI0 SCK0 S00 XTEST PD S0 S MON SSB CLK SSB DATA VREF MON OFTRK MUTE XHP STB BEE.
MZ-E500 — 19 — — 20 — 6-2. PRINTED WIRING BO ARDS – MAIN SECTION (1/2) – MAIN BOARD (SIDE A) 1-680-649 11 (11) AVLS HOLD VOL – VOL + PLAY MODE (OPERATE) 2 3 4 5 6 78 9 A 1 B C D E F IC601 L902 L901 • Refer to page 16 f or Note on Printed Wiring Board.
MZ-E500 — 21 — — 22 — 6-3. PRINTED WIRING BO ARDS – MAIN SECTION (2/2) – MAIN BOARD (SIDE B) 1-680-649 11 (11) 1 4 5 8 11 4 15 28 29 42 43 56 1 1 18 14 15 28 29 42 43 56 20 1 6 71 2 13 18 .
MZ-E500 — 23 — — 24 — 6-4. SCHEMA TIC DIA GRAM – MAIN SECTION (1/3) – • Ref er to page 16 for Note on Schematic Diagr ams. • Ref er to page 16 for W av ef or ms. • Refer to page 31 f or IC Pin Function. * Replacement of IC601 used in this set requires a special tool.
MZ-E500 — 25 — — 26 — 6-5. SCHEMA TIC DIA GRAM – MAIN SECTION (2/3) – • Ref er to page 16 Note on Schematic Diagrams . • Ref er to page 29 for IC Bloc k Diagrams.
MZ-E500 — 27 — — 28 — 6-6. SCHEMA TIC DIA GRAM – MAIN SECTION (3/3) – 2SD2216J-QR UDZ-TE-17-2.4B UDZ-TE-17-2.4B ( ) • Refer to page 16 f or Note on Schematic Diagrams .
— 29 — 6-7. IC BLOCK DIA GRAMS IC301 T A2131FL-(EL) V REF MT SW BST SW BEEP 19 20 21 22 23 24 18 17 16 15 14 13 PW SW 12 11 10 8 7 BST1 9 BST2 6 5 4 3 2 1 BST AGC PW B PW A ADD TC MT VCC INR INL B.
— 30 — IC901 XPC18A32FCR2 56 55 42 41 40 VLON XWK1 XWK2 XWK3 XWK4 VSTV 7 VRMC GND 8 VL VLO 9 10 VL 11 L2 12 PGND2 13 PGND2 VIF VA VAFB VDFB VIFFB GND VC VCO VCOUT L1 VC NC PGND1 PGND1 14 15 16 17 .
— 31 — 6-8. IC PIN FUNCTION DESCRIPTION • IC501 SN761057DBT (RF AMP , FOCUS/TRACKING ERR OR AMP) Pin No . Pin Name I/O Description 1 TE O T racking error signal output to the system controller (.
— 32 — • IC601 CXD2671-203GA (SYSTEM CONTROL) Pin No . Pin Name I/O Description 1 P A USE KEY I Not used (open) 2 NC — Not used (open) 3 XTEST I Input terminal for the test mode detection 4, 5.
— 33 — Pin No . Pin Name I/O Description 47 FE I Focus error signal input 48 A UX1 I Support signal input (A/D input) 49 VC I Middle point voltage input 50 ADIO O Not used (open) 51 ADR T I A/D co.
— 34 — Pin No . Pin Name I/O Description 91 DSPVDD2 — Power supply (for DSP block) 92 DSPVSS1 — Ground (for DSP block) 93 SPCU I Brushless spindle motor drive comparison signal input (U) 94 SP.
— 35 — Pin No . Pin Name I/O Description 156, 157 TEST1, TEST0 I T erminal 1, 0 for the main test 158 EV A I EV A/FLASH chip discrimination terminal 159 OPR LED O Operation LED control 160 SSB D A.
— 36 — Pin No . Pin Name I/O Description 210 TSB SL V CHK I TSB slav e check 211 K-T AI I Not used (open) 213 MCUVSS1 — Ground (for the microcomputer block) 214 CA V CL V SW O Not used (open) 21.
SECTION 7 EXPLODED VIEWS The components identified by mark 0 or dotted line with mark 0 are critical for safety . Replace only with par t number specified. — 37 — NOTE : • -XX, -X mean standardized parts, so they may hav e some difference from the original one.
— 38 — Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 7-2. MECHANISM DECK SECTION (MT -MZE500-174) 51 64 65 M901 M902 54 55 56 57 59 62 63 60 58 52 53 61 51 1-680-453-11 MOTOR FLEXIBLE BOARD 52 3-222-392-01 SCREW (M1.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks — 39 — SECTION 8 ELECTRICAL P AR TS LIST NOTE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks — 40 — C920 1-127-895-11 T ANT AL. CHIP 22uF 20% 4V C921 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V C922 1-127-569-11 T ANT AL. CHIP 100uF 20% 4V C923 1-107-820-11 CERAMIC CHIP 0.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks — 41 — R920 1-208-707-11 MET AL CHIP 10K 0.5% 1/16W R921 1-218-979-11 RES-CHIP 150K 5% 1/16W R923 1-218-969-11 RES-CHIP .
MZ-E500 — 42 — Sony Corporation Audio Entertainment Gr oup 2000L1664-1 Printed in Japan ©2000.12 Published by General Engineering Dept. 9-873-027-11.
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