Benutzeranleitung / Produktwartung NoBL CY7C1470BV25 des Produzenten Cypress Semiconductor
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72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL™ Architecture CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Cypress Semiconductor Corpora tion • 198 Champion Court • San Jose , CA 95134-1709 • 408-943-2600 Document #: 001-15032 Rev .
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 2 of 29 Logic Block Diagram – CY7C1470BV25 (2M x 36) Logic Block Diagram – CY7C1472BV25 (4M x 18) A0, A1, A C MODE BW a .
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 3 of 29 Logic Block Diagram – CY7C1474BV25 (1M x 72) A0, A1, A C MODE CE1 CE2 CE3 OE READ LOGIC DQ s DQ P a DQ P b DQ P c .
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 4 of 29 Pin Configurations A A A A A 1 A 0 V SS V DD A A A A A A V DDQ V SS DQb DQb DQb V SS V DDQ DQb DQb V SS NC V DD DQa .
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 5 of 29 Pin Configurations (continued) 165-Ball FBGA (15 x 17 x 1.4 mm ) Pinout CY7C1470BV25 (2M x 36) CY7C1472BV25 (4M x 18.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 6 of 29 Pin Configurations (continued) CY7C1474BV25 (1M × 72) 209-Ball FBGA (14 x 22 x 1.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 7 of 29 T able 1. Pin Definitions Pin Name IO T ype Pin Description A0 A1 A Input- Synchronous Address In puts Used to Select One of the Address Locations . Sampled at the rising edge of the CLK.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 8 of 29 Functional Overview The CY7C1470BV25, CY7C1472BV25 , and CY7C1474BV25 are synchronous-pipel ined Burst NoBL SRAMs designed specif- ically to eliminate wait states during read or w rite transitions.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 9 of 29 access (read, write, or deselect) is latched into the Address Register (provided the ap propriate control signals are asserted).
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 10 of 29 T a ble 4. T ruth T able The truth table for CY7C1470BV25, CY7C1472BV25, and CY7C1474 BV25 follows.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 1 1 of 29 T able 5. Partial Write Cycle Description The partial write cycle description for CY7C1470 BV25, CY7C1472BV25, and CY7 C1474BV25 follows.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 12 of 29 IEEE 1 149.1 Serial Boun dary Scan (JT AG) The CY7C1470BV25, CY7C1472BV25 , and CY7C1474BV25 incorporates a serial boundary sca n test access port (T AP). This port operates in accordance with IEEE S tandard 1 149.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 13 of 29 Instruction Register Three-bit instructions can be serially loa ded into the instruction register . Thi s register is loaded when it is placed b etween the TDI and TDO balls as shown i n the “T AP Controller Block Diagram” on page 12 .
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 14 of 29 possible to capture all o ther signals and simply ig nore the value of the CLK captured in the boundary scan register . After the data is captured, it is possible to shift out the data by putting the T AP into the Shif t-DR state.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 15 of 29 T AP AC Switching Characteristics Over the Operating Range [9, 10] Parameter Descrip tion Min Max Unit Clock t TCYC.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 16 of 29 2.5V T AP AC T est Conditions Input pulse levels .................... .............. ........... .... V SS to 2.5V Input rise and fall time ............... ..........
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 17 of 29 T able 8. Iden tification Codes Instruction Code Description EXTEST 000 Captures IO ring contents. Places the boundary scan register between TDI and TDO. Forces all SRAM outputs to High-Z state.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 18 of 29 Boundary Scan Exit Order (4M x 18) Bit # 165-Ball ID Bit # 165-Ball ID Bit # 165-Ball ID Bit # 165 -B all ID 1 D 21.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 19 of 29 Maximum Ratings Exceeding maximum ratin gs may impair the useful life o f the device. These user guidelines are not teste d. S torage T emperature ...................
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 20 of 29 I SB3 Automatic CE Power Down Current—CMOS Inputs Max. V DD , Device Deselected, V IN ≤ 0.3V or V IN > V DDQ − 0.3V , f = f MAX = 1/t CYC 4.0-ns cycle, 250 MHz 200 mA 5.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 21 of 29 Switching Characteristics Over the Operating R ange. Timing reference is 1.25V when V DDQ = 2.5V . T est conditions shown in (a) of “AC T est Loads and W aveforms” on page 20 unless otherwise noted.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 22 of 29 Switching W aveforms Figure 6 shows read-write timing waveform. [19, 20, 21] Figure 6.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 23 of 29 Figure 7 shows NOP , ST ALL and D ESELECT Cycles waveform. [19, 20, 22] Figure 7. NOP , ST ALL and DESELECT Cycles Figure 8 shows ZZ Mode timing wavefo rm. [23, 24] Figure 8.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 24 of 29 Ordering Information Not all of the speed, package and temperatur e ranges are available. Please contact y our local sales represe ntative or visit www .cypress.com for actual products offered.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 25 of 29 250 CY7C1470BV25-250AXC 51-85 050 100-pin Thin Quad Flat Pack (1 4 x 20 x 1.4 mm) Pb-Free Commercial CY7C1472BV25-250AXC CY7C1470BV25-250BZC 51-85165 165-ball Fin e-Pitch Ball Grid Array (15 x 17 x 1.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 26 of 29 Package Diagrams Figure 9. 100-Pin Thin Plastic Qu ad Flatpack (14 x 20 x 1.4 mm), 51-85050 NOTE: 1. JEDEC STD REF MS-026 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 27 of 29 Figure 10. 165-Ball F BGA (15 x 17 x 1 .4 mm), 51-85165 Package Diagrams (continued) A 1 PIN 1 CORNER 17.00±0.10 15.00±0.10 7.00 1.00 Ø0.45±0.05(165X) Ø0.25 M C A B Ø0.
CY7C1470BV25 CY7C1472BV25, CY7C1474BV25 Document #: 001-15032 Rev . *D Page 28 of 29 Figure 1 1. 209-Ball FBGA (14 x 22 x 1.76 mm), 51-85167 Package Diagrams (continued) 51-85167-* * [+] Feedback.
Document #: 001-15032 Rev . *D Re vised February 29, 2008 Page 29 of 29 NoBL and No Bu s Latency are trademar ks of Cypress Semicondu ctor Co rporation. ZBT is a trademark of Integrat ed Device T echn ology , Inc. All products and company names me ntioned in this document may be the tr ademarks of their respe ctive hold er s.
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