Benutzeranleitung / Produktwartung MDX-C5970R des Produzenten Sony
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MICROFILM SERVICE MANUAL Ger man Model MDX-C5960R US Model Canadian Model E Model MDX-C5970 AEP Model UK Model MDX-C5970R SPECIFICA TIONS MDX-C5960R/C5970/C5970R Photo: MDX-C5960R Model Name Using Sim.
– 2 – Notes on chip component replacement • Ne ver reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexib le Circuit Board Repairing • Kee p the temperature of the soldering iron around 270 ˚C dur- ing repairing.
– 3 – 1. GENERAL Location of controls ........................................................ 4 Resetting the unit ............................................................ 5 Detaching the front panel ..........................................
– 4 – SECTION 1 GENERAL This section is e xtracted from instruction manual..
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– 10 – SECTION 2 DISASSEMBL Y SUB P ANEL Note: Follo w the disassembly procedur e in the numerical order given. 1 five screws (PTT2.6 × 6) 1 screw (PTT2.
– 11 – MAIN BO ARD, HEA T SINK SER V O BOARD 4 insulating sheet 3 main board 2 three screws (PTT2.6 × 6) (ground point) 1 two screws (PTT2.6 × 10) 6 heat sink 5 eight screws (PTT2.
– 12 – 1 tension spring (FL2) 1 tension spring (FL2 ) 2 two tension springs (FLOAT F) 3 Pushing an arrow A part, raise the float block up ward at the front to release a lock.
– 13 – LO MO TOR ASS’Y (LO ADING) (M903) LEVER (LE) ASS’Y 4 Remove the bracket (LO) in the direction of the arrow A . 1 Remove solders of motor (M903) 5 LO motor ass’y (loading) (M903) 2 ten.
– 14 – HOLDER ASS’Y CHUCKING ARM ASS’Y 1 Remove the chucking arm ass’y in the direction of the arrow. holder ass’y 2 type-E stopring 1.5 2 type-E stopring 1.5 3 lever (lock L) 2 type-E stopring 1.5 2 type-E stopring 1.5 4 Remove the holder ass’y in the direction of the arrow.
– 15 – OPTICAL PICK-UP (KMS-241B/J1NP) SL MO TOR ASS’Y (SLED) (M902), SP MOT OR ASS’Y (SPINDLE) (M901) 6 bearing (SL) 5 feed screw ass’ y 3 screw (K2 × 3) 2 shaft (SL2) 1 two screws (K2 × 3) 7 optical pick-up (KMS-241B/J1NP) 4 screw (B2 × 3) 4 screw (P1.
– 16 – SECTION 3 ELECTRICAL ADJUSTMENTS TEST MODE This set hav e the test mode function. In the test mode, FM Auto Scan/Stop Le vel and AM (MW) Auto Scan/Stop Lev el adjustments can be performed easier than it in ordinary procedure. <Set the T est Mode> 1.
– 17 – – 18 – RDS S-Meter Adjustment (MDX-C5960R/C5970R) Setting: [SOURCE] b utton: FM Procedur e: 1. Set to the test mode. (See page 16) 2. Push the [SOURCE] button and set to FM. Display 3. Push the preset [10] button. 4. Adjust R V1 on MAIN board so that the display indication is “11.
MDX-C5960R/C5970/C5970R – 19 – – 20 – SECTION 4 DIA GRAMS 4-1. BLOCK DIA GRAM – SER V O Section – F C B D A E I J J I B A C D E F DETECTOR 1 2 J I 4 5 6 7 A B C D 8 9 E F LD PD LASER DIODE ILCC PD OPTICAL PICK-UP (KMS-241B/J1NP) AUTOMATIC POWER CONTROL Q302 11 10 APC PD LD/PD AMP 12 APCREF I-V AMP I-V AMP AT AMP B.
MDX-C5960R/C5970/C5970R – 21 – – 22 – 4-2. BLOCK DIA GRAM – TUNER Section – 1 4 2 FM-ANT AM-ANT 6 VCO 21 FM/AM-IF 20 SD 5 5 28 3 24 10 16 9 13 12 69 100 15 VT 13 AM OSC DATA CLOCK SSTOP SD.
MDX-C5960R/C5970/C5970R – 23 – – 24 – 4-3. BLOCK DIA GRAM – MAIN Section – LOCK IN 61 AF ATT 71 SCL 70 SDA 55 AMP ATT 80 58 TEL-ATT 32 60 AU ATT 05 • SIGNAL PATH : MD PLAY : FM : AM (MW/.
MDX-C5960R/C5970/C5970R – 25 – – 26 – 4-4. BLOCK DIA GRAM – DISPLA Y/KEY CONTR OL Section – D813 – 817, LSW802, 808, 811 LSW801, 804, 806, LSW807, 809, 810, LSW812 – 821 PL801, 802 (LC.
MDX-C5960R/C5970/C5970R – 27 – 4-5. BLOCK DIA GRAM – BUS CONTROL/PO WER SUPPL Y Section – – 28 – BACKUP +5V BACKUP +5V RESET SIGNAL GENERATOR IC801 RAM RESET IC802 BATTERY DETECT Q601 ACCE.
MDX-C5960R/C5970/C5970R – 29 – 4-6. NO TES FOR PRINTED WIRING BO ARDS AND SCHEMA TIC DIA GRAMS Note on Schematic Diagram: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except f or electrolytics and tantalums.
MDX-C5960R/C5970/C5970R • Semiconductor Location Ref. No. Location D401 E-6 D501 E-4 IC301 B-5 IC302 C-2 IC303 B-3 IC304 C-5 IC305 F-6 IC306 B-4 IC307 B-8 IC401 E-6 IC501 F-3 IC502 D-5 IC503 D-4 Q301 A-4 Q302 C-1 Q401 D-6 Q402 E-7 Q403 E-7 4-7.
MDX-C5960R/C5970/C5970R 4-8. SCHEMA TIC DIA GRAM – SER V O Board (1/3) – • See page 55 for Wavef orms. • See page 58 f or IC Block Diagrams. • V oltages and wav ef or ms are dc with respect to ground under no-signal conditions.
MDX-C5960R/C5970/C5970R – 35 – – 36 – 4-9. SCHEMA TIC DIA GRAM – SER V O Board (2/3) – • See page 55 for W aveforms. • See page 57 for IC Bloc k Diagrams. • V oltages and wav eforms are dc with respect to ground under no-signal conditions.
MDX-C5960R/C5970/C5970R – 37 – – 38 – 4-10. SCHEMA TIC DIA GRAM – SER V O Board (3/3) – • See page 55 for W aveforms. • V oltages and wav ef or ms are dc with respect to ground under no-signal conditions.
MDX-C5960R/C5970/C5970R – 39 – – 40 – 4-11. PRINTED WIRING BO ARD – MAIN Board (Component Side) – D912 J-10 D913 C-6 D914 K-11 D915 K-4 D916 K-4 IC100 E-11 IC101 E-9 IC102 I-12 IC250 I-5 I.
MDX-C5960R/C5970/C5970R – 41 – – 42 – 4-12. PRINTED WIRING BO ARD – MAIN Boar d (Conductor Side) – • Semiconductor Location (Conductor Side) Ref.
MDX-C5960R/C5970/C5970R – 43 – – 44 – 4-13. SCHEMA TIC DIA GRAM – MAIN Board (1/4) – • See page 55 for W aveforms. • See page 60 f or IC Block Diagrams. • V oltages and wav ef or ms are dc with respect to ground under no-signal (detuned) conditions.
MDX-C5960R/C5970/C5970R – 45 – – 46 – 4-14. SCHEMA TIC DIA GRAM – MAIN Board (2/4) – • V oltages are dc with respect to ground under no-signal (detuned) conditions.
MDX-C5960R/C5970/C5970R – 47 – – 48 – 4-15. SCHEMA TIC DIA GRAM – MAIN Board (3/4) – • See page 55 for W aveforms. • See page 60 f or IC Block Diagrams. • V oltages and wav ef or ms are dc with respect to ground under no-signal (detuned) conditions.
MDX-C5960R/C5970/C5970R – 49 – – 50 – • V oltages are dc with respect to ground under no-signal (detuned) conditions. no mark : FM ( ) : AM (MW) [] : L W 〈〈 〉〉 : MD PLA Y 4-16. SCHEMA TIC DIA GRAM – MAIN Board (4/4) – • See page 61 f or IC Block Diagrams.
MDX-C5960R/C5970/C5970R – 51 – – 52 – 4-17. PRINTED WIRING BO ARD – KEY Board – • Semiconductor Location (Component Side) Ref. No. Location D811 C-3 D812 B-3 D813 A-4 D814 A-2 D815 B-1 D816 C-2 D817 A-11 IC801 B-8 Q806 C-4 Q807 B-1 • Semiconductor Location (Conductor Side) Ref.
MDX-C5960R/C5970/C5970R – 53 – – 54 – 4-18. SCHEMA TIC DIA GRAM – KEY Board – • See page 56 for W avef orms. • V oltages and wav eforms are dc with respect to ground under no-signal (detuned) conditions.
– 55 – – 56 – • W aveforms – SER V O Board – 1 IC302 @§ (TE) (MD PLA Y Mode) 2 IC302 #¢ (FE) (MD PLA Y Mode) 3 IC302 #• (RF) (MD PLA Y Mode) 4 IC301 @∞ (LRCK) (MD PLA Y Mode) 5 IC301 @§ (XBCK) (MD PLA Y Mode) 6 IC501 #¡ (EXT AL) (MD PLA Y Mode) 7 IC304 3 (IN) (MD PLA Y Mode) Approx.
– 57 – • IC Block Dia grams – SER V O Board – IC101 PCM1718E/2K IC301 CXD2652AR INPUT INTERFACE DIGITAL FILTER 5 LEVEL DAC LOWPASS FILTER CMOS AMP 1 XTI 2 DGND 3 VDD 4 LRCIN 5 DIN 6 BCKIN 7 .
– 58 – IC302 CXA2523R –1 –2 + – IVR BB + – IVR AA + – IVR CC + – IVR DD + – IVR + – EE EE' EFB TESW PTGR 48 MORFO 47 MORFI 46 RFO 45 OPN 44 OPO 43 ADDC 42 COMPP 41 COMPO 40 AG.
– 59 – IC303 BH6511FS-E2 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 123456789 10 11 12 13 14 15 16 GND VG IN4R IN4F VM4 OUT4F PGND4 OUT4R VM34 OUT3R PGND3 OUT3F VM3 IN3F IN3R PSB CAPA– CAPA+ IN2R IN2F VM2 OUT2F PGND2 OUT2R VM12 OUT1R PGND1 OUT1F VM1 IN1F IN1R V DD CHARGE PUMP.
– 60 – – MAIN Boar d – IC100 TD A7427AD LP FM LP HC LP AM VREF DOUT3 DOUT4 DOUT5 DOUT6 OSCIN OSCOUT NC SCL SDA IF AM LP OUT VDD2 GND-SIG NC FM IN AM IN GND-AM ADDR VDD1 HFREF DOUT2 DOUT1/INLOC.
– 61 – IC300 TD A7462D013TR SE3L SE3R MUTE SDA SCL PAUSE OUT FL OUT FR OUT RL OUT RR SUBOUT+ SUBOUT– VDD GND CREF SE1L SE1R MD+ MD– CDL+ CDL– CDR– CDR+ PDR PDGND PDL SE2L SE2R INPUT GAIN &.
– 62 – 4-19. IC PIN FUNCTION DESCRIPTION • SERVO BOARD IC301 CXD2652AR Pin No. Pin Name I/O Function 1 MNT0 O Focus OK signal output to the MD mechanism controller (IC501) “H” is output when.
– 63 – Pin No. Pin Name I/O Function 46 D1 I/O 47 D0 I/O 48 D2 I/O 49 D3 I/O 50 MVCI I Digital in PLL oscillation input from the external VCO Not used (fixed at “L”) 51 ASYO O Playback EFM full-swing output terminal 52 ASYI I (A) Playback EFM asymmetry comparator voltage input terminal 53 AVDD — Power supply terminal (+3.
– 64 – Pin No. Pin Name I/O Function 92 SFDR O Sled servo drive PWM signal (+) output to the BH6511FS (IC303) 93 SPRD O Spindle servo drive PWM signal (–) output to the BH6511FS (IC303) 94 SPFD .
– 65 – • SERVO BOARD IC302 CXA2523R (RF AMP, FOCUS/TRACKING ERROR AMP) Pin No. Pin Name I/O Function 1I I I-V converted RF signal I input from the optical pick-up block detector 2J I I-V converted RF signal J input from the optical pick-up block detector 3V C O Middle point voltage (+1.
– 66 – • SERVO BOARD IC501 CXP84340-201Q (MD MECHANISM CONTROLLER) Pin No. Pin Name I/O Function 1 to 5 TIN3 to TIN7 I/O Input of the 4 × 8 matrix test keys (“L” is always output, except in.
– 67 – Pin No. Pin Name I/O Function 47 UNIREQ O Data request signal output terminal (for SONY bus) “H”: request on Not used (open) 48 UNICKIO I/O Serial clock signal input from the master con.
– 68 – • Pin No. Pin Name I/O Function 1 to 7 NC O Not used (open) 8 VCC — Power supply terminal (+5V) 9 PLL SI I PLL serial data input terminal Not used (open) 10 PLL SO O PLL serial data out.
– 69 – Pin No. Pin Name I/O Function 43 AVRH I Reference voltage (+5V) input terminal (for A/D converter) 44 AVRL I Reference voltage (0V) input terminal (for A/D converter) 45 AVSS — Ground ter.
– 70 – Pin No. Pin Name I/O Function 75 NC O Not used (open) 76 BU-IN I Battery detect signal input from the SONY bus interface (IC600) and battery detect circuit “L” is input at low voltage 7.
– 71 – Pin No. Pin Name I/O Function 111 TU-ON O Tuner system power supply on/off control signal output to the BA3918 (IC800) “H”: tuner power on 112 to 118 NC O Not used (open) 119 VSS — Gr.
– 72 – (1) GENERAL SECTION SECTION 5 EXPLODED VIEWS Les composants identifiés par une marque ! sont critiquens pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécif ié. The components identified by mark ! or dotted line with mark ! are critical for safety .
– 73 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark (2) FRONT P ANEL SECTION 51 3-033-694-01 BUTTON (EJ) ( 6 . LIST . DSPL) (C5970) 51 3-033-714-01 BUTTON (EJ) ( 6 . PTY . AF/T A. DSPL) (C5960R/C5970R) 52 3-023-611-03 BUTTON (10KEY) (OFF .
– 74 – (3) MECHANISM DECK SECTION-1 (MG-164N-138) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 101 A-3317-459-A SERVO BOARD, COMPLETE * 102 X-3376-799-1 CHASSIS ASSY.
– 75 – (4) MECHANISM DECK SECTION-2 (MG-164N-138) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 151 2-626-617-01 SCREW (2X8) 152 A-3317-457-A SENSOR BOARD, COMPLETE 153.
– 76 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark KEY KEY BOARD ********* * 3-023-609-01 PLA TE (LCD), LIGHT GUIDE * 3-023-621-02 SHEET (LCD) * 3-033-696-01 SHEET (LCD), DIFFUSION * 3-033-706-01 PLA TE (LCD), GROUND * 3-033-707-01 HOLDER (LCD) < CAP ACITOR > C802 1-163-809-11 CERAMIC CHIP 0.
– 77 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark LSW806 1-762-619-21 SWITCH, KEY BOARD (WITH LED) (GREEN) (SOUND) LSW807 1-762-617-21 SWITCH, KEY BOARD (WITH LED) (.
– 78 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R838 1-216-023-00 RES, CHIP 82 5% 1/10W (C5970) R838 1-216-028-00 MET AL CHIP 130 5% 1/10W (C5960R/C5970R) R840 1-2.
– 79 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C53 1-163-229-11 CERAMIC CHIP 12PF 5% 50V (C5960R/C5970R) C54 1-163-145-00 CERAMIC CHIP 0.
– 80 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C905 1-125-710-11 DOUBLE LA YER 0.1F 5.5V C906 1-164-489-11 CERAMIC CHIP 0.22uF 10% 16V C907 1-164-489-11 CERAMIC CHIP 0.22uF 10% 16V C908 1-164-004-11 CERAMIC CHIP 0.
– 81 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark L250 1-412-533-21 INDUCTOR 47uH L251 1-412-537-31 INDUCTOR 100uH L252 1-412-533-21 INDUCTOR 47uH L500 1-416-712-21 COIL, CHOKE 0.
– 82 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R56 1-216-025-00 RES,CHIP 100 5% 1/10W (C5960R/C5970R) R57 1-216-025-00 RES,CHIP 100 5% 1/10W (C5960R/C5970R) R59 1-216-295-00 SHORT 0 (C5960R/C5970R) R62 1-216-057-00 MET AL CHIP 2.
– 83 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R783 1-216-097-00 RES,CHIP 100K 5% 1/10W (C5970: E) R800 1-216-113-00 MET AL CHIP 470K 5% 1/10W R801 1-216-097-00 R.
– 84 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C330 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C331 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C333 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C334 1-164-004-11 CERAMIC CHIP 0.
– 85 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R330 1-216-853-11 MET AL CHIP 470K 5% 1/16W R331 1-216-809-11 MET AL CHIP 100 5% 1/16W R332 1-216-809-11 MET AL CHI.
– 86 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark ACCESSORIES & PACKING MA TERIALS ******************************* 3-865-831-11 MANUAL, INSTRUCTION (ENGLISH) (C5.
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