Benutzeranleitung / Produktwartung bl460c server blade des Produzenten HP (Hewlett-Packard)
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HP Pr oL iant BL4 6 0c Serv er Blade Maintenance and S erv i ce Guid e Part Number 405778- 008 May 2008 (Ei ghth Edition).
© Copyright 2006, 2008 Hewlett-Pa ckard Development Company, L.P. The in formati on con taine d here in is subject to chan ge with out n otice. The on ly war ranti es for H P produ cts and serv ices ar e set forth in th e ex press warrant y stat ements accom panyin g such produ cts and serv ices.
Contents 3 Con t e n t s Custom er self re pair ........................................................................................................... ........... 5 Parts only warra nty se rvice ...................................................
Contents 4 SAS and SA TA hard dr iv e LED comb inati ons ....................................................................................... ......... 5 5 System boa rd comp on ents .................................................................
Customer self repair 5 C ust omer self r epair HP products are designed with many Customer Self Repair (CSR) parts to minimize r epair time and allow for greater flexibility in performing defective parts re placement.
Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vou s demandez à HP de remplacer ces pièces, les coûts de déplacement et main d' œuv re du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative.
Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste par ti siano sostituit e da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR- Ersatzteil geliefert werden, k önnen Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss.
Customer self repair 9 Centro de asistencia técnica de HP y recibirá ay uda telefónica por parte de un técni co. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectu osos deberán devolverse a HP.
Customer self repair 10 periode, gewoonlijk vijf (5) we rkdagen, retourneren aan HP. Het defecte on derdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen.
Customer self repair 11 Se r v iço de gar anti a apen as par a peças A garantia limitada da HP pode incluir um serviço de garantia apenas para pe ças. Segundo os termos do serviço de garantia apenas para peças, a HP fo rne ce as peças de reposição sem cobrar nenhuma taxa.
Customer self repair 12.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Illustrated parts catalog 16 Illus tr ated par ts cata log Server blade components Item Description Spare part number Customer se lf repair (on page 5 ) Mech anical c omponents 1 Access panel 410303-0.
Illustrated parts catalog 17 Item Description Spare part number Customer se lf repair (on page 5 ) c) 3.20-GHz In tel® Xeon® processor 5063 MV, dual-core, 2×2-MB cache, 1066- MHz FSB* ** 413073-001 O ptional 2 d) 3.73-GHz In tel® Xeon® processor 5080, dual- core, 2×2-MB cac he, 1066-MHz FSB* ** 412955-001 O ptional 2 e) 1.
Illustrated parts catalog 18 Item Description Spare part number Customer se lf repair (on page 5 ) w) 2.50-GHz In tel® Xeon® processor E5420, quad-core, 2×6- MB L2 cache, 1333-MH z FSB* ** 460491-001 O ptional 2 x) 2.50-GHz In tel® Xeon® processor L5420, quad-core, 2×6- MB L2 cache, 1333-MH z FSB* ** 463719-001 O ptional 2 y) 2.
Illustrated parts catalog 19 Item Description Spare part number Customer se lf repair (on page 5 ) a) Smart Array E200i Controlle r cache module, 64-MB* 412800-001 Man datory 1 b) Smart Array E200i Co.
Illustrated parts catalog 20 2 Optional: Facultatif —Pièces pour lesquelles la réparation par le client est f acultative. Ces pièces sont également conçues pour permettre au client d' effectuer lui-mêm e la réparation.
Illustrated parts catalog 21.
Removal and replac ement procedures 22 R emo val and r e placement pr ocedur es Required tools You need the following items for some pro cedures: • T-15 Torx screwdriver (provided inside the access .
Removal and replac ement procedures 23 CAUTION: When performing non-hot-plug operatio ns, you must power down the serv er blade and/or the system. However, it may be necessary to leave the server blade powered up when performing other operations , such as hot-plug installatio ns or troubleshooting.
Removal and replac ement procedures 24 Power down the server blade Before powering down the server blade for any up grade or maintenance procedure s, perform a backup of critical server data and programs.
Removal and replac ement procedures 25 4. Place the server blade on a flat, level work surface. WARNING: To reduce the risk of personal injury from hot surfaces, allow the dr ives and the internal system components to cool before touch ing them.
Removal and replac ement procedures 26 Remove the component as indicated. To replace the blank, slide the blank into the bay until it locks into pla ce.
Removal and replac ement procedures 27 To replace the component: 1. Prepare the hard drive. 2. Install the hard drive. FBDIMM CAUTION: Use only HP FBDIMMs. FBDIMM s from other sources may adv ersely affect data integrity. To remove the component: 1. Power down the server blade (on page 24 ).
Removal and replac ement procedures 28 4. Remove the FBDIMM. To replace the component, reve rse the removal procedure. Hard drive backplane Some models of this server blade do not include a hard drive backplane. To remove the component: 1. Power down the server blade (on page 24 ).
Removal and replac ement procedures 29 6. Remove the hard drive backplane. Use the back plane retainer to disengage the hard drive backplane from the connector. To replace the component: 1. Install the hard drive backplane. Press down on the hard driv e backplane retainer to seat the board.
Removal and replac ement procedures 30 2. Remove the server blade (on page 24 ). 3. Remove the access panel (" Access panel " on page 25 ). 4. Remove all hard drives (" Hard drive " on page 26 ). 5. Remove all hard drive blanks (" Hard drive blank " on page 25 ).
Removal and replac ement procedures 31 4. Install the hard drive blanks (" Hard drive blank " on page 25 ). 5. Install the access panel (" Access panel " on page 25 ). 6. Install the server blade. Front panel/hard drive cage assembly To remove the component: 1.
Removal and replac ement procedures 32 4. Remove the mezzanine card. To replace the component: 1. Install the mezzanine card. Press down on the connector to seat the card. 2. Install the access panel (" Access panel " on page 25 ). 3. Install the server blade.
Removal and replac ement procedures 33 5. Remove all hard drive blanks (" Hard drive blank " on page 25 ). 6. Remove the hard drive backplane (" Hard drive backplane " on page 28 ). 7. Remove the Smart Array E200i Controller cache modul e.
Removal and replac ement procedures 34 8. Remove the Smart Array E200i Controller battery pack. To replace the component, reve rse the removal procedure. Server blade handle To remove the component: 1. Power down the server blade (on page 24 ). 2. Remove the server blade (on page 24 ).
Removal and replac ement procedures 35 8. Remove the server blade handle. To replace the component, reve rse the removal procedure. Release button To remove the component: 1. Power down the server blade (on page 24 ). 2. Remove the server blade (on page 24 ).
Removal and replac ement procedures 36 8. Remove the release button. To replace the component, reve rse the removal procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the dr ives and the internal system components to cool before touch ing them.
Removal and replac ement procedures 37 8. Remove the heatsink. To replace the component: 1. Clean the old thermal grease from the proc esso r with the alcohol swab. Allow the a lcohol to evaporate before continuing. 2. Remove the thermal interface protective cover from the heatsink.
Removal and replac ement procedures 38 3. Install the heatsink. 4. Install the front panel/hard drive cage assembly (" Front panel/hard drive cage assembly " on page 31 ). 5. Install the hard drive backplane (" Hard drive backplane " on page 28 ).
Removal and replac ement procedures 39 6. Remove the hard drive backplane (" Hard drive backplane " on page 28 ). 7. Remove the front panel/hard drive cage assembly (" Front panel/hard drive cage assembly " on page 31 ). 8. Remove the heatsink (" Heatsink " on page 36 ).
Removal and replac ement procedures 40 1. If the processor has separated from the installation to ol, carefully re-insert the processor in the tool. 2. Align the processor installation tool with th e socket and install the spare processor. CAUTION: The processor is designed to fit o ne wa y into the socket.
Removal and replac ement procedures 41 3. Press down firmly until the processor installation t ool clicks and separates from the processor, and then remove the processor installation tool. 4. Close the processor retaining latch and th e processor socket retaining bracket.
Removal and replac ement procedures 42 6. Apply all the grease to the top of the processor in one of the following patterns to e nsure even distribution: CAUTION: Heatsink retaining screws should be tigh tened in diagonally opposite pairs (in an "X" pattern).
Removal and replac ement procedures 43 System board To remove the component: 1. Power down the server blade (on page 24 ). 2. Remove the server blade (on page 24 ). 3. Remove the access panel (" Access panel " on page 25 ). 4. Remove all hard drives (" Hard drive " on page 26 ).
Removal and replac ement procedures 44 12. Using your fingers, remove the proc e ssor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover afte r removing the processor from the sock et.
Removal and replac ement procedures 45 1. Install the spare system board. 2. Prepare the processor socket o n the spare system board: a. Open the processor retaining latch and th e processor socket retaining bracket.
Removal and replac ement procedures 46 b. Remove the processor socket protective cover. 3. Install the processor socket cover onto the proc essor socket of the failed sy stem board. 4. Install the processor on th e spare system board. CAUTION: The processor is designed to fit o ne wa y into the socket.
Removal and replac ement procedures 47 5. Close the processor retaining latch and th e processor socket retaining bracket. 6. Clean the old thermal grease from the heatsink an d the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.
Removal and replac ement procedures 48 After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequ ence, press the F9 ke y to access RBSU. 2. Select the System Options menu. 3. Select Serial Number .
Removal and replac ement procedures 49 8. Remove the system board. 9. Identify the battery location (" System board components " on page 56 ). 10. Remove the battery. IMPORTA NT: Replacing the system board battery re sets the system ROM to its default configuration.
Diagnostic tools 50 Di agno sti c too ls Troubleshooting resources The HP ProLiant Serve rs Troubleshooting Guide provides procedures for resolving c ommon problems and comprehensive courses of action.
Diagnostic tools 51 This functionality supports operatin g systems that may not be supported by the server blade. For operating systems supported by the server blade, see the HP webs ite ( http://www.
Diagnostic tools 52 HP Instant Support Enterprise Edition ISEE is a proactive remote monitoring and diagnostic t ool to help ma nage your systems and devices, a feature of HP support. ISEE provides continuous hardwa re event monitoring and automated notification to identify and prevent potential critical problems.
Server component identificatio n 53 Ser v er component identif icati on Front panel components Item Description 1 Hard drive bay 1 2 Power On/ Standby button 3 SUV connector* 4 Hard drive bay 2 5 Serv.
Server component identificatio n 54 Front panel LEDs Item Description Status 1 UID LED Blue = Identified Blue fla shing = A ctive remote manageme nt Off = No act ive remot e manag ement 2 Health LED G.
Server component identificatio n 55 SAS and SATA hard drive LEDs Item Description 1 Fault/UID LED (amb er/blue) 2 Online L ED (green) SAS and SATA hard drive LED combinations Online/activity LED (gr e.
Server component identificatio n 56 Online/activity LED (gr een) Fault/UID LE D (amber/blue) Interpretation Flashing irreg ularly Amber, flashin g regularly (1 Hz) The drive is ac tive, but a predic tive failure alert has been received for th is drive.
Server component identificatio n 57 Item Description 12 Enclosur e connector The symbols correspond to the symbols located on th e inte rconnect bays. For more in formation, see the HP ProLian t BL460c Server Blade Installation Instruc tions that ship with th e server blade.
Server component identificatio n 58 Position Fu nction Default 5* Password disabled Off 6* Reset co nfigura tion Off 7 Reserved Off 8 Reserved Off *To access redundan t ROM, set S1, S5, an d S6 to ON. Hard drive backplane components Some models of this server blade do not include a hard drive backplane.
Server component identificatio n 59 HP c-Class Blade SUV Cable Item Connector Description 1 Server blade For connecting to the SUV connector on the server blade front panel 2 Video For connec ting a v.
Specifications 60 Sp e c i fica t io n s Environmental specifications Specification Value Tempera ture rang e* Operat ing 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 60 ° C (-40 ° F.
Acronyms an d abbreviations 61 A c r on y ms and abbr e v i ati ons ADU Array Diagnostics Utility BBWC battery-backed write cache CSR Customer Self Repair ESD electrostatic discharge FBDIMM fully buff.
Acronyms an d abbreviations 62 PCI peripheral component interface PCIe peripheral component interconnect express RBSU ROM-Based S etup Utility ROM read-only memory SAS serial attached SCSI SATA serial.
Index 63 A access panel 16, 25 ADU (Array Diagnostic Utility) 51 Array Diagnostic Utility (ADU) 51 B backplane, hard drive 28, 58 battery 16, 48, 56 battery-backed write cache battery pack 16, 33 butt.
Index 64 mezzanine connectors 56, 57 N NIC (network interface card) 56 P part numbers 16 Power On/Standby button 53 powering down 24 preparation procedures 23 processor soc ket 56 processor soc ket co.
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