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Toshiba Personal Computer TECRA M2 Maintenance Manual TOSHIBA CORPORATION File Number 960-468.
Copyright © 2004 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the inform ation contained herein.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA M2. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the TECRA M2 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service.
Conventions This manual uses the following formats to describe, identify, and highlight term s and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ................................................................................................................... ... 1-1 1.2 System Unit Block Diagram ......................................
2.14 Sound Troubleshooting ............................................................................................ 2-53 2.15 SD Card Slot Troubleshooting ................................................................................. 2-56 Chapter 3 Tests and Diagnostics 3.
3.28 System Configuration .............................................................................................. 3-75 3.29 SETUP ..................................................................................................................
4.27 Fluorescent Lamp..................................................................................................... 4-87 Appendices Appendix A Handling the LCD Module ........................................................................... A-1 Appendix B Board Layout .
x TECRA M2 Maintenance Manual (960-468).
Chapter 1 Hardware Overview.
1 Hardware Overview 1-ii TECRA M2 Maintenance Manual (960-468).
1 Hardware Overview Chapter 1 Contents 1.1 Features................................................................................................................... ....1-1 1.2 System Unit Block Diagram ..............................................
1 Hardware Overview 1-iv TECRA M2 Maintenance Manual (960-468) Figures Figure 1-1 Front of the computer .....................................................................................1-6 Figure 1-2 System unit configuration......................
1.1 Features 1 Hardware Overview 1 Features 1.1 Features The Toshiba TECRA M2 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Sem iconductor (CMOS) technology extensively to provide compact size, minim um weight, low power usage and high reliability.
1 Hardware Overview 1.1 Features USB FDD (BTO) A 3.5-inch USB FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks. Slim Select Bay (BTO) A DVD-ROM drive, CD-RW/DVD-ROM drive, DVD±R/±RW drive, DVD Multi drive, 2nd HDD or 2nd Battery can be installed in the Slim Select Bay.
1.1 Features 1 Hardware Overview Keyboard An-easy-to-use 85(US)/86(UK)-key keyboard pr ovides a numeric keypad overlay for fast numeric data entry or for cursor and page control. The keyboard also includes two keys that have special functions in Microsoft Windows 2000/XP.
1 Hardware Overview 1.1 Features SD Card The SD Card Slot can accommodate Secure Digital flash m emory cards with various capacities. SD cards let you easily transfer data from devices, such as digital cameras and Personal Digital Assistants, which use SD Card flash-memory.
1.1 Features 1 Hardware Overview Video-out jack The video jack enables to transfer NTSC or PAL data to external devices connected with S-Video cable. Internal modem The internal modem is equipped as a m odem daughter card (MDC). The internal modem provides capability for data and fax com munication and supports V.
1 Hardware Overview 1.1 Features The front of the computer is shown in figure 1-1. Figure 1-1 Front of the computer 1-6 TECRA M2 Maintenance Manual (960-468).
1.1 Features 1 Hardware Overview The system unit configuration is shown in figure 1-2. Figure 1-2 System unit configuration TECRA M2 Maintenance Manual (960-468) 1-7.
1 Hardware Overview 1.2 System Unit Block Diagram 1.2 System Unit Block Diagram Figure 1-3 is a block diagram of the system unit. Figure 1-3 System unit block diagram 1-8 TECRA M2 Maintenance Manual (.
1.2 System Unit Block Diagram 1 Hardware Overview The system unit is composed of the following m ajor components: Processor • Intel Banias Processor 1.
1 Hardware Overview 1.2 System Unit Block Diagram Intel ICH4-M (South Bridge) • One Intel FW82801DBM is used. • This gate array has the following features: – Hub Link Interface – PCI Rev2.2 Interface (6 PCI REQ/GNT Pairs) – BusMaster IDE Controller (Ultra ATA 100/66/33) – USB 1.
1.2 System Unit Block Diagram 1 Hardware Overview Firmware Hub (FWH ) • One STMicro M50FW080N1 is used. • This gate array has the following features: – Firmware hub hardware interface mode .
1 Hardware Overview 1.2 System Unit Block Diagram EC/KBC (Embedded Controller/Keyboard Controller) • One Mitsubishi M306K9FCLRP micon chip functions as both EC and KBC.
1.2 System Unit Block Diagram 1 Hardware Overview Modem Controller • One built-in modem card with Agere SCORPIO+CSP1037B is used. • This controller has the following functions: – One RJ11 po.
1 Hardware Overview 1.2 System Unit Block Diagram IEEE1394 • One Ti TSB43AB22 is used. Sensor • Thermal Sensor: One ADM1032AR chip is used.
1.3 3.5-inch Floppy Disk Drive 1 Hardware Overview 1.3 3.5-inch Floppy Disk Drive (USB External) The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD and 1.44MB (formatted) 2HD disks. The FDD is shown in figure 1-4.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive 1.4 2.5-inch Hard Disk Drive The removable HDD is a random access non-volatile storage device. It has a non-rem ovable 2.5-inch magnetic disk and mini-W inchester type magnetic heads. The computer supports a 30GB, 40GB, 60GB and 80GB HDD.
1.4 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-2 2.5-inch HDD specifications (2/4) Specifications Items TOSHIBA HDD 2190B HITACHI GST G8BC0000Z410 Outline Width (mm) 69.85 69.85 dimensions Height (mm) 9.5 9.5 Depth (mm) 100 100.2 Weight (g) 95 max.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive Table 1-2 2.5-inch HDD specifications (3/4) Specifications Items TOSHIBA HDD2183 HITACHI GST G8BC00017610 HITACHI GST G8BC0000Z610 Outline Width (mm) 69.85 69.85 69.85 dimensions Height (mm) 9.5 9.5 9.5 Depth (mm) 100 100 100.
1.4 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-2 2.5-inch HDD specifications (4/4) Specifications Items FUJITSU G8BC00019610 HITACHI GST G8BC00015610 HITACHI GST G8BC00014810 Outline Width (mm) 70 69.85 69.85 Dimensions Height (mm) 9.5 9.5 9.
1 Hardware Overview 1.5 DVD-ROM Drive 1.5 DVD-ROM Drive The DVD-ROM drive accommodates either 12cm (4.72-inch) or 8cm (3.15-inch) DVDs. This drive plays DVDs at maximum 8-speed and reads CDs at maximum 24-speed. The DVD-ROM drive is shown in figure 1-6.
1.5 DVD-ROM Drive 1 Hardware Overview Table 1-3 DVD-ROM drive specifications (2/2) HITACHI G8CC0000R410 Item DVD-ROM mode CD-ROM mode ATAPI Burst (Mbytes/s) 33.3 (U-DMA Transfer mode 2) Access time (ms) Average Random Access 110 (Typ.) 85 (Typ.) Rotation speed (rpm) 4,594 max.
1 Hardware Overview 1.6 CD-RW/DVD-ROM Drive 1.6 CD-RW/DVD-ROM Drive The CD-RW/DVD-ROM drive accomm odates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CDs, CD-R/RW and DVDs. It is a high-perfor mance drive that reads CD-R at m aximum 24- speed and reads DVD-ROM at maximum 8-speed.
1.6 CD-RW/DVD-ROM Drive 1 Hardware Overview Table 1-4 CD-RW/DVD-ROM drive specifications (2/2) Specifications Item Panasonic G8CC0001C410 ATAPI Burst (Mbytes/s) 16.6 (PIO Mode 4, Multi-word DMA Mode 2) 33.3 (Ultra DMA Mode2) CD-ROM 130 typ. Average access time (msec) DVD-ROM 180 typ.
1 Hardware Overview 1.7 DVD±R/±RW Drive 1.7 DVD±R/±RW Drive This full size DVD±R/±RW drive module lets you record data to rewritable CD/DVDs as well as run either 12 cm (4.
1.8 DVD Multi (DVD-R/-RW/-RAM) Drive 1 Hardware Overview 1.8 DVD Multi (DVD-R/-RW/-RAM) Drive The DVD Multi drive is capable of driving either 12cm (4.
1 Hardware Overview 1.8 DVD Multi (DVD-R/-RW/-RAM) Drive Table 1-6 DVD Multi drive specifications (2/2) TEAC G8CC00013410 Item DVD-ROM mode CD-ROM mode CD-R/CD-RW (Write) ATAPI Burst (Mbytes/s) 33.
1.9 Keyboard 1 Hardware Overview 1.9 Keyboard The keyboard is mounted 85(US)/86(UK) keys that consist of character key and control key, and in conformity with JIS. The keyboard is connected to mem brane connector on the system board and controlled by the keyboard controller.
1 Hardware Overview 1.10 TFT Color Display 1.10 TFT Color Display The TFT color display consists of 14.1-in ch XGA/SXGA+ LCD module and FL inverter board. 1.10.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 262,144 colors with 1,024 x 768 or 1,400 x 1,050 resolution.
1.10 TFT Color Display 1 Hardware Overview Table 1-7 LCD module specifications (2/2) Specifications Item 14.1-inch SXGA+ TFT (VF2074P01) Number of Dots 1,400 (W) x 1,050 (H) Dot spacing (mm) 0.204 (H) x 0.204 (V) Display range (mm) 285.6 (H) x 214.2 (V) 1.
1 Hardware Overview 1.11 Power Supply 1.11 Power Supply The power supply supplies many different voltages to the system board and perform s the following functions: 1. Checks power input to determine: • Whether the AC adaptor is connected to the computer.
1.11 Power Supply 1 Hardware Overview Table 1-9 Power supply output rating Name Voltage (V) Use PPV 0.748-1.484 CPU MCH1R2-P1V 1.2 MCH-M PTV 1.075 CPU, MCH-M, ICH4-M 2R5-P2V 2.5 GPU 2R5-B2V 2.5 MCH-M, DDR-SDRAM LAN2R5-E2V 2.5 GB it LAN Controller 1R25-P1V 2.
1 Hardware Overview 1.12 Batteries 1.12 Batteries The computer has three types of batteries as follows: Main battery pack RTC battery Secondary battery pack (optional slim select bay module) The battery specifications are listed in Table 1-10.
1.12 Batteries 1 Hardware Overview 1.12.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The microprocessor controls whether the charge is on or off and detects a full charge when the AC adaptor and battery are attached to the computer.
1 Hardware Overview 1.12 Batteries 1-34 TECRA M2 Maintenance Manual (960-468) 1.12.3 RTC battery The RTC battery provides power to keep the current date, time and other setup information in memory while the com puter is turned off. Table 1-12 lists the charging time and data preservation period of the RTC battery.
Chapter 2 Troubleshooting Procedures.
2 Troubleshooting Procedures 2-ii TECRA M2 Maintenance Manual (960-468).
2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting ..........................................................................................................2- 1 2.2 Troubleshooting Flowchart ..........................................
2 Troubleshooting Procedures 2.9 Optical Drive Troubleshooting .................................................................................2-42 Procedure 1 Diagnostic Test Program Execution Check ...............................2-42 Procedure 2 Connector Check and Replacement Check .
2 Troubleshooting Procedures Figures Figure 2-1 Troubleshooti ng flowchart ..................................................................................2-3 Figure 2-2 Printer port LED ..............................................................
2 Troubleshooting Procedures 2-vi TECRA M2 Maintenance Manual (960-468).
2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to dete rmine if a Field R eplaceable Un it (FRU) in the computer is causing the computer to malfunc tion. The FRUs covered are: 1. System Board 6. Optical Drive 11.
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart 2.2 Troubleshooting Flowchart Use the flowchart in figure 2-1 as a guide fo r determ ining which troubleshooting procedures to execute.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (1/2) TECRA M2 Maintenance Manual (960-4 68) 2-3.
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart Figure 2-1 Troubleshooting flowchart (2/2) 2-4 TECRA M2 Maintenance Man ual (960-468).
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the prob lem may be intermittent. The Running Test program should be executed severa l times to isolate the problem .
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 2.3 Power Supply Troubleshooting The power supply controls many functions and components. To determine if the power supply is functioning properly, star t with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 2 Error Code Check If the power supply microprocessor detects a malfunction, it indicates the error code as shown below.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Check 1 Compare the patterns in the hexadeci mal error code to the tables below. DC IN Error code Meaning 10h AC Adaptor output voltage is over 16.5V. 11h Common Dock voltage is over 16.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures S3V output Error code Meaning 40h S3V voltage is 3.14V or less wh en the computer is powered on/off. 45h S3V voltage is 3.14V or less when the computer is booting up. (CV support) 1R5-C1V output Error code Meaning 50h 1R5-C1V voltage is over 1.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting PGV output Error code Meaning 80h PGV voltage is over 1.62V when the computer is powered on/off. 81h PGV voltage is 0.68V or less when the computer is powered on. 82h PGV voltage is 0.68V or less when the computer is booting up.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures MCH1R2-P1V output Error code Meaning C0h MCH1R2-P1V voltage is over 1.44V when the compu ter is powered on/off. C1h MCH1R2-P1V voltage is 1.02V or less when the computer i s powered on.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Check 2 In the case of error code 10h or 12h: Make sure the AC adaptor cord and AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 3 Connection Check The power supply wiring diagram is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Disconnect the AC power cord from the wall outlet.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 4 Charge Check The power supply may not charge the batter y pack. Perform the following procedures: 1. Reinstall the battery pac k. 2. Attach the AC adaptor and turn on the pow er.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 5 Replacement Check The system board processor module m ay be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures .
2 Troubleshooting Procedures 2.4 System Board Troubleshooting 2.4 System Board Troubleshooting This section describes how to determ ine if th e system board and CPU are defective o r not functioning properly. Start with Procedure 1 an d continue with the other procedures as instructed.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Procedure 1 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Check 2 The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) th rough (17), (24) or (25) appears, go to Procedure 4.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Procedure 2 Printer Port LED Check on Boot Mode The printer port LED displays the IRT (Initial Reliability Test) status and test status by turning lights on and off as an eight-digit bi nary value for boot mode.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LE D boot mode status (1/7) LED Status Test item Message Clearance of software reset bit Permission of A20 line Sta.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Printer port LE D boot mode status (2/7) LED Status Test item Message (B7h) Memory type check Initialization of cache Bus L2 con.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LE D boot mode status (3/7) LED Status Test item Message Check of DRAM type and size (Reading DRAM size at Warm Boo.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Printer port LE D boot mode status (4/7) LED Status Test item Message 04h BIOS signature check (at Cold Boot) SMRAM initializati.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LE D boot mode status (5/7) LED Status Test item Message (07h) Setting default when a CMOS default (Bad Battery, Ba.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Printer port LE D boot mode status (6/7) LED Status Test item Message (0Ah) PCI automatic configuratio n Creat ing a work area f.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LE D boot mode status (7/7) LED Status Test item Message 1Fh PRE_BOOT_SETUP Storing the val ue of 40:00h (for SIO s.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Procedure 3 Diagnostic Test Program Execution Check Execute the following tests from the Di agnostic Test Menu. Refer to Chapter 3, Tests and Diagnostics, for more inform ation on how to perform these tests.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Procedure 4 Replacement Check The system board connectors may be disconnect ed. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform Check 1.
2.5 FDD Troubleshooting 2 Troubleshooting Procedures 2.5 FDD Troubleshooting This section describes how to determ ine if the FDD is functioning properly. Perform the steps below starting with Procedure 1 and con tinuing with the other pr ocedures as required.
2 Troubleshooting Procedures 2.5 FDD Troubleshooting Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more inform ation about th e diagnostics test procedures.
2.5 FDD Troubleshooting 2 Troubleshooting Procedures Procedure 3 Connector Check and Replacement Check The USB 3.5-inch FDD is connected to the System Board.
2 Troubleshooting Proce dures 2.6 HDD Troubleshooting 2 2.6 HDD Troubleshooting This section describes how to determine if the HDD is functioning properly. Perform the steps below starting with Procedure 1 and con tinuing with the other pr ocedures as required.
2.6 HDD Troubleshooting 2 Troubleshooting Procedures Procedure 2 Partition Check Insert the Toshiba MS-DOS system disk and restart the computer with U key holding down. Perform the following checks: Check 1 Type C: and press Enter . If you cannot change to drive C, go to Check 2.
2 Troubleshooting Proce dures 2.6 HDD Troubleshooting Procedure 3 Format Check The computer’s HDD is formatted using the low level format program and the MS-DOS FORMAT program. To format the HDD, start with Check 1 below and perform the other steps as required.
2.6 HDD Troubleshooting 2 Troubleshooting Procedures Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnos tics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more inform ation about the HDD test program.
2 Troubleshooting Proce dures 2.6 HDD Troubleshooting Procedure 5 Connector Check and Replacement Check The HDD may be disconnected, or the HDD or the system board may be dam aged.
2.7 Keyboard and Touch pad Troubleshooting 2 Troubleshooting Procedures 2.7 Keyboard and Touc h pad Troubleshooting To determine if the computer’s keyboard or touch pad is functioning properly, perform the following procedures. Start with Procedure 1 an d continue with the other procedures as instructed.
2 Troubleshooting Procedures 2.7 Keyboard and Touch pad Troubleshooting Procedure 2 Connector and Replacement Check The keyboard, touch pad or sensor/switch board may be disconnected or damaged. Disassemble the computer following the steps described in C hapter 4, Replacement Procedures , and perform the following checks: 1.
2.7 Keyboard and Touch pad Troubleshooting 2 Troubleshooting Procedures Check 5 Make sure the cable of the sensor/s witch board is firm ly connected to PJ9600 on the system board, and the sensor/switch boa rd cable is connected to PJ9610 on the sensor/switch board.
2 Troubleshooting Procedures 2.8 Display Troubleshooting 2.8 Display Troubleshooting This section describes how to determ ine if th e computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2.8 Display Troubleshooting 2 Troubleshooting Procedures Procedure 3 Replacement Check The FL, FL inverter board, LCD module, and system board are connected to display circuits.
2 Troubleshooting Procedures 2.9 Optical drive Troubleshooting 2.9 Optical drive Troubleshooting This section describes how to determine if the optical drive (DVD-ROM, CD-RW /DVD- ROM, DVD±R/±RW or DVD Multi drive) in the Slim Select Bay is functioning properly.
2.9 Optical drive Troubleshooting 2 Troubleshooting Procedures Procedure 2 Connector Check and Replacement Check The optical drive (DVD-ROM, CD-RW/DVD- ROM, DVD±R/±RW or DVD Multi drive) is connected to the system board. The connectors may be disconnected from the system board or may be damaged.
2 Troubleshooting Procedures 2.10 Modem Troubleshooting 2.10 Modem Troubleshooting This section describes how to determ ine if the computer's m odem is functioning properly. Perform the steps below starting with Procedure 1 and continui ng with the othe r procedures as required.
2.10 Modem Troubleshooting 2 Troubleshooting Procedures Procedure 2 Connector Check and Replacement Check The Modem is installed as a modem daughter card (MDC). If the modem m alfunctions, there may be a bad connection between the MDC a nd the system board.
2 Troubleshooting Procedures 2.11 LAN Troubleshooting 2.11 LAN Troubleshooting This section describes how to determ ine if the computer's LAN is functioning properly.
2.12 Bluetooth Troubleshooting 2 Troubleshooting Procedures 2.12 Bluetooth Troubleshooting This section describes how to determ ine if the computer's Bluetooth is functioning properly. Perform the steps below starting with Procedure 1 and continui ng with the other procedures as required.
2 Troubleshooting Procedures 2.12 Bluetooth Troubleshooting Procedure 2 Connection Check The Bluetooth function wiring diagram is shown below: Any of the connections may be disconnected.
2.12 Bluetooth Troubleshooting 2 Troubleshooting Procedures Procedure 3 Replacement Check The Bluetooth antenna, Bluetooth module, sound board and system board are connected to the circuits.
2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting 2.13 Wireless LAN Troubleshooting This section describes how to determ ine if the computer's Wireless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.13 Wireless LAN Troubleshooting 2 Troubleshooting Procedures Procedure 2 Connection Check The wireless LAN wiring diagram is shown below: Any of the connections may be disconnected.
2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting Procedure 3 Replacement Check The wireless LAN antenna, wireless LAN board and the system board are connected to the circuits.
2.14 Sound Troubleshooting 2 Troubleshooting Procedures 2.14 Sound Troubleshooting This section describes how to determine if the computer's sound functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures 2.14 Sound Troubleshooting Procedure 2 Connector Check The sound function-wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the com puter following the steps described in Chapter 4, Replacement Procedures and perform the following checks: 1.
2.14 Sound Troubleshooting 2 Troubleshooting Procedures Procedure 3 Replacement Check Check 1 If the stereo speakers do not sound pr operly, the right or left speaker may be defective or damaged. Replace it with a new one. If the stereo speakers still do not work properly, go to Check 4.
2 Troubleshooting Procedures 2.15 SD Card Slot Troubleshooting 2.15 SD Card Slot Troubleshooting This section describes how to determ ine if th e computer's SD card f unctions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
Chapter 3 Tests and Diagnostics.
3 Tests and Diagnostics 3-ii TECRA M2 Maintenance Manual (960-468).
3 Tests and Diagnostics Chapter 3 Contents 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ..............................................
3 Tests and Diagnostics 3-iv TECRA M2 Maintenance Manual (960-468) 3.26.1 Function Description .......................................................................... 3-69 3.26.2 Operations ..........................................................
3.1 The Diagnostic Test 3 Tests and Diagnostics 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test program to test the functions of the computer’s hardware modules. The Diagnostic Test Program is stored on the Diagnostic Disk NOTE: To start the diagnostics, follow these steps: 1.
3 Tests and Diagnostics 3.1 The Diagnostic Test Other tests are as follows: Wireless LAN (Cisco) Test Wireless LAN (Atheros) Test Wireless LAN (Calexico) Test Sound/Modem/LAN Test .
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Toshiba MS-DOS is required to run the Diagnostic Test Program. To start the Diagnostic Test Program, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive and turn on the computer while pressing U key.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test When “1.Repair Main (T&D)” is selected and Enter key is pressed, the following menu will appear. NOTE : To exit the DIAGNOSTIC TEST MENU, press Esc . If a test program is in progress, press Ctrl + Break to exit the test program, or press Ctrl + C to stop the test program.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 2. To execute the DIAGNOSTIC TEST MENU from the DIAGNOSTICS MENU, set the highlight bar to 1 , and press Enter . The following DIAGNOSTIC TEST MENU will appear: TOSHIBA Personal Computer XXXX DIAGNOSTICS Version X.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test 3. Select the option you want to execute and press Enter . When “1-SYSTEM TEST” is selected, the following message will appear: SYSTEM TEST XXXXXXX XXXX DIAGNOSTIC TEST VX.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 5. The following message will appear: ERROR STOP : YES/NO Then, use the left or right arrow keys to move the cursor to the desired option and press Enter .
3 Tests and Diagnostics 3.3 Subtest Names 3.3 Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/3) No.
3.3 Subtest Names 3 Tests and Diagnostics Table 3-1 Subtest names (2/3) No. Test Name Subtest No. Subtest Name 7 ASYNC 01 02 03 04 06 07 Wrap around (board) Point to point (send) Point to point (recei.
3 Tests and Diagnostics 3.3 Subtest Names Table 3-1 Subtest names (3/3) No. Test Name Subtest No. Subtest Name - IEEE1394 1 2 3 IEEE1394 test Responder tool ID check - Bluetooth 1 3 T BD_ADDR check Co.
3.4 System Test 3 Tests and Diagnostics 3.4 System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3 Tests and Diagnostics 3.4 System Test Subtest 07 DMI read Reads the factory setting for the serial and DMI numbers. Model Name : XXXXXX Version Number : XXXXXX-XXXXX Serial Number : XXXXXXXXXX Model.
3.4 System Test 3 Tests and Diagnostics Subtest 09 CPU Thirmistor This subtest measures the CPU temperature to see if the cooling functions of the computer are effectively working.
3 Tests and Diagnostics 3.5 Memory Test 3.5 Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3.6 Keyboard Test 3 Tests and Diagnostics 3.6 Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3 Tests and Diagnostics 3.6 Keyboard Test Subtest 04 Touch Pad/IPS This subtest checks the functions of the pointing stick as shown below. A) Touch Pad/IPS stick pressure sensing direction and parameter. B) Touch Pad/IPS switch function check. This test reports the pointing stick motion response from the IPS and IPS switch.
3.6 Keyboard Test 3 Tests and Diagnostics Subtest 05 USB Test This Subtest checks USB. The USB TEST Module (ZD0003P01) and USB Cable (ZD0003P02) must be connected to the computer. The following message will appear. Select a port to test and press Enter .
3 Tests and Diagnostics 3.7 Display Test 3.7 Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Display test contains seven subtests that test the display in various modes.
3.7 Display Test 3 Tests and Diagnostics Subtest 04 Gradation & Mode test for VGA This subtest displays gradations for each mode. Execute the test, then press Enter to change the mode. The display below appears on the screen when this subtest is executed.
3 Tests and Diagnostics 3.7 Display Test Pressing Enter changes the size of the displayed image. Pressing Enter changes the size of the displayed image in the following order: Mode 111 640*480 64K Mod.
3.7 Display Test 3 Tests and Diagnostics Subtest 05 All dot on/off for LCD This subtest displays an all-white screen (all dots on) for three seconds then an all-black screen (all dots off) for three seconds. Subtest 06 “H” Pattern Display This subtest displays a full screen of “H” patterns.
3 Tests and Diagnostics 3.8 Floppy Disk Test 3.8 Floppy Disk Test NOTE : Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. Otherwise, the contents of the floppy disk will be erased.
3.8 Floppy Disk Test 3 Tests and Diagnostics Subtest 01 Sequential read This subtest performs a Cyclic Redundancy Check (CRC) that continuously reads all the tracks (track: 0 to 39/0 to 79) on a floppy disk. The start track is specified at the start of the FDD test.
3 Tests and Diagnostics 3.9 Printer Test 3.9 Printer Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Printer Test contains three subtests that test the output of the printer connected to the computer.
3.9 Printer Test 3 Tests and Diagnostics Subtest 02 Function This subtest is for IBM compatible printers, and tests the following f unctions: Normal print Double-width print Compressed print Emphasize.
3 Tests and Diagnostics 3.10 Async Test 3.10 Async Test To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. The Async test contains six subtests that test the asynchronous communication functions.
3.10 Async Test 3 Tests and Diagnostics Subtest 03 Point to point (receive) This subtest is used with subtest 02 described above. This subtest receives the data from the send side, then sends the received data. Subtest 04 Interrupt test This subtest checks the Interrupt Request Level of IRQ 4, 3 and 5 from the send side.
3 Tests and Diagnostics 3.11 Hard Disk Test 3.11 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter , and follow the directions on the screen. The hard di sk test contains eight subtests that test the hard disk drive functions.
3.11 Hard Disk Test 3 Tests and Diagnostics 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter . The following message will appear during each subtest.
3 Tests and Diagnostics 3.11 Hard Disk Test Subtest 04 Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
3.12 Real Timer Test 3 Tests and Diagnostics 3.12 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The real timer test contains three subtests that test the computer’s real timer functions.
3 Tests and Diagnostics 3.12 Real Timer Test Subtest 03 Real time carry CAUTION : When you execute this Subtest, the current date and time are erased. This Subtest checks the real time clock increment.
3.13 NDP Test 3 Tests and Diagnostics 3.13 NDP Test To execute the NDP Test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3 Tests and Diagnostics 3.14 Expansion Test 3 3.14 Expansion Test To execute the Expansion Test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The expansion test contains two subtests. NOTE: To execute this subtest, the PC card wraparound connector is required.
3.15 CD-ROM/DVD-ROM Test 3 Tests and Diagnostics 3.15 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM Test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the scree n. The CD-ROM/DVD-ROM test contains five subtests that test the computer’s CD-ROM/DVD-ROM functions.
3 Tests and Diagnostics 3.16 Wireless LAN Test (Cisco) 3.16 Wireless LAN Test (Cisco) This section describes how to perform the wireless LAN transm itting-receiving test with the test program. NOTE: Use another computer that can communicate by the wireless LAN as a reference machine to perform this test.
3.16 Wireless LAN Test (Cisco) 3 Tests and Diagnostics Subtest 01 Transmit & Receive test [Responder] This subtest checks transmit and receive functions. Transmit test Press 1 to select the test and press Enter in the reference machine as a responder.
3 Tests and Diagnostics 3.16 Wireless LAN Test (Cisco) When the machine has passed the test, “OK” m essage will appear in the target machine. Then press Enter in the reference machine; the “OK” message will appear also in the reference machine.
3.16 Wireless LAN Test (Cisco) 3 Tests and Diagnostics Press 0 to select the test and press Enter in the reference machine. The following message will appear: When the target machine has passed the test, “OK” m essage will appear in the target machine.
3 Tests and Diagnostics 3.16 Wireless LAN Test (Cisco) Subtest 02 MAC Address test [Mini-PCI Wireless LAN] This sub test reads MAC Address. When the test is completed with no trouble, “OK” appears. Subtest 03 W ireless LAN (WEP64/128) test This sub test reads the WEP of the W ireless LAN Card installed in the target machine.
3.17 Wireless LAN Test (Atheros) 3 Tests and Diagnostics 3.17 Wireless LAN Test (Atheros) This section describes how to perform the wireless LAN transm itting-receiving test with the test program. NOTE: Use another computer (with Atheros wire less LAN card) that can communicate by the wireless LAN as a responder machine to perform this test.
3 Tests and Diagnostics 3.17 Wireless LAN Test (Atheros) Setting the responder machine NOTE: Release the write-protection of the floppy disk for the test. Insert a floppy disk containing the test program into the FDD for the responder machine and turn on the responder machine.
3.17 Wireless LAN Test (Atheros) 3 Tests and Diagnostics To proceed the test, press any key. When the tester machine has passed the test, "OK" m essage will appear in the tester machine. Press Enter to return to the main menu. When the tester machine has not passed the test, "NG" m essage will appear in the tester machine.
3 Tests and Diagnostics 3.18 Wireless LAN Test (Calexico) 3.18 Wireless LAN Test (Calexico) This section describes how to perform the wireless LAN transm itting-receiving test with the test program. NOTE : Use another computer (with Calexico wi reless LAN card) that can communicate by the wireless LAN as a reference machine to perform this test.
3.19 Sound/Modem/LAN Test 3 Tests and Diagnostics 3.19 Sound/Modem/LAN Test This section describes how to perform the Sound/Modem/LAN test with the test program . CAUTION : The system is capable of producing high volume sound. When you use a headphone, be careful to set the volume low and adjust it as necessary.
3 Tests and Diagnostics 3.19 Sound/Modem/LAN Test Subtest 01 Microphoned recording & play This subtest checks the function of the CODEC A/D D/A converter. Both the microphone and headphone terminal can be checked at the sam e time. Before executing this subtest, connect an external microphone to the computer.
3.19 Sound/Modem/LAN Test 3 Tests and Diagnostics To execute a subtest continuously, select the test number and press Enter . To exit the Sound/Modem/LAN test, remove the test program disk from the USB FDD and turn the computer off. Subtest 02 Sin wave This subtest is executed by the load format of COM file (ADSIN.
3 Tests and Diagnostics 3.19 Sound/Modem/LAN Test Subtest 03 LAN (100M) This subtest checks the operation of mini-PCI I/F by the loopback in the chip. Select 3 to execute and press Enter .
3.19 Sound/Modem/LAN Test 3 Tests and Diagnostics Subtest 04 Modem (a) Select 4 to execute and press Enter . The following message will appear: ICHX MDC Test Program with Modem Sound ( PCB Interface ) Version X.
3 Tests and Diagnostics 3.20 IEEE1394 Test 3.20 IEEE1394 Test This section describes how to perform the IEEE1394 test with the test program. Toshiba MS-DOS is required to run the DIAGNOSTICS TEST PROGRAM. To start the DIAGNOSTIC TEST PROGRAM, follow these steps: (a) Insert the Diagnostics disk in the floppy disk drive and turn on the computer.
3.21 Bluetooth Test 3 Tests and Diagnostics 3.21 Bluetooth Test This section describes how to perform the Bluetooth test program to check if the Bluetooth functions of computer are working properly.
3 Tests and Diagnostics 3.21 Bluetooth Test Subtest 01 BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter .
3.21 Bluetooth Test 3 Tests and Diagnostics If the target machine has any problem, it displays Error CODE . The following message is desplayed. ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.
3 Tests and Diagnostics 3.21 Bluetooth Test If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-2 Error code for Bluetooth test (BD_ADDR) (1/2) Error code Meaning 0x01 Unknown HCI Command.
3.21 Bluetooth Test 3 Tests and Diagnostics Table 3-2 Error code for Bluetooth test (BD_ADDR) (2/2) Error code Meaning 0x20 Unsupported LMP Parameter Value. 0x21 Role Change Not Allowed. 0x22 LMP Response Timeout. 0x23 LMP Error Transaction Collosion.
3 Tests and Diagnostics 3.21 Bluetooth Test When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following m essage will appear: ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.
3.21 Bluetooth Test 3 Tests and Diagnostics If the target machine has any problem, the following m essage “ INCOMPLETE ” is displayed with the Error CODE . ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.
3 Tests and Diagnostics 3.21 Bluetooth Test If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-3 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code Meaning 0x01 Unknown HCI Command.
3.21 Bluetooth Test 3 Tests and Diagnostics Table 3-3 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code Meaning 0x20 Unsupported LMP Parameter Value. 0x21 Role Change Not Allowed. 0x22 LMP Response Timeout. 0x23 LMP Error Transaction Collosion.
3 Tests and Diagnostics 3.21 Bluetooth Test Table 3-4 Common error code Error code Meaning 0x30 BT Control Status should be “Disable”, but it is “Enable”. 0x31 BT Control Status should be “Enable”, but it is “Disable”. 0x32 Power Status should be “OFF”, but it is “ON”.
3.22 Error Code and Error Status Names 3 Tests and Diagnostics 3.22 Error Code and Error Status Names Table 3-5 lists the error codes and error status names for the Diagnostic Test.
3 Tests and Diagnostics 3.22 Error Code and Error Status Names Table 3-5 Error codes and error status names (2/3) Device name Error code Error status name Printer 01 08 10 20 40 80 PRT Time Out PRT Fa.
3.22 Error Code and Error Status Names 3 Tests and Diagnostics Table 3-5 Error codes and error status names (3/3) Device name Error code Error status name Expansion C1 C3 C4 C5 C6 C7 C8 CB CC CE CF Ad.
3 Tests and Diagnostics 3.23 Hard Disk Test Detail Status 3.23 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight-digit number.
3.23 Hard Disk Test Detail Status 3 Tests and Diagnostics Table 3-7 Error register contents Bit Name Description 7 BBK1 (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error.
3 Tests and Diagnostics 3.24 Head Cleaning 3.24 Head Cleaning 3.24.1 Function Description This function cleans the heads in the USB FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.
3.25 Log Utilities 3 Tests and Diagnostics 3.25 Log Utilities 3.25.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer.
3 Tests and Diagnostics 3.25 Log Utilities 3.25.2 Operations Selecting 5 and pressing Enter in the DIAGNOSTIC MENU, logs error information into RAM or onto a floppy disk.
3.26 Running Test 3 Tests and Diagnostics 3.26 Running Test 3.26.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02 and 06) 3. Real timer test (subtest 02) 4.
3 Tests and Diagnostics 3.27 Floppy Disk Drive Utilities 3.27 Floppy Disk Drive Utilities 3.27.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE : This program is only for testing a floppy di sk drive.
3.27 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3.27.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 - FORMAT 2 - COPY 3 - DUMP 4 - HDD ID READ 9 - EXIT TO DIAGNOSTICS MENU 2.
3 Tests and Diagnostics 3.27 Floppy Disk Drive Utilities 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a m essage similar to the one below: Insert source disk into drive A: Press any key when ready.
3.27 Floppy Disk Drive Utilities 3 Tests and Diagnostics 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h).
3 Tests and Diagnostics 3.27 Floppy Disk Drive Utilities 3-74 TECRA M2 Maintenance Manual (960-468) (k) The following message will appear. To finish the dum p, select 3 . Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU.
3.28 System Configuration 3 Tests and Diagnostics 3 3.28 System Configuration 3.28.1 Function Description The System Configuration program contains th e following configuration information for the computer: 1. Processor Type 2. VGA Controller 3. MS-DOS Version 4.
3 Tests and Diagnostics 3.28 System Configuration 3.28.2 Operations Selecting 8 from the DIAGNOSTIC MENU and pressing Enter displays the following system configuration: System Configuration Display : Ver X.XX [Machine Name XXXXXX] * - Processor Type = XXXX **- VGA Controller = XXXX * - MS-DOS Version = VX.
3.29 SETUP 3 Tests and Diagnostics 3.29 SETUP 3.29.1 Function Description This program displays the current system setup inform ation as listed below: 1. Memory (a) Total 2. System Date/Time (a) Date (MM-DD-YYYY) (b) Time (HH:MM:SS) 3. Battery (a) Battery Save Mode 4.
3 Tests and Diagnostics 3.29 SETUP 11. Drives I/O (a) Built-in HDD (b) Select Bay 12. PCI Bus (a) PCI Bus 13. PC Card (a) Controller Mode 14. Peripheral (a) Internal Pointing Device (b) Ext keyboard “Fn” (c) Paralla Port Mode (d) Hard Disk Mode 15.
3.29 SETUP 3 Tests and Diagnostics 3.29.2 Accessing the SETUP Program Selecting 0 from the DIAGNOSTICS MENU and pressing Enter displays the SETUP screen. The SETUP screen is divided into two pages. NOTE: USB FDD Legacy Emulation under LEGACY EMULATION appears only when floppy Disk I/O is set to “Disabled”.
3 Tests and Diagnostics 3.29 SETUP Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press PgDn and PgUp to m ove between the two pages. Press ↑ and ↓ to move between items in a colum n. 2. Press either the space bar to change the value.
3.29 SETUP 3 Tests and Diagnostics SETUP Options The SETUP screen is divided into functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s mem ory. (a) Total This field displays the total amount of mem ory installed and is automatically calculated by the computer.
3 Tests and Diagnostics 3.29 SETUP CPU Sleep Mode Use this option to enable or disable the CPU sleep function. Enabled Enables sleep mode. (Default) Disabled Disables sleep mode. Display Auto Off Use this option to disable or set the duration of the display automatic power off function.
3.29 SETUP 3 Tests and Diagnostics 4. Password This option allows you to set or reset the user password for power on. Not Registered Change or remove the password. (Default) For details on setting the user password, refer to the User’s Manual. 5. HDD Password This option sets HDD password.
3 Tests and Diagnostics 3.29 SETUP 6. Boot Priority This tab sets the priority for booting the computer and the priority for the built-in HDD or optional secondary HDD. (a) Boot Priority HDD → FDD → CD-ROM → LAN: The computer looks for bootable files in the following order: HDD, FDD, CD- ROM and LAN.
3.29 SETUP 3 Tests and Diagnostics 7. Display This group of options configures the computer’s display. (a) Power On Display This option is used to select the display when booting up. Auto-Selected Selects an external monitor if one is connected. Otherwise it selects the internal LCD.
3 Tests and Diagnostics 3.29 SETUP 8. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) CPU Cache Use this option to enable or disable the CPU cache. Enabled Enables the CPU cache.
3.29 SETUP 3 Tests and Diagnostics (d) Auto Power On Use this option to set a time and date for automatic power on and enable or disable the ring indicator feature.
3 Tests and Diagnostics 3.29 SETUP 10. I/O ports This option controls settings for the parallel port. NOTE: Do not assign the same interrupt request level and I/O address to the serial port and PC card. (a) Serial Use this option to set the COM level for the serial port.
3.29 SETUP 3 Tests and Diagnostics When the “Parallel Port Mode” (see settings below) is set to ECP , the DMA channel can also be set to 1 or 3 . The default is 3.
3 Tests and Diagnostics 3.29 SETUP 13. PC Card This option sets the PC Card Controller mode. This option can be changed when “Device Config.” is set to “All Devices”. Auto-Selected Use this setting for all PC Cards when OS supports Plug&Play.
3.29 SETUP 3 Tests and Diagnostics (c) Parallel Port Mode The options in this tab are ECP and Standard Bi-directional. ECP Sets the port mode to Extended Capabilities Port (ECP). For most printers, the port should be set to ECP. (Default) Std. Bi-Direct.
3 Tests and Diagnostics 3.29 SETUP 17. SD This option enables/disables the SD Controller functions. (a) SD Controller Enabled Enables SD Controller functions.
3.30 Repair Initial Config Set 3 Tests and Diagnostics 3.30 Repair Initial Config Set The following message will appear: #################################################################### ######### H/W initial information setting tool VerX.
3 Tests and Diagnostics 3.31 Thermal Radiation Control Test 3-94 TECRA M2 Maintenance Manual (960-468) 3.31 Thermal Radiation Control Test This thermal radiation control test checks the temperature of the CPU and GPU. To execute this test, use the diagnostics disk (thermal radiation control) and follow the procedures below.
Chapter 4 Replacement Procedures.
4 Replacement Procedures 4-ii TECRA M2 Maintenance Manual (960-468).
4 Replacement Procedures Chapter 4 Contents 4.1 General .................................................................................................................... ... 4-1 4.2 Battery pack .....................................................
4 Replacement Procedures Figures Figure 4-1 Removing the battery pack ............................................................................ 4-8 Figure 4-2 Removing the PC card ....................................................................
4 Replacement Procedures Figure 4-31 Removing the sound board .......................................................................... 4-49 Figure 4-32 Removing the HDD con holder ................................................................... 4-50 Figure 4-33 Removing the LAN jack .
4 Replacement Procedures 4-vi TECRA M2 Maintenance Manual (960-468).
4.1 General 4 Replacement Procedures 4 Replacement Procedures 4.1 General This section explains how to disassemble the computer and replace Field Replaceable Units (FRUs). It may not be necessary to remove all the FRUs in order to replace one. The chart below is a guide to which FRUs need to be removed in order to remove others.
4 Replacement Procedures 4.1 General Safety Precautions Before you begin disassembly, read the following safety precautions and observe them carefully as you work. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit.
4.1 General 4 Replacement Procedures Before You Begin Look over the procedures in this section before you begin disassembling the computer. Familiarize yourself with the disassembly and reassem bly steps. Begin each procedure by removing the AC adapter and the battery pack as instructed in this section: 1.
4 Replacement Procedures 4.1 General Disassembly Procedures The computer has two basic types of cable connectors: • Pressure Plate Connectors • Coaxial Cable Connectors • Normal Pin Connectors T.
4.1 General 4 Replacement Procedures Tools and Equipment The use of Electrostatic Discharge (ESD) equipment is very important for your safety and the safety of those around you. Proper use of these devices will increase the success rate of your repairs and lower the cost for damaged or destroyed parts.
4 Replacement Procedures 4.1 General Screw Tightening Torque When you fasten screws, be sure to follow the torque list below. CAUTION: Overtightening can damage components and screws; undertightening can result in electrical shorts or other damage if screws or components come loose.
4.1 General 4 Replacement Procedures Color of Screw Shaft To avoid mistakes on the screw length, screw shafts are colored as follows: Even number length screw: brown Odd number length screw: white Special length screw: blue Screws whose lengths are indicated to one or more decim al places such as 2.
4 Replacement Procedures 4.2 Battery pack 4.2 Battery pack Removing the Battery pack To remove the battery pack, follow the steps below and refer to figure 4-1. CAUTION: When handling battery packs, be careful not to short circuit the terminals. Also do not drop, hit or apply impact; do not scratch, break, twist or bend the battery pack.
4.2 Battery pack 4 Replacement Procedures Installing the Battery pack To install the battery pack, follow the steps below and refer to figure 4-1. CAUTION: The battery pack is a lithium ion battery, which can explode if not properly replaced, used, handled or disposed of.
4 Replacement Procedures 4.3 PC card 4.3 PC card Removing the PC card To remove the PC card follow the steps below and refer to figure 4-2. CAUTION: Before you remove a PC card, refer to the card's documentation and to your operating system documentation for proper procedures and precautions.
4.4 SD card 4 Replacement Procedures 4.4 SD card Removing the SD card To remove the SD card, follow the steps below and refer to figure 4-3. CAUTION: Before you remove the SD card, refer to the card's documentation and to your operating system documentation for proper procedures and precautions.
4 Replacement Procedures 4.5 HDD 4.5 HDD CAUTION : When handling the HDD, do not press the top surface as shown by the arrow. Hold it by the sides. Removing the HDD To remove the HDD, follow the steps below and refer to figures 4-4 to 4-6. 1. Turn the computer upside down.
4.5 HDD 4 Replacement Procedures 3. Pull the tab of the HDD pack to remove it from the system board. Be careful not to damage the connector. Tab HDD pack Figure 4-5 Removing the HDD pack TECRA M2 Main.
4 Replacement Procedures 4.5 HDD NOTE: The following steps describe how to disassemble the HDD pack; however, do not disassemble if the HDD is working properly. 4. Place the HDD pack on a flat surface, and remove the following screws . • M3 × 4Z FLAT HEAD screw × 4 5.
4.5 HDD 4 Replacement Procedures Installing the HDD To install the HDD, follow the steps below and refer to figures 4-4 to 4-6. CAUTION: Do not hold the HDD by its top and bottom flat surfaces. It may damage the HDD. 1. Seat the HDD in the HDD bracket and secure them with the following screws .
4 Replacement Procedures 4.6 Expansion memory 4.6 Expansion memory Removing the expansion Memory Module To remove the expansion mem ory module, make sure the com puter is in boot mode and powered off, follow the steps below and refer to figure 4-7 and 4-8.
4.6 Expansion memory 4 Replacement Procedures 2. Press the two latches outward and remove the memory module . Latch Memor y module Latch Figure 4-8 Removing the expansion memory module TECRA M2 Mainte.
4 Replacement Procedures 4.6 Expansion memory Installing the expansion Memory module To install the expansion memory m odule, make sure that the computer is in boot m ode and powered off, follow the steps below and refer to figure 4-7 and 4-8. CAUTION: Do not touch the connectors on the memory module or on the computer.
4.7 Slim select bay module 4 Replacement Procedures 4.7 Slim select bay module Removing the Slim select bay module To remove the slim select bay m odule, follow the steps below and refer to figures 4-9 and 4- 10. CAUTION: The slim select bay module can become hot with use.
4 Replacement Procedures 4.7 Slim select bay module 3. Remove the following screws securing the connector and plastic brace. • M2 × 8S BIND screw × 2 4. Remove the connector and plastic brace from the slim select bay module. 5. Remove the following screws securing the plastic fram e.
4.7 Slim select bay module 4 Replacement Procedures Installing the Slim select bay module To install the slim select bay module, follow the steps below and refer to figures 4-9 and 4- 10. 1. Seat the plastic frame on the side of the slim select bay module, and secure it with the following screws .
4 Replacement Procedures 4.8 Keyboard 4.8 Keyboard Removing the Keyboard To remove the keyboard, follow the steps below and refer to figures 4-11 to 4-15. 1. Remove the following screw securing the keyboard holder. • M2.5 × 3S S-FLAT HEAD screw × 1 M2.
4.8 Keyboard 4 Replacement Procedures 2. Turn the computer face up and open the display panel. 3. Insert your fingers into the latches between the keyboard holder and the computer, and lift up the keyboard holder to unlatch and remove it. 4. Remove the following screws securing the keyboard.
4 Replacement Procedures 4.8 Keyboard 5. Lift the upper side of the keyboard and turn it face down on the cover. Ke y board Figure 4-13 Turning the keyboard 4-24 TECRA M2 Maintenance Manual (960-468).
4.8 Keyboard 4 Replacement Procedures 6. Loosen the screw (with e-ring) securing the keyboard support plate and remove the keyboard support plate . Keyboard support plate Screw ( with e-rin g) Figure .
4 Replacement Procedures 4.8 Keyboard 7. Disconnect the keyboard cable from the connector PJ3200 on the system board and remove the keyboard . Ke y board Keyboard cable PJ3200 Figure 4-15 Removing the.
4.8 Keyboard 4 Replacement Procedures Installing the Keyboard To install the keyboard, follow the steps below and refer to figures 4-11 to 4-15. 1. Place the keyboard face down on the cover. 2. Connect the keyboard cable to the connector PJ3200 on the system board.
4 Replacement Procedures 4.9 Modem Daughter Card (MDC) 4.9 Modem Daughter Card (MDC) Removing the Modem Daughter Card To remove the modem daughter card, follow the steps below and refer to figure 4-16. 1. Remove the following screws securing the m odem daughter card.
4.9 Modem Daughter Card (MDC) 4 Replacement Procedures Installing the Modem Daughter Card To install the modem daughter card, follow the steps below and refer to figures 4-16.
4 Replacement Procedures 4.10 RTC battery 4.10 RTC battery WARNING: When replacing the RTC battery, be sure to use genuine batteries or replacement batteries authorized by Toshiba. Installing the wrong battery could cause a battery explosion or other damage.
4.10 RTC battery 4 Replacement Procedures TECRA M2 Maintenance Manual (960-468) 4-31 Removing the RTC battery To remove the RTC battery, follow the steps below and refer to figure 4-17. 1. Peel off the glass tape . 2. Disconnect the RTC battery cable from the connector PJ1005 on the system board and remove the RTC battery from the slot.
4 Replacement Procedures 4.11 Cover/Touch pad 4 Replacement Procedu res 4.11 Cover/Touch pad Removing the Cover/Touch pad To remove the cover/touch pad, follow the steps below and refer to figures 4-18 to 4-23. 1. Turn the computer face down and remove the following screws .
4.11 Cover/Touch pad 4 Replacement Procedures 2. Turn the computer face up and open the display. 3. Remove the following screws . • M2.5 × 4B FLAT HEAD screw × 1 • M2.
4 Replacement Procedures 4.11 Cover/Touch pad 4. Disconnect the touch pad cable from the connector PJ3201 on the system board. Touch pad cable PJ3201 Figure 4-20 Removing the cover (3) 5. Remove the cover by lifting it up toward the front of the computer.
4.11 Cover/Touch pad 4 Replacement Procedures 6. Turn the removed cover face down and remove the following screws securing the touch pad and touch pad switch to the cover. (Remove one screw after peeling the insulator.) • M2.5 × 4B FLAT HEAD screw × 2 M2.
4 Replacement Procedures 4.11 Cover/Touch pad 7. Remove the touch pad and touch pad switch from the cover while unhooking the latches. Touch pad switch Touch pad Figure 4-23 Removing the touch pad and touch pad switch 8. Disconnect the touch pad cable from the connector on the touch pad.
4.11 Cover/Touch pad 4 Replacement Procedures Installing the Cover/Touch Pad To install the cover/touch pad, follow the steps below and refer to figures 4-18 to 4-23. 1. Connect the touch pad cable to the connector on the touch pad. 2. Install the touch pad and touch pad switch on the cover while hooking the latches.
4 Replacement Procedures 4.12 Memory module 4.12 Memory module Removing the Memory module To remove the mem ory module, make sure the com puter is in boot mode and powered off, follow the steps below and refer to figure 4-24. 1. Press the two latches outward and remove the memory module .
4.12 Memory module 4 Replacement Procedures Installing the Memory module To install the memory m odule, make sure that the computer is in boot m ode and powered off, follow the steps below and refer to figure 4-24. CAUTION: Do not touch the connectors on the memory module or on the computer.
4 Replacement Procedures 4.13 Wireless LAN board 4.13 Wireless LAN board Removing the Wireless LAN board To remove the wireless LAN board, make sure the com puter is in boot mode and powered off, follow the steps below and refer to figures 4-25. NOTE: The wireless LAN board is an option in some models.
4.13 Wireless LAN board 4 Replacement Procedures 2. Press the latches outward to release the wireless LAN board. 3. Disconnect the wireless LAN board from the connector on the system board.
4 Replacement Procedures 4.14 Bluetooth module 4.14 Bluetooth module Removing the Bluetooth module To remove the Bluetooth module, follow the steps below and refer to figure 4-26. CAUTION: Do not try to remove the Bluetooth module with the computer turned on.
4.14 Bluetooth module 4 Replacement Procedures Installing the Bluetooth module To install the Bluetooth module, follow the steps below and refer to figure 4-26. 1. Place the Bluetooth module and connect it to the connector PJ4400 on the sound board. 2.
4 Replacement Procedures 4.15 Display assembly 4.15 Display assembly Removing the Display assembly To remove the display assembly, follow the steps below and refer to figures 4-27 to 4-30. 1. Turn the computer face down, and remove the following screws .
4.15 Display assembly 4 Replacement Procedures 2. Turn the computer face up and open the display. 3. Remove the following screw and the LCD cable holder . • M2.5 × 6B FLAT HEAD screw × 1 4. Disconnect the LCD cable from the connector PJ5500 on the system board.
4 Replacement Procedures 4.15 Display assembly 10. Rem ove the following screws securing the display assembly. • M2.5 × 6B FLAT HEAD screw × 4 M2.5 × 6B FLAT HEAD M2.
4.15 Display assembly 4 Replacement Procedures 11. Remove the display assembly from the base assembly. Display assembly Figure 4-30 Removing the display assembly (4) NOTE: When removing the display assembly, be careful not to damage any cables.
4 Replacement Procedures 4.15 Display assembly Installing the Display assembly To install the display assembly, follow the steps below and refer to figures 4-27 and 4-30. 1. Install the display assembly on the base assembly. NOTE : When installing the display assembly, be careful not to pinch or damage any cables.
4.16 Sound board 4 Replacement Procedures 4.16 Sound board Removing the Sound board To remove the sound board, follow the steps below and refer to figure 4-31 and 4-32. 1. Disconnect the sound board flexible cable from the connector PJ9510 on the sound board and the connector PJ9500 on the system board.
4 Replacement Procedures 4.16 Sound board 4. Remove the following screw and the HDD con holder . • M2.5 × 4B FLAT HEAD screw × 1 M2.5 × 4B FLAT HEAD HDD con holder Figure 4-32 Removing the HDD co.
4.16 Sound board 4 Replacement Procedures Installing the Sound board To install the sound board, follow the steps below and refer to figure 4-31 and 4-32. 1. Install the HDD con holder and secure it with the following screw . • M2.5 × 4B FLAT HEAD screw × 1 2.
4 Replacement Procedures 4.17 LAN jack 4.17 LAN jack Removing the LAN jack To remove the LAN jack, follow the steps below and refer to figure 4-33. 1. Disconnect the LAN jack cable from the connector PJ4100 on the system board. 2. Remove the LAN jack from the slot.
4.18 RGB harness holder/RGB board/Modem jack 4 Replacement Procedures 4.18 RGB harness holder/RGB board/Modem jack Removing the RGB harness holder/RGB board/Modem jack To remove the RGB harness holder/RGB board/modem jack, follow the steps below and refer to figure 4-34 to 4-36.
4 Replacement Procedures 4.18 RGB harness holder/RGB board/Modem jack 3. Peel off the glass tape . 4. Disconnect the modem cable from the connector PJ3001 on the system board.
4.18 RGB harness holder/RGB board/Modem jack 4 Replacement Procedures 6. Remove the following screw . • M2.5 × 2.8B FLAT HEAD screw × 1 7. Remove the RGB board and disconnect the RGB cable from the connector PJ5620 on the RGB board.
4 Replacement Procedures 4.18 RGB harness holder/RGB board/Modem jack Installing the RGB harness holder/RGB board/Modem jack To install the RGB harness holder/RGB board/modem jack, follow the steps below and refer to figure 4-34 to 4-36. 1. Connect the RGB cable to the connector PJ5620 on the RGB board.
4.19 Fan 4 Replacement Procedures 4.19 Fan Removing the Fan To remove the fan, follow the steps below and refer to figure 4-37. 1. Remove the following screws securing the fan. • M2.5 × 4B FLAT HEAD screw × 2 2. Disconnect the fan cable from the connector PJ8770 on the system board.
4 Replacement Procedures 4.19 Fan Installing the Fan To install the fan, follow the steps below and refer to figure 4-37. 1. Place the fan . 2. Connect the fan cable to the connector PJ8770 on the system board. 3. Secure the fan with the following screws .
4.20 Cooling fin/CPU 4 Replacement Procedures 4.20 Cooling fin/CPU Removing the Cooling fin/CPU To remove the Cooling fin/CPU, follow the steps below and refer to figures 4-38 to 4-40. CAUTION: 1) The CPU can become very hot during operation. Be sure to let it cool before starting repair work.
4 Replacement Procedures 4.20 Cooling fin/CPU 3. Remove the cooling fin . CAUTION: Silicon grease is applied between the fin and the CPU. When removing the fin, be careful not to damage the CPU under the fin. Coolin g fin Figure4-39 Removing the cooling fin 4.
4.20 Cooling fin/CPU 4 Replacement Procedures Installing the CPU To install the CPU, follow the steps below and refer to figures 38 to 4-42. 1. Make sure the cam is in the open position. 2. Seat the CPU in the CPU socket. Make sure the alignment is exact to avoid damaging pins on the CPU.
4 Replacement Procedures 4.20 Cooling fin/CPU 4-62 TECRA M2 Maintenance Manual (960-468) 4. Apply new grease on the CPU using a special syringe as shown in the following figure. Apply quarter of scale (0.25ml) of grease evenly on the CPU chip. When silicon grease is already applied to the CPU, wipe them off with a close in advance.
4.21 System board/DC-IN jack 4 Replacement Procedures 4 Replaceme nt Procedure s 4.21 System board/DC-IN jack Removing the System board/DC-IN jack To remove the system board/DC-IN jack, follow the steps below and refer to figures 4-43. 1. Remove the following screws securing the system board.
4 Replacement Procedures 4.22 Speaker 4.22 Speaker Removing the Speaker To remove the speaker, follow the steps below and refer to figures 4-44. 1. Remove the following screw and the speaker holder (left). • M2.5 × 6B FLAT HEAD screw × 1 2. Remove the speaker (left) from the slot.
4.22 Speaker 4 Replacement Procedures Installing the Speaker To install the speaker, follow the steps below and refer to figures 4-44 and 4-45. 1. Install the speaker (left) to the slot. 2. Install the speaker holder (left) while inserting its tip to the slot and secure it with the following screw .
4 Replacement Procedures 4.23 Power switch board 4.23 Power switch board Removing the Power sw itch board To remove the power switch board, follow the steps below and refer to figure 4-46 and 4-47. 1. Remove the power button holder while pushing two latches from the back.
4.23 Power switch board 4 Replacement Procedures 2. Remove the power sw itch board from the hole. 3. Disconnect the power switch cable from the connector PJ9610 on the power switch board.
4 Replacement Procedures 4.24 LCD unit/FL inverter 4.24 LCD unit/FL inverter Removing the LCD unit/FL inverter To remove the LCD unit/FL inverter, follow the steps below and refer to figures 4-48 to 4-53. 1. Remove the two mask seals and the following screws securing the LCD m ask.
4.24 LCD unit/FL inverter 4 Replacement Procedures 2. Remove the LCD mask while releasing the latches. LCD mask Figure 4-49 Removing the LCD mask TECRA M2 Maintenance Manual (960-468) 4-69.
4 Replacement Procedures 4.24 LCD unit/FL inverter 3. Remove the following screw securing the FL inverter. • M2 × 4Z S-FLAT HEAD screw × 1 4. Peel the insulator . 5. Disconnect the FL cable under the insulator and the HV cable from the FL inverter.
4.24 LCD unit/FL inverter 4 Replacement Procedures 7. Remove the four mask seals on the sides of the LCD unit and the following screws securing the LCD unit.
4 Replacement Procedures 4.24 LCD unit/FL inverter 8. Carefully lift up the top of the LCD unit to access the LCD cable. NOTE: When lifting up the top of the LCD unit, hold the corners of the LCD unit. The top edge of LCD unit is sensitive area. 9. Remove the copper tape securing the LCD cable.
4.24 LCD unit/FL inverter 4 Replacement Procedures 11. Rem ove the following screws and detach the two LCD supports from the LCD unit . • M2 × 3C S-FLAT HEAD screw × 4 M2 × 3C S-FLAT HEAD screw L.
4 Replacement Procedures 4.24 LCD unit/FL inverter Peel the aluminum cover off the LCD unit.(only for the Samsung-made 14.1-inch XGA LCD unit) CAUTION : Peel the aluminum cover off th e LCD unit. (only for Samsung-made 14.1- inch XGA LCD unit). NOTE: 1) Be careful not to apply pressure to the ICs along the edge of LCD unit.
4.24 LCD unit/FL inverter 4 Replacement Procedures Installing the LCD unit/FL inverter To install the LCD unit/FL inverter, follow the steps below and refer to figures 4-48 to 4-53. 1. Stick the aluminum cover on the LCD unit (only for the Samsung-made14.
4 Replacement Procedures 4.24 LCD unit/FL inverter 4-76 TECRA M2 Maintenance Manual (960-468).
4.24 LCD unit/FL inverter 4 Replacement Procedures 2. Secure the two LCD supports to the LCD unit with the following screws . • M2 × 3C S-FLAT HEAD screw × 4 3.
4 Replacement Procedures 4.24 LCD unit/FL inverter 4. Connect the LCD cable to the connector on the back of the LCD unit. Stick the copper tape on the LCD cable. CAUTION : 5. Seat the LCD unit and secure it with the following screws . • M2 × 4Z S-FLAT HEAD screw × 4 6.
4.25 Microphone/Wireless LAN antenna/Bluet ooth antenna 4 Replacement Procedures 4.25 Microphone/Wireless LAN antenna/Bluetooth antenna Removing the Microphone/Wireless LAN antenna/Bluetooth antenna To remove the microphone/wireless LAN antenna/Bluetooth antenna, follow the steps below and refer to figures 4-54 and 4-55.
4 Replacement Procedures 4.25 Microphone /Wireless LAN antenna/Bluetooth antenna 4. Remove the nine acetate tapes securing the wireless LAN antenna cables and Bluetooth antenna cable (for wire less LAN/Bluetooth models only). 5. Peel off the wireless LAN antennas and Bluetooth antenna from the display cover.
4.25 Microphone/Wireless LAN antenna/Bluet ooth antenna 4 Replacement Procedures Installing the Microphone/Wireless LAN antenna/Bluetooth antenna To install the microphone/wireless LAN antenna/Bluetooth antenna, follow the steps below and refer to figures 4-54 and 4-55.
4 Replacement Procedures 4.26 Hinge 4.26 Hinge Removing the Hinge To remove the hinge, follow the steps below and refer to figures 4-56 to 4-59. 1. Remove the following screw and the LCD cable holder .
4.26 Hinge 4 Replacement Procedures 2. Remove the hinge cap (at the LCD cable side). Hinge cap Figure 4-57 Removing the hinge cap TECRA M2 Maintenance Manual (960-468) 4-83.
4 Replacement Procedures 4.26 Hinge 3. Remove the two mask seals and the following screws of the LCD cover. • M2.5 × 2.8B FLAT HEAD screw × 2 4. Remove the following screws securing the hinges on the LCD cover. • M2.5 × 5B FLAT HEAD screw × 2 Hin g e Mask seal M2.
4.26 Hinge 4 Replacement Procedures 5. Remove the following screws securing the hinges at the back and rem ove the hinges while turning them. • M2.5 × 6 Tapping screw × 2 M2.5 × 6 Tapping Hinge Hinge M2.5 × 6 Tapping Figure 4-59 Removing the hinge (2) 6.
4 Replacement Procedures 4.26 Hinge 4-86 TECRA M2 Maintenance Manual (960-468) Installing the Hinge To install the hinge, follow the steps below and refer to figures 4-56 to 4-59. 1. Pass the LCD cable through the hole. 2. Set the both sides hinges and secure them with the following screw s (on the back).
4.27 Fluorescent Lamp 4 Replacement Procedure 4 4.27 Fluorescent Lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type Part No.
4 Replacement Procedure 4.27 Fluorescent Lamp 4.27.1 Replacing the 14.1-inch XGA Samsung Fluorescent Lamp CAUTION : When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module.
4.27 Fluorescent Lamp 4 Replacement Procedure 2. Remove the lamp-wire tape and alum inum tape. Figure 4-61 Replacing Samsung fluorescent lamp (XGA) (2) Figure 4-62 Replacing Samsung fluorescent lamp (.
4 Replacement Procedure 4.27 Fluorescent Lamp 3. Remove the two screws from the PCB. Figure 4-63 Replacing Samsung fluorescent lamp (XGA) (4) Figure 4-64 Replacing Samsung fluorescent lamp (XGA) (5) 4.
4.27 Fluorescent Lamp 4 Replacement Procedure 4. Remove the four screws from the top chassis. Figure 4-65 Replacing Samsung fluorescent lamp (XGA) (6) TECRA M2 Maintenance Manual (960-468) 4-91.
4 Replacement Procedure 4.27 Fluorescent Lamp 5. Separate the panel assembly from the backlight assem bly. CAUTION : Handle with care not to damage the COF of S/D and G/D ICs.
4.27 Fluorescent Lamp 4 Replacement Procedure 6. Remove the two clips. 7. Remove the backlight assembly. Figure 4-67 Replacing Samsung fluorescent lamp (XGA) (8) TECRA M2 Maintenance Manual (960-468) .
4 Replacement Procedure 4.27 Fluorescent Lamp 8. Remove the two screws fixing the back cover of the fluorescent lamp. Figure 4-68 Replacing Samsung fluorescent lamp (XGA) (9) 4-94 TECRA M2 Maintenance.
4.27 Fluorescent Lamp 4 Replacement Procedure 9. Remove the grounding wire of the fluorescent lamp from the frame. Figure 4-69 Replacing Samsung fluorescent lamp (XGA) (10) TECRA M2 Maintenance Manual.
4 Replacement Procedure 4.27 Fluorescent Lamp 10. Rem ove the fluorescent lamp from the fram e. Figure 4-70 Replacing Samsung fluorescent lamp (XGA) (11) 4-96 TECRA M2 Maintenance Manual (960-468).
4.27 Fluorescent Lamp 4 Replacement Procedure Assembling the 14.1-inch XGA Samsung Fluorescent Lamp To assemble the 14.1-inch XGA Samsung fluorescent lam p, follow the steps below and refer to figures 4-60 to 4-70. 1. Set the fluorescent lamp on the flame in place.
4 Replacement Procedure 4.27 Fluorescent Lamp 4.27.2 Replacing the 14.1-inch SXGA+ Sharp Fluorescent Lamp CAUTION : When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module.
4.27 Fluorescent Lamp 4 Replacement Procedure 2. Remove the four screws (E) on the sides. (E) Screw tightening torque: 0.1078N • m (1.1kgf • cm) (E (E) ) Figure 4-72 Replacing Sharp fluorescent la.
4 Replacement Procedure 4.27 Fluorescent Lamp 3. Turn the LCD module face up and release the two latches on the side of lamp. Latch Figure 4-73 Replacing Sharp fluorescent lamp (SXGA+) (3) 4-100 TECRA.
4.27 Fluorescent Lamp 4 Replacement Procedure 4. Remove the bezel with having the U-shape side of bezel a supporting point, by lifting up the bezel from the side of lamp.
4 Replacement Procedure 4.27 Fluorescent Lamp 5. Turn the bezel face down, and remove the two screws (E) fixing the lamp cover (F) and remove the lamp cover. Then replace the lam p unit (G) with a new one. (E) (F) Lamp cover Screw tightening torque: 0.
4.27 Fluorescent Lamp 4 Replacement Procedure 6. Install the lamp cover (F) and secure it with the two screws (E). NOTE: Be careful not to make the lamp cover over the fitting pin. Around the pulling-out part of the lead wire, attach so that the P chassis is outside.
4 Replacement Procedure 4.27 Fluorescent Lamp 7. Install the bezel. Make sure the bezel does not cover the guide rib. Hook the U-shape side of bezel first, then engage the two latches at the side of lamp.
4.27 Fluorescent Lamp 4 Replacement Procedure 8. Tighten the four screws (E) on the sides. Make sure the two latches are precisely mated. Screw tightening torque: 0.
4 Replacement Procedure 4.27 Fluorescent Lamp 9. Install the protection cover S (A), protection cover G (B), aluminum tape (C) and fixing tape for lead wire (D). Use new parts. • Stick the protection covers in the order of (B), (A) to the standard line for fitting pin.
4.27 Fluorescent Lamp 4 Replacement Procedure 10. Perform appearance inspection after assembling the module. Check screw Check screw Check mating Check mating Check sticking Check sticking Check mating Check screw Check sticking Check mating Check mating Check sticking Check screw Check there is no scratch.
4 Replacement Procedure 4.27 Fluorescent Lamp 4-108 TECRA M2 Maintenance Manual (960-468).
Appendices.
Appendices App-ii TECRA M2 Maintenance Manual (960-468).
Appendices Appendix Contents Appendix A Handling the LCD Module .......................................................................... A-1 Appendix B Board Layout ....................................................................................
Appendices C.22 PJ9501 USB harness connector (8-pin) ..............................................................C-22 C.23 PJ5621 RG board interface connector (20-pin)...................................................C-23 C.24 PJ9600 SW board interface connector (8-pin) .
Appendices Figures Figure B-1 System board (FGTSY*) layout (front) .........................................................B-1 Figure B-2 System board (FGTSY*) layout (back) .........................................................B-3 Figure B-3 Sound board (FGTSN*) layout (front/back) .
Appendices Tables Table B-1 System board (FGTSY*) ICs and connectors (front) .......................................B-2 Table B-2 System board (FGTSY*) ICs and connectors (back) .......................................B-4 Table B-3 Sound board (FGTSN*) ICs and connectors (front/back) .
Appendices Table C-24 SW board interface connector (8-pin) ............................................................C-23 Table C-25 SN board interface connector (40-pin) ...........................................................C-24 Table C-26 Bluetooth interf ace connector (20-pin) .
Appendices App-viii TECRA M2 Maintenance Manual (960-468).
Appendix A Handling the LCD Module Appendices Appendix A P Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assem bly or disassembly. Observe the following precautions when handling the LCD module: 1.
Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent.
Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge.
Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
Appendix A Handling the LCD Module Appendices 9. Do not disassemble the LCD module. Disassem bly can cause malfunctions. 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime).
Appendices Appendix A Handling the LCD Module A-6 TECRA M2 Maintenance Manual (960-468).
Appendix B Board Layout Appendices Appendix B Board Layout B.1 System Board (FGTSY*) Front View (B) (A) (C) (F) (D) (E) (G) (H) (I) (J) (K) (L) (M) (N) (O) (P) (Q) (R) (S) (T) (U) (V) Figure B-1 Syste.
Appendices Appendix B Board Layout Table B-1 System board (FGTSY*) ICs and connectors (front) Mark Number Name (A) PJ4100 Network interface connector (B) PJ8810 Main Battery connector (C) PJ3001 MODEM.
Appendix B Board Layout Appendices B.2 System Board (FGTSY*) Back View (A) (B) (C) (D) (E) (F) (G) (H) Figure B-2 System board (FGTSY*) layout (back) TECRA M2 Maintenance Manual (960-468) B-3.
Appendices Appendix B Board Layout Table B-2 System board (FGTSY*) ICs and connectors (back) Mark Number Name (A) PJ2300 Debugging connector (B) PJ1400 SO-DIMM0 connector (C) PJ1801 Select-bay interfa.
Appendix B Board Layout Appendices B.3 Sound Board (FGTSN*) Front and Back View (A) (B ) (C ) (D) (front) (E) (F ) (G ) (H) (I ) (J) (back) Figure B-3 Sound board (FGTSN*) layout (front/back) TECRA M2.
Appendices Appendix B Board Layout Table B-3 Sound board (FGTSN*) ICs and connectors (front/back) Mark Number Name (A) PJ6000 Headphone connector (B) PJ6002 External microphone connector (C) PJ4600 US.
Appendix B Board Layout Appendices B.4 Switch Board (FGTSW*) Front and Back View (front) (A) (front) (back) Figure B-4 Switch board (FGTSW*) layout (front/back) Table B-4 Switch board (FGTSW*) connect.
Appendices Appendix B Board Layout B-8 TECRA M2 Maintenance Manual (960-468) B.5 RGB Board (FGTRG*) Front and Back View (front) (f ro nt) ( f ro nt) (A) (B) (C) (back) Figure B-5 RGB board (FGTRG*) la.
Appendix C Pin Assignments Appendices Appendix C Appendix C Pin Assignments System board C.1 PJ1400 SO-DIMM0 connector (200-pin) Table C-1 SO-DIMM0 connector (200-pin) (1/3) Pin No.
Appendices Appendix C Pin Assignments Table C-1 SO-DIMM0 connector (200-pin) (2/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 63 GND - 64 GND - 65 SDQ30R-B2P I/O 66 SDQ29R-B2P I/O 67 SDQ31R-B2P I.
Appendix C Pin Assignments Appendices Table C-1 SO-DIMM0 connector (200-pin) (3/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 139 SDQ35R-B2P I/O 140 SDQ32R-B2P I/O 141 SDQ45R-B2P I/O 142 SDQ46R-B.
Appendices Appendix C Pin Assignments C.2 PJ1401 SO-DIMM1 connector (200-pin) Table C-2 SO-DIMM1 connector (200-pin) (1/3) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-2 SO-DIMM1 connector (200-pin) (2/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 63 GND - 64 GND - 65 SDQ28R-B2P I/O 66 SDQ31R-B2P I/O 67 SDQ29R-B2P I.
Appendices Appendix C Pin Assignments Table C-2 SO-DIMM1 connector (200-pin) (3/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 139 SDQ33R-B2P I/O 140 SDQ35R-B2P I/O 141 SDQ46R-B2P I/O 142 SDQ44R-B.
Appendix C Pin Assignments Appendices C.3 PJ1800 HDD interface connector (44-pin) Table C-3 HDD interface connector (44-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments C.4 PJ1801 Select bay interface connector (72-pin) Table C-4 Select bay interface connector (72-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.5 PJ2100 PC card interface connector (150-pin) Table C-5 PC card interface connector (150-pin) (1/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments Table C-5 PC card ard interface connector (150-pin) (2/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 71 ACAD02-EYP I/O 72 ACAD00-EYP I/O 73 ACCD1-E3N I 74 GN.
Appendix C Pin Assignments Appendices Table C-5 PC card interface connector (150-pin) (3/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 145 BCAD01-EYP I/O 146 BCAD02-EYP I/O 147 BCAD00-EYP I/O 148 BCCD1-E3N I 149 GND - 150 GND - C.6 IS2101 SD card interface connector (12-pin) Table C-6 SD card interface connector (12-pin) Pin No.
Appendices Appendix C Pin Assignments Table C-7 Mini PCI interface connector (124-pin) (2/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 35 AD29-P3P I/O 36 NC - 37 GND - 38 AD30-P3P I/O 39 AD27-P3.
Appendix C Pin Assignments Appendices Table C-7 Mini PCI interface connector (124-pin) (3/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 109 NC - 110 NC - 111 NC - 112 NC - 113 GND - 114 GND - 115.
Appendices Appendix C Pin Assignments C.8 PJ2300 Docking interface connector (240-pin) Table C-8 Docking interface connector (240-pin) (1/4) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Pin No. Signal Name I/O Pin No. Signal Name I/O 71 GND - 72 NVDSDA-P5P I/O 73 GND - 74 GND - 75 GND - 76 DHSYNC-P5P O 77 DVISDA-P5P I/O 78 NC - 79 GND - 80 NC - 8.
Appendices Appendix C Pin Assignments Table C-8 Docking interface connector (240-pin) (3/4) Pin No. Signal Name I/O Pin No. Signal Name I/O 145 PE-P5P I 146 PDB07-P5P I/O 147 PDB06-P5P I/O 148 GND - 1.
Appendix C Pin Assignments Appendices Table C-8 Docking interface connector (240-pin) (4/4) Pin No. Signal Name I/O Pin No. Signal Name I/O 219 NC - 220 NC - 221 GND - 222 NC - 223 NC - 224 NC - 225 G.
Appendices Appendix C Pin Assignments C.10 PJ3001 Modem connector (4-pin) Table C-10 Modem connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 MDMRNG-E3P I/O 2 MDMRNG-E3P I/O 3 MDMTIP-E3P I/O 4 MDMTIP-E3P NC I/O C.11 PJ3200 Key board interface connector (34-pin) Table C-11 Keyboard interface connector (34-pin) Pin No.
Appendix C Pin Assignments Appendices C.12 PJ3201 PAD interface connector (8-pin) Table C-12 PAD interface connector (8-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 SP-P5V - 2 SPX-PXP O 3 SPY-PXP O 4 SP-GND - 5 GND - 6 IPDCLK-P5P I/O 7 IPDDAT-P5P I/O 8 P5V - C.
Appendices Appendix C Pin Assignments C.15 PJ4200 IEEE 1394 interface connector (4-pin) Table C-15 IEEE 1394 interface connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 TPB0-P3N I/O 2 TPB0-P3P I/O 3 TPA0-P3N I/O 4 TPA0-P3P I/O C.16 PJ5500 LCD interface connector (40-pin) Table C-16 LCD interface connector (40-pin) Pin No.
Appendix C Pin Assignments Appendices C.17 PJ8800 DC-IN connector (4-pin) Table C-17 DC-IN connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 ADPDC - 2 ADPDC - 3 GND - 4 GND - C.18 PJ8810 1st Battery connector (10-pin) Table C-18 1st Battery connector (10-pin) Pin No.
Appendices Appendix C Pin Assignments C.21 PJ9500 SN board interface connector (40-pin) Table C-21 SN board interface connector (40-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.23 PJ5621 RG board interface connector (20-pin) Table C-23 RG board interface connector (20-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments SN Board C.25 PJ9510 SN board interface connector (40-pin) Table C-25 SN board interface connector (40-pin) Pin No.
Appendix C Pin Assignments Appendices C.27 PJ4600 USB0 interface connector (4-pin) Table C-27 USB0 interface connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 USBOPS-E5V I 2 USBP0-E3N I/O 3 USB0-E3P I/O 4 GND - C.28 PJ4601 USB1 interface connector (4-pin) Table C-28 USB1 interface connector (4-pin) Pin No.
Appendices Appendix C Pin Assignments C.32 PJ6000 Headphone connector (6-pin) Table C-32 Headphone connector (6-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 A-GND - 2 HEADL-PXP O 3 HEADR-PXP O 4 A-GND - 5 (SPKEN-P5P) I 6 NC - C.33 PJ9511 USB harness connector (8-pin) Table C-33 USB harness connector (8-pin) Pin No.
Appendix C Pin Assignments Appendices RG Board C.34 PJ5622 RG board interface connector (20-pin) Table C-34 RG board interface connector (20-pin) Pin No.
Appendices Appendix C Pin Assignments C-28 TECRA M2 Maintenance Manual (960-468) SW Board C.37 PJ9610 SW board interface connector (8-pin) Table C-37 SW board interface connector (8-pin) Pin No.
Appendix D Keyboard Scan/Character Codes Appendices Appendix D Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Code set 1 Code set 2 Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 29 | 2B AB 5D F0 5D *5 30 Caps Lock 3A.
Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 58 Ctrl 1D 9D 14 F0 14 *3 60 Alt (L) 38.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8.
Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Code set 1 Code set 2 Cap No. Key top Make Break Make Break 55 / E0 AA E0 35 E0 B5 E0 2A E0 F0 12 E0 4A E0 .
Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Code set 1 Code set 2 Cap No. Key top Make Break Make Break 75 INS E0 2A E0 52 E0 D2 E0 AA E0 12 E0 70 E0 F0 70.
Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Code set 1 Code set 2 Cap No. Key top Make Break Make Break 09 8 (8) 48 C8 75 F0 75 10 9 (9) 49 C9 7D F0 7D 11 .
Appendices Appendix D Keyboard Scan/Character Codes D-8 TECRA M2 Maintenance Manual (960-468) Table D-7 No.126 key scan code Code set 1 Code set 2 Key top Shift Make Make Pause Co mm o n * E1 1D 45 E1 9D C5 E1 14 77 E1 F0 14 F0 77 Ctrl* E0 46 E0 C6 E0 7E E0 F0 7E *: This key generates only make codes.
Appendix E Key Layout Appendices Appendix E Appendix E Key Layout E.1 United Kingdom (UK) Keyboard Figure E-1 UK keyboard E.2 United States (US) Keyboard Figure E-2 US keyboard TECRA M2 Maintenance Ma.
Appendices Appendix E Key Layout E-2 TECRA M2 Maintenance Manual (960-468).
Appendix F Wiring diagrams Appendices Appendix F Appendix F Wiring diagrams F.1 Parallel Port Wraparound Connector Figure F-1 Parallel port wraparound connector F.
Appendices Appendix F Wiring diagrams F-2 TECRA M2 Maintenance Manual (960-468) F.3 RS-232C Cable (9-pin to 9-pin) Figure F-3 RS-232C cable (9-pin to 9-pin) F.
Appendix G BIOS rewrite procedures Appendices Appendix G Appendix G BIOS rewrite procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk for the com puter that has renewed BIOS data.
Appendices Appendix G BIOS rewrite procedures G-2 TECRA M2 Maintenance Manual (960-468).
Appendix H EC/KBC rewrite procedures Appendices Appendix H Appendix H EC/KBC rewrite procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: BIOS/EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1.
Appendices Appendix H EC/KBC rewrite procedures H-2 TECRA M2 Maintenance Manual (960-468).
Appendix I Reliability Appendices Appendix I Appendix I Reliability The following table shows MTBF (Mean Time Between Failures). Table I-1 MTBF Time (hours) MTBF 5,133.
Appendices Appendix I Reliability I-2 TECRA M2 Maintenance Manual (960-468).
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