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1 Toshiba Personal Computer Satellite A10/TECRA A1/ Satellite Pro A10 (not released in U.S.) Maintenance Manual TOSHIBA CORPORATION File Number 960-445.
Copyright © 2003 by Toshiba Corporation. All rights reserved. Under the cop yright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the in formation contai ned herein.
Photo CD is a trademark of Eastm an Kodak Satellite A10/TECRA A1/Sa tellite Pro A10 Maintenan ce Manual (960-445) iii.
Preface This maintenance manual describes how to pe rform hardware service maintenance for the Toshiba Personal Computer Satellite A10/TECRA A1/Satellite Pro A10. NOTE: This Satellite A10/TECRA A1/Satelli te Pro A10 is a BTO-support personal computer.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the Satellite A10/TEC RA A1/Satellite Pro A10 system unit and each FRU.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronym s are enclosed in parentheses following their definition.
Table of Contents Chapter 1 Hardware Overview 1.1 Features .................................................................................................................. .... 1-1 1.2 System Block Diagram ...........................................
2.12 LAN Troubleshooting .............................................................................................. 2-53 2.13 Sound Troubleshooting ............................................................................................ 2-54 2.
Chapter 4 Replacement Procedures 4.1 Overview ................................................................................................................... .4 - 1 4.2 Battery Pack/PC Card .........................................................
Appendices Appendix A Handling the LCD Module ........................................................................ A-1 Appendix B Board Layout ............................................................................................. B-1 Appendix C Pin Assignment .
Satellite A10/TECRA A1/Sa tellite Pro A10 Maintenance Man ual (960-445) xi.
Chapter 1 Hardware Overview.
1 Hardware Overview 1 Hardware Overview 1-ii Satellite A10/TECRA A1/Sa tellite Pro A10 Maintenan ce Manual (960-445).
1 Hardware Overview Chapter 1 Contents 1.1 Features .................................................................................................................. .... 1-1 1.2 System Block Diagram ..................................................
1 Hardware Overview 1-iv Satellite A10/TECRA A1/Sa tellite Pro A10 Maintenance Man ual (960-445) Figures Figure 1-1 Front of the computer and the system units configuration ............................ 1-4 Figure 1-2 System block diagram .............
1.1 Features 1 Hardware Overview 1 Features 1.1 Features The Satellite A10/TECRA A1/Satellite Pro A10 is a high perform ance all-in-one PC running a Pentium 4 or Celeron processor. There are five models of Satellite A10/TE CRA A1/Satellite Pro A10 according to the combination of CPU and LCD.
1 Hardware Overview 1.1 Features Memory Two DDR266 SO-DIMM slots. Memory modul es can be installed to provide a maximum of 1GB. Memory modules are available in 128MB, 256MB and 512MB sizes. VRAM The computer has VGA imbedded in North Bridge and VRAM in 16-64MB.
1.1 Features 1 Hardware Overview Battery The RTC battery is mounted inside the computer. The main battery is a detachable lithium ion battery (3,600mAh: Li-Ion, 6cell o r 4,400mAh: Li-Ion, 6cell). USB (Universal Serial Bus) The computer has two USB ports which support USB2.
1 Hardware Overview 1.1 Features Figure 1-1 shows the front of the comput er and the system units configuration. PJ1440 PJ1420 Optical driv e PJ1800 PJ8800 Wireless LAN an tenna (left) Wireless LAN an.
1.2 System Block Diagram 1 Hardware Overview 1.2 System Block Diagram Figure 1-2 shows the system block diagram. Exp.Memo ry 128/256/ 512MB Exp.Mem ory 128/256/ 512MB CD-ROM, DVD-ROM, Combo, Combo+2, .
1 Hardware Overview 1.2 System Block Diagram The PC contains the following components. CPU Intel ® Mobile Pentium ® 4-M model • 1.80/1.90/2.00/2.
1.2 System Block Diagram 1 Hardware Overview Chipset This gate array has the following elements and functions. • North Bridge (Intel Montara-GML) − CPU interface and controller − Host bus su.
1 Hardware Overview 1.2 System Block Diagram VGA controller Imbedded in North Bridge Super I/O (SMSC-made LPC-47N259) • FDC (765B FDC) • Parallel port control (PS/2 bi-directional compatib.
1.3 3.5-inch USB Floppy Disk Drive 1 Hardware Overview 1.3 3.5-inch USB Floppy Disk Drive This compact, lightweight and high-reliabil ity FDD can be used with 720KB, 1.2MB and 1.44MB floppy disks. Figure 1-3 shows the 3.5-inch FDD. Table 1-2 lists the specifications.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive 1.4 2.5-inch Hard Disk Drive The computer has a compact, high-capacity HD D with a height of 9.5 mm. The HDD contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-4 shows a view of the 2.5-inch HDD and Tables 1-3 and 1-4 list the dimensions and specifications.
1.4 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-3 2.5-inch HDD dimensions (3/3) Standard HITACHI Item G8BC000 0F210 G8BC0 000F310 G8B C0000F410 G8BC000 0F610 Width (mm) 70 Height (mm) 9.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive Table 1-4 2.5-inch HDD Specifications (2/3) Specifications Item IBM G8BC0000Z3 10 G8BC0000Z4 10 G8BC0000Z 610 Storage size (formatted) 30GB 40GB 60GB R.
1.5 CD-ROM Drive 1 Hardware Overview 1.5 CD-ROM Drive The CD-ROM drive accommodates either 12 cm ( 4.72-inch) or 8 cm (3.1 5-inch) CD. It is a high-performance drive that reads at ma ximum 24-speed (3,600 KB per second). The CD-ROM drive is shown in Figure 1-5.
1 Hardware Overview 1.6 DVD-ROM Drive 1.6 DVD-ROM Drive The DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CD- R/RW and DVD. It is a high-performance driv e that reads DVD at maximum 8-speed, and reads CD at maximum 24-speed (3,600 KB per second).
1.6 DVD-ROM Drive 1 Hardware Overview Table 1-6 DVD-ROM drive dimensions (1/2) Specifications Toshiba G8CC0000R810 Item DVD-ROM CD-ROM DVD-RAM Burst data transfer rate (MB/s) 16.
1 Hardware Overview 1.7 Combo Drive 1.7 Combo Drive The Combo drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CD- R/RW and DVD. It is a high-performance driv e that reads DVD at m aximum 8-speed, and reads CD at maximum 24-speed (3,600 KB per second).
1.7 Combo Drive 1 Hardware Overview Table 1-7 Combo drive specifications (2/5) Specifications Item TEAC G8CC0000Q810 For read (CD-ROM) 1,545 to 3,600 KB/sec.
1 Hardware Overview 1.7 Combo Drive Table 1-7 Combo drive specifications (4/5) Specifications Item TEAC G8CC0001D810 For read (CD-ROM) 1,545 to 3,600KB/sec.
1.8 Combo+2 drive 1 Hardware Overview 1.8 Combo+2 drive The Combo+2 drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CD- R/RW and DVD. It is a high-performance driv e that reads DVD at m aximum 8-speed, writes DVD-R/-RW at 1-speed, and reads CD at maximum 24-speed (3,600 KB per second).
1 Hardware Overview 1.9 DVD Multi drive 1.9 DVD Multi drive The DVD Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CD- R/RW and DVD. It is a high-performance driv e that reads DVD at m aximum 8-speed, writes DVD-R/-RW at 1-speed, and reads CD at maximum 24-speed (3,600 KB per second).
1.10 Keyboard 1 Hardware Overview 1.10 Keyboard An 85(US)-/86(UK)- key (101 emulation) keybo ard is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-10 shows a view of the keyboard.
1 Hardware Overview 1.11 TFT Color Display 1.11 TFT Color Display The TFT color display has a 14.1-inch (XGA) or 15.0-inch (XGA, SXGA+) LCD module and the FL inverter board.
1.11 TFT Color Display 1 Hardware Overview Table 1-10 LCD module specificat ions (14.1-inch XGA TFT) (1/3) Specifications Item G33C00012210, G33C00013 110, G33C00014110, VF2093P01, VF2058P 01, VF2048P01, VF2062P01 Number of Dots 1,024(W) x 768(H) Dot spacing (mm) 0.
1 Hardware Overview 1.11 TFT Color Display 1.11.2 FL Inverter Board The FL inverter board supplies a high freque ncy current to illuminate the LCD module FL. Table 1-11 lists the FL inve rter board specifications. Table 1-11 FL inverter board specifications Item Specifications Voltage (V) DC5 Input Power (W) 7 Voltage (V) 750 Current (mA) 6.
1.12 Power Supply 1 Hardware Overview 1.12 Power Supply The power supply supplies 28 different voltages to the system board. The power supply microcontroller has the following functions. 1. Judges if the DC power supply (AC adap ter) is connected to the computer.
1 Hardware Overview 1.12 Power Supply Table 1-12 Power supply output rating Name Voltage [V] Name/Use PPV 1.30 - 1.00 CPU, Montara-GML, ICH4-M 1R5-C1V 1.5 Power 1.5V&1.2V 1R5-S1V 1.5 ICH4-M LAN1R5-E1V 1.5 ICH4-M (LAN) 1R5-P1V 1.5 Montara-GML, ICH4-M 1R2-P1V 1.
1.13 Batteries 1 Hardware Overview 1.13 Batteries The PC has the following two batteries. Main battery Real time clock (RTC) battery Table 1-13 lists the specifica tions for these two batteries. Table 1-13 Battery specifications Battery Name Batte ry Element Output Voltage Capacity G71C0002N210 G71C0002N110 lithium ion 10.
1 Hardware Overview 1.13 Batteries 1.13.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and dete cts a full charge when the AC adaptor and battery are connected to the computer.
1.13 Batteries 1 Hardware Overview 1.13.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory.
1 Hardware Overview 1.14 AC Adapter 1-30 Satellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445) 1.14 AC Adapter The AC adapter is used to charge the battery.
Chapter 2 Troubleshooting Procedures.
2 Troubleshooting Procedures 2 2-ii Satellite A10 /TECRA A1/Satellite Pro A10 Ma intenance Manual (960 -445).
2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart ...........................................
2 Troubleshooting Procedures 2.8 Display Troubleshooting .......................................................................................... 2-48 Procedure 1 Diagnostic Test Program Execution Check ......................... 2-48 Procedure 2 Connector and Cable Check.
2 Troubleshooting Procedures Figures Figure 2-1 Troubleshoo ting flowchart ............................................................................. 2-3 Figure 2-2 Printer port LED ..................................................................
2 Troubleshooting Procedures 2-vi Satellite A10 /TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ).
2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine which Fi eld Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU ” m eans the replaceable unit in the field.
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart 2.2 Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide fo r determining which troubleshooting procedure is executed. Before going through the flowchart steps, check the following: Make sure that Toshiba Windows ® 2000/XP-HE/XP-PRO is installed on the hard disk.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures Ye s T urn the Pow er Sw itch on. ST ART Connect th e AC adapt er to the DC IN socket. Perform the Power S upply T r oubleshootin g Proced ures in section 2.
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart Do typed chara cters appear corr ectly? 1 Perform the Keyboard T roubles hooting Proced ures in section 2.7. No Ye s Insert the diagnosti c disk int o FDD and run the di agnosti cs test pro gram.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an e rror, the problem may be intermittent. The Test program should be executed several tim es to is olate the problem.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 2.3 Power Supply Troubleshooting The power supply controller cont rols many functions and compone nts. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights green DC power is being supplie d from the AC adapter. Blinks orange Power supply malfunction *1 Doesn’t light Any condition other than those above.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 2 Error Code Check If the power supply microprocessor detects a ma lfunction, the DC IN icon blinks orange.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Main Battery Error code Meaning 21h Main battery charge current is over 6.60A. 22h Main battery discharge current is over 0.5A when there is no load. 23h Main battery charge current is over 3.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 1R5-C1V output (P62) Error code Meaning 60h 1R5-C1V voltage is over 1.80V wh en the computer is powered on/off. 61h 1R5-C1V voltage is 1.275V or less when the computer is powered on. 62h 1R5-C1V voltage is 1.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures E5V output Error code Meaning 90h E5V voltage is over 6.00V when the computer is powered on/off. 91h E5V voltage is 4.50V or less when the computer is powered on. 92h E5V voltage is 4.50V or less when the computer is booting up.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 1R25-B1V output Error code Meaning D0h 1R25-B1V voltage is over 1.50V when the computer is powered on/off. D1h 1R25-B1V voltage is 1.063V or le ss when the computer is powere d on. D2h 1R25-B1V voltage is 1.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Check 2 In the case of error code 10h or 12h: Make sure the AC adapter and AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If the cables are connected correctly, go to the following step: Connect a new AC adapter and AC power co rd.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 3 Connection Check The wiring diagram related to th e power supply is shown below: Ba tte ry p ac k Syste m Board Power Cor d AC adapter Any of the connectors may be disconnected.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 5 Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures .
2 Troubleshooting Procedures 2.4 System Board Troubleshooting 2.4 System Board Troubleshooting This section describes how to determine if the sy stem board is defective.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Procedure 1 Message Check When the power is turned on, the system perfor ms the Initial Reliability T est (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Check 3 The IRT checks the system board. When the IRT detects an erro r, the system stops or an error message appears. If one of the following error messages (1) th rough (17), (24) or (25) is displayed, go to Procedure 5.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Procedure 2 Printer Port LED Check on Boot Mode The printer port LED displays the IRT status and test status by turning lights on and off as an eight-digit binary value for boot mode . Figure 2-2 shows th e printer port LED.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting To use the printer port LED, follow the steps below: System Board PJ3202 Prin t er Port LED 1. Turn on the com puter’s power and set it to boot mode. 2. Turn off the computer’s power. 3.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 Printer port LE D boot mode status (1/8) LED Status Test item Contents Start Clear of software reset bit Prohibition of APIC Ini.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 Printer port LE D boot mode status (2/8) LED Status Test item Contents (B6H) (BIOS rewrite) Cancel of sound mute Setting of volume to max.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 Printer port LE D boot mode status (3/8) LED Status Test item Contents 01h Memory check DRAM type and size check (at Cold boot ).
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 Printer port LE D boot mode status (4/8) LED Status Test item Contents (03h) Forwa rds the area of C0000h to EFFFFh to PCI (proh.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 Printer port LE D boot mode status (5/8) LED Status Test item Contents 06h Saving memory configuration to buffer Reading of EC v.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 Printer port LE D boot mode status (6/8) LED Status Test item Contents 09h Task generation for waiting PnP resource making compl.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 Printer port LE D boot mode status (7/8) LED Status Test item Contents 11h SYS_MEM_CHECK Check of conventi onal memory (Cold boo.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 Printer port LE D boot mode status (8/8) LED Status Test item Contents (1Ch) (PRE_BOOT _SETUP) Updating of table for DMI Cop y o.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures NOTE: The printer port LED outputs the status of an item in which an error is occurred. If the printer port LED outputs “0Ch” and then halts, it indicates memory check of first 64KB is completed and an error occurred during initialization of vecto r.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Procedure 3 Printer Port LED Check on Suspend/Resume Mode The printer port LED displays the IRT status and error status by turning lights on and off as an eight-digit binary value afte r turning on of the power.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Printer port LED suspend mode error status (1/3) LED Status Test item Con tents Sets the parallel port to D0 state. 2Bh Release resources us ed for identificatio n of fingerprint.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Printer port LED suspend mode error status (2/3) LED Status Test item Con t ents 2Fh Resume error check in susp end mode. Checks if in IRT. Checks if external cards are conn ected (If PNP OS exists, does not check.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Printer port LED suspend mode error status (3/3) LED Status Test item Contents 36h Prohibition of PCI arbiter Setting of Wakeup .
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LED resume mode error status (1/4) LED Status Test item Contents 00h Refer to IRT printer LED error status. 01h Refer to IRT printer LED error status. 02h Refer to IRT printer LED error status.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Printer port LED resume mode error status (2/4) LED Status Test item Contents Control of permission/prohi bition for built-in LA.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LED resume mode error status (3/4) LED status Test item Contents 25h Recovery of each devic e(3) Recovery of COM regi ster Recovery of DMAC regist er PnP Resume processing 2 T urns the disabled HDD motor off.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Printer port LED resume mode error status (4/4) LED status Test item Contents Waiting for the completion of recover y of VGA reg.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting 2-38 Satellite A10/TECRA A1/Sa tellite Pro A10 Maintenan ce Manual (960-445) Procedure 4 Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board.
2.5 3.5” FDD Troubleshooting 2 Troubleshooting Procedures 2 2.5 3.5” FDD Troubleshooting This section describes how to determine if the 3.5” FDD is functioning properly. Perform the steps below starting with Procedure 1 and con tinuing with the other pr ocedures as required.
2 Troubleshooting Procedures 2.5 3.5” FDD Troubleshooting Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, tu rn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more inform ation about th e diagnostics test procedures.
2.5 3.5” FDD Troubleshooting 2 Troubleshooting Procedures Procedure 3 Connector Check and Replacement Check The USB connector may be disconnected from the system board. Check visually that the connector is connected firmly. Check 1 Make sure the following cable and conn ector are firmly connected to the system board.
2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting 2.6 2.5” HDD Troubleshooting This section describes how to determine if the 2.5” HDD is functioning properly. Perform the steps below starting with Procedure 1 and con tinuing with the other pr ocedures as required.
2.6 2.5” HDD Troubleshooting 2 Troubleshooting Procedures Procedure 2 Message Check When the power is turned on, the system perfor ms the Initial Reliability T est (IRT) installed in the BIOS ROM. When the test detects an erro r, an error message is displayed on the screen.
2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting Procedure 3 Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To fo rmat the HDD, start with Check 1 below and perform the other steps as required.
2.6 2.5” HDD Troubleshooting 2 Troubleshooting Procedures Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnosti cs Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program.
2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting Procedure 5 Connector Check and Replacement Check The HDD is connected to the connector of th e system board.
2.7 Keyboard Troubleshooting 2 Troubleshooting Procedures 2.7 Keyboard Troubleshooting To determine if the computer’s keyboard is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedures 2.8 Display Troubleshooting 2.8 Display Troubleshooting This section describes how to determine if th e computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2.8 Display Troubleshooting 2 Troubleshooting Procedures Procedure 3 Replacement Check The display unit has an FL i nverter board, Display module, System board, LCD harness and Display ON/OFF switch.
2 Troubleshooting Procedures 2.9 Touch Pad Troubleshooting 2.9 Touch Pad Troubleshooting To determine whether the Touch Pad is faulty or not, perform the following procedures: Procedure 1: Diagnostic .
2.10 Optical Drive Troubleshooting 2 Troubleshooting Procedures 2.10 Optical Drive Troubleshooting To check if the optical drive (CD-ROM, DVD-ROM, Combo, Com bo+ 2 or DVD Multi drive) is defective or malfunctioning, follow the troubleshooting procedures below as instructed.
2 Troubleshooting Procedures 2.11 Modem Troubleshooting 2.11 Modem Troubleshooting To check if the modem is defective or malf unctioning, follow the troubleshooting procedures below as instructed.
2.12 LAN Troubleshooting 2 Troubleshooting Procedures 2.12 LAN Troubleshooting To check if the computer’s LAN is defec tive or malfunctioning, follow the troubleshooting procedures below as instructed.
2 Troubleshooting Procedures 2.13 Sound Troubleshooting 2.13 Sound Troubleshooting To check if the sound function is defectiv e or malfunctioning, follow the troubleshooting procedures below as instructed.
2.13 Sound Troubleshooting 2 Troubleshooting Procedures Procedure 3 Replacement Check Check 1 The speaker may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem persists, perform Check 2. Check 2 The system board may be faulty.
2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting 2.14 Wireless LAN Troubleshooting This section describes how to determine if the computer's W i reless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.14 Wireless LAN Troubleshooting 2 Troubleshooting Procedures Procedure 2 Antennas' Connection Check The wireless LAN function-wiri ng diagram is shown below: A ntenna C able Wireless LAN Antenna (R ight) Wireless LAN Antenna (Lef t) Mini PCI System Bo ard PJ2200 Any of the connections may be disconnected.
2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting Procedure 3 Antenna Check Check 1 Use an antenna test cable to check the antennas' connection. Follow the steps below: 1. Remove the Mini PCI slot cover and lift it off. Refer to Chapter 4, Replacement Procedures , for detailed steps of disassembling.
2.14 Wireless LAN Troubleshooting 2 Troubleshooting Procedures Procedure 4 Replacement Check The Mini PCI card and the system board are connected. Any of these components may be damaged.
2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting 2-60 Satellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445).
Chapter 3 Tests and Diagnostics.
3 Tests and Diagnostics 3 3-ii Satellite A10/TECRA A1/Sa tellite Pro A10 Maintenan ce Manual (960-445).
3 Tests and Diagnostics Chapter 3 Contents 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ..............................................
3 Tests and Diagnostics 3-iv Satellite A10/TECRA A1/Sa tellite Pro A10 Maintenance Man ual (960-445) 3.24 Running Test ............................................................................................................ 3 -58 3.24.1 Function Description .
3.1 The Diagnostic Test 3 Tests and Diagnostics 3 Tests and Diagnostics 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test program to test the functions of the computer’s hardware modules. The Diagnostic Program s are stored on the Diagnostic Disks.
3 Tests and Diagnostics 3.1 The Diagnostic Test You will need the following equipment to perform som e of the Diagnostic test programs. The Diagnostic Disks (three disks for all tests (T&D for.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3.2 Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Turn off the computer and connect a USB FDD to the computer. Insert the Diagnostics disk (No.1) in the floppy disk drive.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test To execute the DIAGNOSTIC TEST MENU from the DIAGNOSTICS MENU, set the highlight bar to 1 , and press Enter . The following DIAGNOSTIC TEST MENU will appear: TOSHIBA Personal Computer XXXXXX DIAGNOSTICS version X.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 4. Select the option you want to execute and press Enter . When you select 1- SYSTEM TEST , the following message will appear: SYSTEM TEST NAME XXXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Use the up and down arrow keys to move the cursor to “ ERROR STOP ”. Use the right and left arrow keys to move the cursor to the desired option and press Enter .
3.3 Subtest Names 3 Tests and Diagnostics 3.3 Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No.
3 Tests and Diagnostics 3.3 Subtest Names Table 3-1 Subtest names (2/2) No. Test Name Subtest No. Subtest Name 7 ASYNC 01 02 03 04 06 07 Wraparound (board) Point to point (send) Point to point (receiv.
3.4 System Test 3 Tests and Diagnostics 3.4 System Test To execute the System Test, select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3 Tests and Diagnostics 3.4 System Test Subtest 07 DMI read The information in the Flash-ROM is displayed in the following f ormat. *** DMI Data Display Ver X.
3.4 System Test 3 Tests and Diagnostics Subtest 10 CPU Temperature This subtest checks the CPU temperature. When the subtest starts, the following message appears on the display. Enter the ambient Celsius temperature. EXT. TEMP = When the temperature is entered, test program turns off the screen message.
3 Tests and Diagnostics 3.5 Memory Test 3.5 Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3.5 Memory Test 3 Tests and Diagnostics Subtest 05 L2 Cache Memory To test the L2 cache memory, a pass-through write-read com parison of ‘5A’ data is run repeatedly to the test area (‘7000’:’Program’ size to ‘7000’:’7FFF’ (32 KB)) to check the hit-miss ratio (on/off status) for L2 cache mem ory.
3 Tests and Diagnostics 3.6 Keyboard Test 3.6 Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Keyboard test contains some subtests that test the computer’s keyboard and Touch pad actions.
3.6 Keyboard Test 3 Tests and Diagnostics Subtest 03 PS/2 Mouse Connect Check NOTE : 1. The touch pad and the PS/2 mouse cannot be tested simultaneously. Select the PS/2 mouse in the SETUP setting. 2.To execute the PS/2 mouse connect check, a PS/2 mouse must be connected to the computer before the power is turned on.
3 Tests and Diagnostics 3.6 Keyboard Test * **** IP S TEST PROG RAM ( Vx.xx) **** * <POINTI NG> < PARAME TER> S T A T U S : 0 0 0 0 h ■■ X - R A T E : 0 0 0 0 h ■■■■ Y - R A T .
3.6 Keyboard Test 3 Tests and Diagnostics Subtest 06 USB ( Port2,Port3 ) test This subtest checks USB. The USB TEST Module (ZD0003P01) and USB Cable (ZD0003P02) must be connected to the computer. The following message will appear. Select a port to test and press Enter .
3 Tests and Diagnostics 3.7 Display Test 3.7 Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Display test contains subtests that test the display in various modes.
3.7 Display Test 3 Tests and Diagnostics Subtest 04 Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter .
3 Tests and Diagnostics 3.7 Display Test Subtest 06 “H” Pattern Display This subtest displays a full screen of “H” patterns. HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHH.
3.8 Floppy Disk Test 3 Tests and Diagnostics 3.8 Floppy Disk Test NOTE : Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. Otherwise, the contents of the floppy disk will be erased.
3 Tests and Diagnostics 3.8 Floppy Disk Test Subtest 01 Sequential read This subtest performs a Cyclic Redundancy Check (CRC) that continuously reads all the tracks (track: 0 to 39/0 to 79) on a floppy disk. The start track is specified at the start of the FDD test.
3.9 Printer Test 3 Tests and Diagnostics 3.9 Printer Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Printer Test contains subtests that test the output of the printer connected to the computer.
3 Tests and Diagnostics 3.9 Printer Test Subtest 02 Function This subtest is for IBM compatible printers, and tests the following f unctions: Normal print Double-width print Compressed print Emphasize.
3.10 Async Test 3 Tests and Diagnostics 3.10 Async Test NOTE: This test can not be executed since the computer is not equipped with a serial port and FIR port. The FIR port will be equipped in a succeeding model of this computer. NOTE: The subtests 01 to 04 are not be supported since the computer has no serial port.
3 Tests and Diagnostics 3.10 Async Test NOTE : To execute this subtest, an RS-232C wraparound connector must be connected to the RS-232C port. The RS-232C wraparound connector wiring diagram is described in Appendix F. This subtest checks the data send/receive function through the wraparound connector.
3.10 Async Test 3 Tests and Diagnostics Subtest 02 Point to point (Send) NOTE : To execute this subtest, two machines must be connected with an RS-232C direct cable. One machine should be set as “send”(subtest 02) and the other set as “receive” (subtest 03).
3 Tests and Diagnostics 3.11 Hard Disk Test 3.11 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter , and follow the directions on the screen. The hard disk test contains subtests that test the hard disk drive functions.
3.11 Hard Disk Test 3 Tests and Diagnostics 4. Select the number of the subtest you want to execute and press Enter . The following message will appear.
3 Tests and Diagnostics 3.11 Hard Disk Test Subtest 04 Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder (to check the data interference in the neighbor track) to compare.
3.12 Real Timer Test 3 Tests and Diagnostics 3.12 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The real timer test contains subtests that test the computer’s real timer functions.
3 Tests and Diagnostics 3.12 Real Timer Test Subtest 03 Real time carry CAUTION : When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments. Make sure the date and time are displayed in the following format and they m ove forward correctly.
3.13 NDP Test 3 Tests and Diagnostics 3.13 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The NDP test contains one subtest that tests the computer’s NDP functions. Move the highlight bar to the subtest you want to execute and press Enter .
3 Tests and Diagnostics 3.14 Expansion Test 3.14 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3.14 Expansion Test 3 Tests and Diagnostics Subtest 03 RGB monitor ID test Connect a CRT monitor to the computer for the test of ID acquisition. To check whether the ID is acquired or not is judged by the data from the monitor. Therefore, this test will fail when it is perform ed in simultaneously display mode or panel display mode.
3 Tests and Diagnostics 3.15 CD-ROM/DVD-ROM Test 3.15 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM Test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The CD-ROM/DVD-ROM Test contains subtests that test the modem functions.
3.16 LAN Test 3 Tests and Diagnostics 3.16 LAN Test To execute the LAN test, select 14-LAN TEST from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3 Tests and Diagnostics 3.17 Sound/LAN/Modem Test 3.17 Sound/LAN/Modem Test To execute the Sound/LAN/Modem Test, use the Diagnostics disk (No.2). Finish the tests of the Diagnostics disk (No.1) by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU.
3.17 Sound/LAN/Modem Test 3 Tests and Diagnostics Subtest 01 Microphoned recording & play This subtest checks the function of the CODEC A/D D/A converter. Both the microphone and headphone terminals can be checked at the sam e time. Before executing this subtest, connect an external microphone to the computer.
3 Tests and Diagnostics 3.17 Sound/LAN/Modem Test When the subtest is executed, the following message appears. ....Press test number[1-4] ? pause Press any key to continue... Press any key, and the following message appears. Then sin wave is expanded from 16KB to 64KB data and is played.
3.17 Sound/LAN/Modem Test 3 Tests and Diagnostics Subtest 03 Modem Test For this subtest, connect the modem PCB and RJ11 connector with a harness. This subtest contains the following tests. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests.
3 Tests and Diagnostics 3.18 Wireless LAN Test (Agere) 3.18 Wireless LAN Test (Agere) This section describes how to perform the Agere wireless LAN transmitting-receiving test with the test program. NOTE: Use another computer (with Agere wireless LAN card) that can communicate by the wireless LAN as a reference machine to perform this test.
3.18 Wireless LAN Test (Agere) 3 Tests and Diagnostics Subtest 01 Transmit & Receive test This sub test checks transmit and receive functions. Transmit test Press 1 to select the test and press Enter in the target machine as a responder.
3 Tests and Diagnostics 3.18 Wireless LAN Test (Agere) When the machine has passed the test, “OK” m essage will appear in the test machine. Then press Enter in the target machine; the “OK” me ssage will appear also in the target machine. Press Enter to return to the main menu.
3.18 Wireless LAN Test (Agere) 3 Tests and Diagnostics Press 0 to select the test and press Enter in the target machine. The following message will appear: ############################################################## #### Wireless LAN sub system repair test VX.
3 Tests and Diagnostics 3.18 Wireless LAN Test (Agere) Subtest 02 Mac Address test This subtest reads MAC Address. If there is no problem, the “OK” message will appear. Subtest 03 Wireless LAN (WEP64/128) test This subtest reads the WEP of the wireless LAN card installed in the target machine.
3.19 Wireless LAN Test (Atheros) 3 Tests and Diagnostics 3.19 Wireless LAN Test (Atheros) This section describes how to perform the wireless LAN transmitting-receiving test with the test program. NOTE: Use another computer (with Atheros wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform this test.
3 Tests and Diagnostics 3.19 Wireless LAN Test (Atheros) Setting the responder machine NOTE: Release the write-protection of the floppy disk for the test. Insert a floppy disk containing the test program into the floppy disk drive of the responder machine and turn on the responder machine.
3.19 Wireless LAN Test (Atheros) 3 Tests and Diagnostics Satellite A10/TECRA A10/Satellite Pro A10 Maintenance Manual (960-445) 3-49 When the tester machine has passed the test, "OK" m essage will appear in the tester machine. Press Enter to return to the main menu.
3.20 Error Code and Error Status Names 3 and Diagnostics 3 and Diagnostic 3.20 Error Code and Error Status Names s Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3.20 Error Code and Error Status Names 3 and Diagnostics Table 3-2 Error codes and error status names (2/3) Device name Error code Error status name FDD 01 02 03 04 06 08 09 10 20 40 60 80 EE Bad Comm.
3 and Diagnostics 3.20 Error Code and Error Status Names DA No HDD 3-52 Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445).
3.20 Error Code and Error Status Names 3 and Diagnostics Table 3-2 Error codes and error status names (3/3) Device name Error code Error status name PCMCIA C1 C4 C5 C6 C7 C8 CB CD CE CF ADDRESS LINE E.
3 and Diagnostics 3.21 Hard Disk Test Detail Status 3.21 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXX Detailed information about the hard disk test error is displayed on the screen by a four-digit number.
3.21 Hard Disk Test Detail Status 3 and Diagnostics Table 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” Not used “1” A bad block mark is detected. 6 UNC (Uncorrectable) “0” There is no uncorrectable data error.
3 and Diagnostics 3.22 FDD Cleaning 3.22 FDD Cleaning 3.22.1 Function Description This function cleans the heads in the 3.5-inch FDD by executing a series of head load/seek and read operations. A cleaning disk is necessary to perform this program. 3.22.
3.23 Log Utilities 3 and Diagnostics 3.23 Log Utilities 3.23.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a display or a printer.
3 and Diagnostics 3.23 Log Utilities 2. The error information displayed on the screen can be manipulated by the following number keys: The 1 key scrolls the display to the next page. The 2 key scrolls the display to the previous page. The 3 key returns to the Diagnostic Menu.
3.24 Running Test 3 and Diagnostics 3.24 Running Test 3.24.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01,02,04,06) 3. Real timer test (subtest 02) 4.
3 and Diagnostics 3.24 Running Test 4. Select Yes or No and press Enter . The following message will appear: Mount the work disk(s) on the drive(s), then press [Enter] key. [Warning : The contents of the disk(s) will be destroyed] 5. This program is executed continuously.
3.25 Floppy Disk Drive Utilities 3 and Diagnostics 3.25 Floppy Disk Drive Utilities 3.25.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE : This program is only for testing a floppy disk drive.
3 and Diagnostics 3.25 Floppy Disk Drive Utilities 3.25.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 - FORMAT 2 - COPY 3 - DUMP 4 - HDD-ID READ 9 - EXIT TO DIAGNOSTICS MENU 2.
3.25 Floppy Disk Drive Utilities 3 and Diagnostics 3. COPY program (a) When COPY is selected, the following m essage appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Select a drive type number. Selecting 3:2HD will display a message similar to the one below.
3 and Diagnostics 3.25 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following m essage appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type number. If 2:HDD is selected , the display will go to step (h).
3.25 Floppy Disk Drive Utilities 3 and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5.
3 and Diagnostics 3.26 System Configuration 3.26 System Configuration 3.26.1 Function Description The System Configuration program contains th e following configuration information for the computer: 1. Processor Type 2. VGA Controller 3. MS-DOS Version 4.
3.26 System Configuration 3 and Diagnostics 3.26.2 Operations 1. Selecting 8 from the DIAGNOSTIC MENU and pressing Enter displays the following system configuration: System Configuration Display : Ver X.XX [Machine Name : XXXXXX] * - Processor Type = XXXXXXXX ** - VGA Controller = XXXXX * - MS-DOS Version = VX.
3 and Diagnostics 3.27 SETUP 3.27 SETUP 3.27.1 Function Description This program displays the current system setup inform ation as listed below: 1. Memory (a) Total 2. System Date/Time 3. Battery 4. Password 5. Boot Priority (a) Boot Priority (b) HDD Priority (a) Network Boot Protocol 6.
3.27 SETUP 3 and Diagnostics 14. LEGACY Emulation 15. PCI LAN 3.27.2 Accessing the SETUP Program Selecting 0 from the DIAGNOSTICS MENU and pressing Enter displays the followings: Satellite A10/TECRA A.
3 and Diagnostics 3.27 SETUP Boot Prio rity =HDD → FD D → CD-R OM → LAN HDD Pri ority =Built-in HDD → PC Card Network Boot Pr otocol = PXE Tota l = XXXXX KB (* 1) MEMORY Not Re gist ered Powe .
3.27 SETUP 3 and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn + ↑ ( PgUp) and Fn + ↓ ( PgDn) to move between the two pages.
3 and Diagnostics 3.27 SETUP SETUP Options The SETUP screen is divided into 15 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s mem ory. (a) Total This field displays the total amount of mem ory installed and is automatically calculated by the computer.
3.27 SETUP 3 and Diagnostics NOTE: In boot mode, the System Auto Off (*1) item does not appear. Display of the LCD Brightness will be changed in the condition below: (*2) Operating the battery (*3) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS .
3 and Diagnostics 3.27 SETUP HDD Auto Off Use this option to set the duration of the HDD automatic power off function. xx Min. Automatically turns off the power to the hard disk drive if it is not used for the duration set. The duration xx can be set to 1 , 3 , 5 , 10 , 15 , 20 or 30 minutes.
3.27 SETUP 3 and Diagnostics 4. Password This option sets or resets the user password for power on and instant security ( Fn+F1 ). Registered The user password has been registered. Not registered The user password has not been registered. For details on setting the user password, refer to the User’s Manual.
3 and Diagnostics 3.27 SETUP (c) Network Boot Protocol Use this option to set the starting method via a network. PXE Sets to PXE protocol. (Default) R P L Sets to RPL protocol. 6. Display This group of options configures the computer’s display. (a) Power On Display This option is used to select the display when booting up.
3.27 SETUP 3 and Diagnostics 7. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) Power-up Mode Use this option to choose between resume and boot mode. This potion can also be set by hotkeys.
3 and Diagnostics 3.27 SETUP (e) Auto Power On This option shows the setting for the Auto Power On function and Wake-up LAN function. Disabled Parameters for the Auto Power On function and Wake- up LAN function are set. (Default) Enabled Parameters for the Auto Power On function and Wake- up LAN function are not set.
3.27 SETUP 3 and Diagnostics NOTE: 1. Do not remove the AC adaptor and battery pack at the same time when you use this feature. If you do so, data saved by the resume function will be lost.
3 and Diagnostics 3.27 SETUP 9. I/O ports This option controls settings for the parallel port. NOTE: Do not assign the same interrupt request level and I/O address to the serial port and PC card. (a) Parallel This option sets the interrupt request level and I/O port base address for the parallel port.
3.27 SETUP 3 and Diagnostics 10. Drives I/O This option displays the address and interrupt level for the hard disk drive, CD/DVD- ROM drive and PC card. It is for information only and cannot be changed. Built-in HDD The setting for the built-in HDD is displayed.
3 and Diagnostics 3.27 SETUP (b) Parallel Port Mode Use this option to set information of ECP and Standard Bi-directional. ECP Sets the port mode to Extended Capabilities Port (ECP). For most printers, the port should be set to ECP. (Default) Std. Bi-Direct.
3.27 SETUP 3 and Diagnostics Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445) 3-83 (b) USB-FDD Legacy Emulation This option sets the Legacy support condition of the USB floppy disk drive. Enabled Enables LEGACY support. (Default) USB floppy disk is available without the driver.
Chapter 4 Replacement Procedures.
4 Replacement Procedures 4 4-ii Satellite A10/TECRA A1/Sa tellite Pro A10 Maintenan ce Manual (960-445).
4 Replacement Procedures Chapter 4 Contents 4.1 Overview ................................................................................................................... .4 - 1 Safety Precautions ....................................................
4 Replacement Procedures 4.18 Fluorescent Lamp..................................................................................................... 4-64 4.18.1 Replacing the 14.1 Inch XGA TMD Fluorescent Lamp ..........................................
4 Replacement Procedures Figures Figure 4-1 Removing Battery Cover..................................................................................... 4-8 Figure 4-2 Removing Battery Pack...............................................................
4 Replacement Procedures Figure 4-30 Removing FI R Dummy Cover ........................................................................ 4-44 Figure 4-31 Removing BAT LOCK ASSY ........................................................................ 4-46 Figure 4-32 Removing HDD UPPER ASSY .
4 Replacement Procedures Figure 4-153 to 4-177 Replacing 15.0 Inch Shar p fluorescent lamp (SXGA+) (1) to (25) ........................................
4 Replacement Procedures 4-viii Satellite A10/TECRA A1/Satellite Pro A10 Ma intenance Manual (960-4 45).
4.1 Overview 4 Replacement Procedures 4 4.1 Overview This chapter describes the procedure for rem oving and replacing the fi eld replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to whic h other FRUs must be removed before a particular FRU can be removed.
4 Replacement Procedures 4.1 Overview Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions w hile working on the computer. Danger: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba.
4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before star ting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.
4 Replacement Procedures 4.1 Overview Disassembly Procedures Three main types of cable connector are used. Pressure plate connector Spring connector Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cab le out from the connect or.
4.1 Overview 4 Replacement Procedures Assembly Procedure After the computer has been disassembled and th e part that caused the fault has been repaired or replaced, the computer must be reassem bled. Take note of the following general points when assembling the computer.
4 Replacement Procedures 4.1 Overview Screw Tightening Torque Use the following torque when tightening screws. CAUTION : Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage.
4.1 Overview 4 Replacement Procedures Screw Notation To make maintenance of the co mputer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body.
4 Replacement Procedures 4.2 Battery Pack/PC Card 4.2 Battery Pack/PC Card 4.2.1 Battery Pack Removing the battery pack The following describes the procedure for rem oving the battery pack (See Figure 4-1, 4-2). CAUTION: Take care not to short circuit the te rminals when removing the battery pack.
4.2 Battery Pack/PC Card 4 Replacement Procedures 1. Push the latches on the back of the ba ttery cover and remove the battery pack. NOTE : For environmental reasons, do not throw away a spent battery pack.
4 Replacement Procedures 4.2 Battery Pack/PC Card Installing the battery pack The following describes the procedure for reinsta lling the battery pack (See Figure 4-1, 4-2). CAUTION: There is a danger that the lithium io n battery pack may explode if not fitted, operated, handled, or disposed correctly.
4.2 Battery Pack/PC Card 4 Replacement Procedures 4.2.2 PC Card Removing the PC card The following describes the procedure for removing a PC card (See Figure 4-3). CAUTION: Insert or remove the PC card in accordance with any instructions in the PC card manual or the manuals of the computer system you are using.
4 Replacement Procedures 4.3 Memory Module 4.3 Memory Module CAUTION: The power of the computer must be turned off when you remove the memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module termi nals.
4.3 Memory Module 4 Replacement Procedures 4. Open the left and right latche s and remove the memory module. Latch Memory Module SLOT A: Standa rd Memory Latch SLOT B: Expansi on Memor y Figure 4-5 Removing Memory Module Installing the memory module To install the memory module, confirm that the computer is in boot m ode .
4 Replacement Procedures 4.4 HDD 4.4 HDD Removing the HDD The following describes the procedure for rem oving an HDD (See Figure 4-6 to 4-8). CAUTION: Take care not to press on the top or bottom of the HDD. Pressure may cause data loss or damage to the device.
4.4 HDD 4 Replacement Procedures 3. Remove the following screw fixing the HDD ASSY. • M2.5x5 THIN BIND screw x1 4. Pull the tab of the HDD holder from the inside of the computer. 5. Hold the HDD tab and pull out the HDD A SSY in the direction indicated by the arrow.
4 Replacement Procedures 4.4 HDD 6. Remove the following screws fixing the HDD. • M3x4 THIN BIND screw x4 7. Remove the HDD holder from the HDD. THIN B IND M3x4 HDD Holder HDD Figure 4-8 Removing HD.
4.4 HDD 4 Replacement Procedures Installing the HDD The following describes the procedure for in stalling an HDD (See Figure 4-6 to 4-8). 1. Install the HDD to the HDD holder with the following screws. • M3x4 THIN BIND screw x4 2. Insert the HDD ASSY into the HDD slot.
4 Replacement Procedures 4.5 MDC Modem 4.5 MDC Modem Removing the MDC Modem The following describes the procedure for rem oving an MDC modem (See Figure 4-9). CAUTION : The power must be turned off when you remove the MDC modem. Removing an MDC modem with the power on risks damagi ng the modem or the computer itself.
4.5 MDC Modem 4 Replacement Procedures Installing the MDC Modem The following describes the procedure for in stalling an MDC m ode m (See Figure 4-9). 1. Connect the MDC jack cable to JP1 on the MDC modem. 2. Set the MDC modem on the slot and c onnect the MDC m odem to the connector PJ3000 on the system board by pressing it from the top.
4 Replacement Procedures 4.6 Mini PCI Card 4.6 Mini PCI Card CAUTION: (1) The power must be turned off when y ou remove a mini PCI card. Removing a mini PCI card with the power on risks damagi ng the card or the computer itself. (2) Never press hard or bend the mini PCI card.
4.6 Mini PCI Card 4 Replacement Procedures 3. Remove the glass tape and disconnect two wireless LAN cables from JP1 and JP2 on the mini PCI card. 4. Open the left and right latches holding the mini PCI card and remove the m ini PCI card.
4 Replacement Procedures 4.7 Fan Module/Cooling Fin/CPU 4.7 Fan Module/Cooling Fin/CPU NOTE: If silicon grease has already been ap plied to the CPU and fan module, wipe clean with a cloth and apply new silicon grease . The computer will not operate cor rectly if the CPU is not firmly in contact with the fan module.
4.7 Fan Module/Cooling Fin/CPU 4 Replacement Procedures 2. Remove the following screws fixing the fan module. • M2.5x5 THIN BIND screw x2 3. Lift up the fan module and disconnect th e fan module cable from the PJ8770 on the system board. PJ8770 Fan Mo dule M2.
4 Replacement Procedures 4.7 Fan Module/Cooling Fin/CPU 4. Remove the following screws securing th e CPU holder in the opposite order of the marks (1 to 4) on the CPU holder.
4.7 Fan Module/Cooling Fin/CPU 4 Replacement Procedures 5. Lift up the cooling fin in the direction indica ted by the arrow and remove the cooling fin.
4 Replacement Procedures 4.7 Fan Module/Cooling Fin/CPU Installing the Fan M odule/Cooling Fin/CPU The following describes the procedure for in stalling the fan module/ cooling fin/CPU (See Figure 4-12 to 4-18). 1. Check that the mark on the cam is in the unlocking position.
4.7 Fan Module/Cooling Fin/CPU 4 Replacement Procedures NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. When installing the fin, make sure th e bottom of the fin covers the top of CPU. CPU Ch ip Figure 4-18 Applying Silicon Grease 5.
4 Replacement Procedures 4.8 Keyboard 4.8 Keyboard Removing the keyboard The following describes the procedure for rem o ving the keyboard (See Figure 4-19 to 4-21). CAUTION: As the keytop may fall out, when handli ng the keyboard always hold it by the frame and do not touch the keytop.
4.8 Keyboard 4 Replacement Procedures 3. Remove the following screws holding the keyboard. • M2.5 × 2.8 THIN BIND screw x2 4. Remove the following screw fixing the ke yboard hold plate and remove the keyboard hold plate. • M2.5 × 2.8 THIN BIND screw x1 5.
4 Replacement Procedures 4.8 Keyboard 6. Remove the following screw fixing the keyboard support plate underneath the keyboard. • M2.5x8 THIN BIND screw x1 7. Remove the keyboard support plate by lifting it up toward the left side. 8. Lift up the insulator and disconnect the keyboard flexible cable from PJ3200 on the system board.
4.8 Keyboard 4 Replacement Procedures Satellite A10/TECRA A1/Sa tellite Pro A10 Maintenance Man ual (960-445) 4-31 Installing the keyboard The following describes the procedure for inst alling the keyboard (See Figure 4-19 to 4-21). 1. Turn the keyboard upside down and place it on the palm rest as its face is down.
4 Replacement Procedures 4.9 Optical Drive 4 4.9 Optical Drive This section describes how to remove and install a CD-ROM drive as an example. The procedure for a DVD-ROM, Combo, Com bo+2 or DVD-Multi drive is the sam e. NOTE : Do not apply excessive force to the top of an optical drive.
4.9 Optical Drive 4 Replacement Procedures 1. Remove the following screws fixing the CD-ROM holder from the CD-ROM drive assembly. • M2x1.7 STEP screw x2 2. Remove the following screw fixing the side bracket and remove the side bracket. • M2x3 SUPER THIN BIND screw x1 Side B racket M2x1.
4 Replacement Procedures 4.9 Optical Drive Installing the Optical Drive The following describes the procedure for instal ling the optical drive (S ee Figure 4-22, 4-23). 1. Install the side bracket on the CD-ROM drive and fix it with the followin g screw.
4.10 Display Assembly 4 Replacement Procedures 4.10 Display Assembly Removing the Display Assembly The following describes the procedure for rem o ving the display assembly (See Figure 4-24 to 4-26). 1. Open the display and disconnect the LCD cable from PJ5600 on the system board.
4 Replacement Procedures 4.10 Display Assembly 3. Close the display and turn the computer face down. 4. Remove the following screws from th e bottom and rear of the com puter.
4.10 Display Assembly 4 Replacement Procedures 5. Lift the display assembly up and remove it from the base assembly. Display As sembly Base A ssembly Figure 4-26 Removing Display Assembly (3) 6. (For wireless LAN models only) Pull the wireless LAN cables from the slot of the base assembly.
4 Replacement Procedures 4.10 Display Assembly Installing the Display Assembly The following describes the procedure for instal ling the display assem bly (See Figure 4-24 to 4-26). 1. Close the display and install the display a ssembly on the base assem bly from the rear of the computer.
4.11 Touch Pad 4 Replacement Procedures 4.11 Touch Pad Removing the Touch Pad The following describes the procedure for removing the touch pad (See Figure 4-27). 1. Disconnect the touch pad flexible cab le from PJ3201 on the system board. 2. Remove the following screw securing the touch pad.
4 Replacement Procedures 4.11 Touch Pad Installing the Touch Pad The following describes the procedure for in stalling the touch pad (See F igure 4-27). 1. Place the touch pad from the right side according to the guid e pins. 2. Connect the touch pad flexible cable to PJ3201 on the system board.
4.12 BAT CON Holder 4 Replacement Procedures 4.12 BAT CON Holder Removing the BAT CON Holder The following describes the procedure for rem o ving the BAT CON holder (See Figure 4-28). 1. Remove the following screws fixing the BAT CON holder. • M2.5x8 THIN BIND screw x2 2.
4 Replacement Procedures 4.13 Sy stem Board/DC-IN Jack/RTC Battery 4.13 System Board/DC-IN Jack/RTC Battery CAUTION: 1. When handling the system board, alwa ys hold by the edges. Do not touch the printed circuit face. 2. After replacing the system board w ith a new one, set the DMI information as described in section 3.
4.13 System Board/DC-IN Jack/RTC Battery 4 Replacement Procedures M2.5x5 THIN BIND M2.5x5 THIN BIND System Board Modem Jack DC-IN Jack RTC Bat tery PJ8800 PJ8790 Figure 4-29 Removing System Board Sate.
4 Replacement Procedures 4.13 Sy stem Board/DC-IN Jack/RTC Battery 8. Remove the FIR dummy cover from the ba se assembly by pressing it outward while holding the base assembly.
4.13 System Board/DC-IN Jack/RTC Battery 4 Replacement Procedures Installing the System Bo ard/DC-IN Jack/RTC Battery The following describes the procedure for installing the system board/DC-IN Jack/RTC Battery (See Figure 4-29, 4-30). 1. Attach the FIR dummy cover on the base asse mbly.
4 Replacement Procedures 4.14 BAT LOCK ASSY/HDD UPPER ASSY 4.14 BAT LOCK ASSY /HDD UPPER ASSY Removing the BAT LOCK ASSY/HDD UPPER ASSY The following describes the procedure fo r removing the BAT LOCK ASSY/HDD UPPER ASSY (See Figure 4-31, 4-32). 1. Remove the following screws fixing the BAT LOCK ASSY.
4.14 BAT LOCK ASSY/HDD UPPER ASSY 4 Replacement Procedures 3. Remove the HDD UPPER ASSY from the base assembly by lifting it up. HDD UPPER ASSY Base A ssembly Figure 4-32 Removing HDD UPPER ASSY Satel.
4 Replacement Procedures 4.14 BAT LOCK ASSY/HDD UPPER ASSY Installing the BAT LOCK ASSY/HDD UPPER ASSY The following describes the procedure for installing the BAT LOCK ASSY/HDD UPPER ASSY (See Figure 4-31, 4-32). 1. Install the HDD UPPER ASSY on the base assembly.
4.15 Touch Pad Switch 4 Replacement Procedures 4.15 Touch Pad Switch Removing the Touch Pad Switch The following describes the procedure for re m oving the touch pad switch (See Figure 4-33). 1. Remove the following screws fixing the touch pad switch.
4 Replacement Procedures 4.16 LCD Unit/FL Inverter 4.16 LCD Unit/FL Inverter NOTE: The same part is used for the display hinge that holds the LCD unit, regardless of the LCD size. Removing the LCD Unit/FL Inverter The following describes the procedure for removing the LCD unit and FL inverter (See Figure 4-34 to 4-36).
4.16 LCD Unit/FL Inverter 4 Replacement Procedures 3. Peel off the mask tapes from the sides of the display and rem ove the following screws fixing the LCD unit. • M2x4 SUPER THIN BIND screw x4 4. With the bottom edge of the LCD unit resti ng on the display cover, lift the top edge of the LCD unit.
4 Replacement Procedures 4.16 LCD Unit/FL Inverter 8. Remove the following screws securing the LCD brackets. Remove the LCD brackets from the LCD module.
4.16 LCD Unit/FL Inverter 4 Replacement Procedures Installing the FL Inverter/LCD Unit The following describes the procedure f or installing the LCD unit/FL inverter (See Figure 4- 34 to 4-36). 1. Secure the LCD brackets to the LCD module with the following screws.
4 Replacement Procedures 4.17 Wire less LAN Antenna/Display Cover/Speaker 4.17 Wireless LAN Ante nna/Display Cover/Speaker Removing the Wireless LAN Antenna/Display Cover/Speaker The following describes the procedure for remo ving the wireless LAN antenna, display cover, and speaker (See Figure 4-37 to 4-44).
4.17 Wireless LAN Antenna/Display Cover/Speaker 4 Replacement Procedures 2. Close the display and turn the display assembly face down. Peel off the glass tape securing the speaker cables. Unhook the speaker cables (Blue, Red) from the guides respectively.
4 Replacement Procedures 4.17 Wire less LAN Antenna/Display Cover/Speaker 3. (Wireless LAN models only) Open the display and peel off four acetat e tapes securing the wireless LAN antenna cables. Remove the wireless LAN antenna s. Then unhook the wireless LAN antenna cables from the guides on the chassis .
4.17 Wireless LAN Antenna/Display Cover/Speaker 4 Replacement Procedures 4. Peel off the insulator covering the back si de of the display assembly and rem ove the following screws securing the hinge cover. Then open the display, release two latches of the hinge cover and remove the hinge cover.
4 Replacement Procedures 4.17 Wire less LAN Antenna/Display Cover/Speaker 5. Remove the following screws securing the speakers (Left, Right) and remove the speakers. • M2.5x5 THIN BIND screw x5 (Left: 2, Right: 3) CAUTION : When removing the speakers, be carefu l not to touch the metal part of the speakers.
4.17 Wireless LAN Antenna/Display Cover/Speaker 4 Replacement Procedures 6. Remove the following screw securing the LCD cable holder and remove the LCD cable holder. Then pull out the LCD cable from the bottom side of the display cover. • M2.5x4 PSP TIGHT screw x1 M2.
4 Replacement Procedures 4.17 Wire less LAN Antenna/Display Cover/Speaker 7. Peel off four mask seals from the both sides of the display cover and remove the following screws securing the hinges to the display cover. • M2.5x2.8 THIN BIND screw x2 8.
4.17 Wireless LAN Antenna/Display Cover/Speaker 4 Replacement Procedures 11. Straighten the edges of the left and right speaker nets (at four point each) using a device such as a flatblade driver and remove the speaker nets. 12. Remove the following screws securing the hinges to the display assembly.
4 Replacement Procedures 4.17 Wire less LAN Antenna/Display Cover/Speaker Installing the Wireless LAN Antenna/Display Cover/Speaker The following describes the procedure for insta lling the wireless LAN antenna, display cover, and display cable (See Figure 4-37 to 4-44).
4.17 Wireless LAN Antenna/Display Cover/Speaker 4 Replacement Procedures Satellite A10/TECRA A1/Sa tellite Pro A10 Maintenance Manual (96 0-445) 4-63 10. Set the left and right speakers on the back of the display assembly and secure the speakers with the following screws.
4 Replacement Procedures 4.18 Fluorescent Lamp 4 4.18 Fluorescent Lamp This system uses LCD modules from the followi ng suppliers. The procedure for replacing the fluorescent lamp is different for each LCD m odule. Refer to the appropriate procedure. Type Part No.
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.1 Replacing the TMD 14.1 Inch XGA Fluorescent Lamp Replace the Toshiba 14.1-inch XGA fluorescent la mp according to the following procedures and Figures 4-45 to 4-56. 4.18.1.1 Disassembling Fluorescent Lamp Peeling off the tapes and insulation s heets 1.
4 Replacement Procedures 4.18 Fluorescent Lamp Removing the screws 1. Spread out the insulation sheet without de tachin g it from the side of the bezel, as shown in Figure 4-46. 2. In the order (1) and (2) shown in Figure 4-46, remove the screws from the left- and right-hand sides of the module.
4.18 Fluorescent Lamp 4 Replacement Procedures Removing the bezel 1. Without removing the insulation tape, flip the module over again so that the display screen can face up. 2. Release the latches of the bezel and frame. (O n the sides, there are five latches in th e upper area and two latches in the lower area.
4 Replacement Procedures 4.18 Fluorescent Lamp Opening the PCB 1. Spread out the PCB horizontal ly, as shown in Figure 4-48. CAUTION: Be careful not to damage the TAB.
4.18 Fluorescent Lamp 4 Replacement Procedures Removing the PCB-assembly cell 1. Remove the cell of the PCB assembly from the backlight assembly, as indicated by (1) in Figure 4-49. Completely remove the double-sided tape remaining on the reverse side of the cell.
4 Replacement Procedures 4.18 Fluorescent Lamp 4.18.1.2 Assembling Fluorescent Lamp Putting the double-sided tapes on the bezel 1. Attach the double-sided tape to the reverse side of the bezel, as shown in Figure 4-50 . 両面テープ貼り規格 両面テープ：４５９７（ 住友３Ｍ） （テープ長さ） ±0 .
4.18 Fluorescent Lamp 4 Replacement Procedures Checking the backlight 1. Inspect the replacement backlight according to Figure 4-51. 乗り上げていないこと 。 フレームに プリズムシ.
4 Replacement Procedures 4.18 Fluorescent Lamp Assembling PCB-assembly cell 1. Remove the paper (coated with a mold release) from the double-sided tape in the three areas on the replacement backlight unit. The areas are at the top and on both sides. See Figure 4-52.
4.18 Fluorescent Lamp 4 Replacement Procedures Folding down and temporary fixing of the TAB/PCB 1. Fold down the TAB (PCB) toward the reverse side of the backlight unit, as shown in Figure 4-53. CAUTION: Be careful not to damage the TAB. 1 ＸＰＣＢを裏面に折り曲げ． For the X-PCB toward t he reverse side.
4 Replacement Procedures 4.18 Fluorescent Lamp Setting the bezel 1. Start installing the bezel in the upward dire ction u ntil it stops at the top left corner. NOTE: The GND-CU and lamp reflector on the left-hand side must not go beyond the edges of the bezel.
4.18 Fluorescent Lamp 4 Replacement Procedures Fasten screws of the PCB and bezel 1. Fasten four screws on the left edge in the order (5), (6), (7), and (8) shown in Figure 4-55. 2. Fasten four screws on the right edge in the order (1), (2), (3), and (4) shown in Figure 4-55.
4 Replacement Procedures 4.18 Fluorescent Lamp Attaching the tapes and insulation sheet 1. Attach the PCB insulation sheet (one point). 2. Attach the tape for the bezel to the bo ttom area close to the lamp (two points). 3. Attach the tape for fixing th e FL tube cable (one point).
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.2 Replacing the 14.1 Inch XGA CHIMEI Fluorescent Lamp The following describes the procedure for repl acing the fluorescent la mp (See Figure 4-57 to Figure 4-63). 1. Remove the tapes, labels and films (1 to 8).
4 Replacement Procedures 4.18 Fluorescent Lamp 3. Remove the screw and PCB cover. Figure 4-59 Replacing 14.1 Inch CHIMEI fluorescent lamp (3) 4. Loosen the X-PCB connector and di sconnect the FPC from the Y-PCB. 5. Remove the X-PCB and Y-PCB. Figure 4-60 Replacing 14.
4.18 Fluorescent Lamp 4 Replacement Procedures 6. Remove the spacer from the protecto r sheet. 7. Remove the sheets (2) to (5). Figure 4-61 Replacing 14.1 Inch CHIMEI fluorescent lamp (5) 8. Remove the LGP and reflection sheet. Figure 4-62 Replacing 14.
4 Replacement Procedures 4.18 Fluorescent Lamp 9. Remove the screw. Figure 4-63 Replacing 14.1 Inch CHIMEI fluorescent lamp (7) 10. The assembly procedure is the revers e of the above disassembly procedure.
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.3 Replacing the 14.1 Inch XGA Samsung Fluorescent Lamp (VF2058P01) The following describes the procedure for repl acing the fluorescent la mp (See Figure 4-64 to Figure 4-71) 1. Remove the PCB cover and tapes from th e LCD module.
4 Replacement Procedures 4.18 Fluorescent Lamp 2. Remove two screws fixing the PCB. Be careful not to damage the PCB. Screw Scr ew Figure 4-65 Replacing 14.
4.18 Fluorescent Lamp 4 Replacement Procedures 3. Remove the metal bezel from the plastic chassis by detaching the top hooks, side hooks and bottom hooks. Figure 4-66 Replacing 14.1 Inch Sams ung fluorescent lamp (VF2058P01) (3) 4. Remove the panel from the backlight unit.
4 Replacement Procedures 4.18 Fluorescent Lamp 5. Remove two clips. Remove the sheets (lens sheet, diffusion sheet, light guide and reflection sheet). Figure 4-68 Replacing 14.1 Inch Sams ung fluorescent lamp (VF2058P01) (5) 6. Remove two screws fixing the lamp cover and remove the lamp cover.
4.18 Fluorescent Lamp 4 Replacement Procedures 7. Remove the GND cable of the FL lamp from the plastic chassis. GND W i re Hot W ire Figure 4-70 Replacing 14.
4 Replacement Procedures 4.18 Fluorescent Lamp 8. Remove the lamp unit from the plastic chassis and replace the lamp with a new one. Lamp AS S Y Figure 4-71 Replacing 14.1 Inch Sams ung fluorescent lamp (VF2058P01) (8) 9. The assembly procedure is the revers e of the above disassembly procedure.
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.4 Replacing the 14.1 Inch XGA Samsung Fluorescent Lamp (VF2048P01) The following describes the procedure for repl acing the fluorescent la mp (See Figure 4-72 to Figure 4-81). 1. Remove the PCB cover (Cover-PCB), tape fixing the FL cable (Tape-Wire) and the aluminum tape (Tape-Al).
4 Replacement Procedures 4.18 Fluorescent Lamp 11. Remove the top chassis 1) Release four hooks on the bottom side. Figure 4-74 Replacing 14.1 Inch Sams ung fluorescent lamp (VF2048P01) (3) 2) Release the four hooks on the side. Figure 4-75 Replacing 14.
4.18 Fluorescent Lamp 4 Replacement Procedures Figure 4-76 Replacing 14.1 Inch Sams ung fluorescent lamp (VF2048P01) (5) 13. Remove the panel assembly from the back light assembly. Be careful not to scratch the TAB (TCP) and other parts. Figure 4-77 Replacing 14.
4 Replacement Procedures 4.18 Fluorescent Lamp Figure 4-78 Replacing 14.1 Inch Sams ung fluorescent lamp (VF2048P01) (7) 4-90 Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manua l (960-445).
4.18 Fluorescent Lamp 4 Replacement Procedures 15. Remove the lamp cover. 1) Remove the two screws (VF2048P15:M2x2.5) from the lamp cover. 2) Remove the lamp cover from the mold frame. Figure 4-79 Replacing 14.1 Inch Sams ung fluorescent lamp (VF2048P01) (8) 16.
4 Replacement Procedures 4.18 Fluorescent Lamp 17. Remove the lamp assembly (Lamp-Ass’y) fixed by the double-sided tape from the mold frame. Figure 4-81 Replacing 14.1 Inch Sams ung fluorescent lamp (VF2048P01) (10) 18. The assembly procedure is the revers e of the above disassembly procedure.
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.5 Replacing the 14.1 Inch XG A LG.Philips Fluorescent Lamp The following describes the procedure for repl acing the fluorescent la mp (See Figure 4-82 to Figure 4-89). Removing the tape and cover shield 1.
4 Replacement Procedures 4.18 Fluorescent Lamp Removing the LCD controller, top case, and cover assembly 1. Disconnect the FPC cable from the LCD cont roller (Control PCB) (1). Be careful not to apply excessive force to the FPC cable. 2. Remove the LCD controller (2).
4.18 Fluorescent Lamp 4 Replacement Procedures Removing the source PCB and the gate PCB 1. Remove the source PCB (1). Be careful not to apply excessive force to the TCP or PCB when removing the adhesive tape. 2. Remove the gate PCB (2). Be careful not to apply excessive force to the TCP or PCB when removing the adhesive tape.
4 Replacement Procedures 4.18 Fluorescent Lamp Removing the board assembly, tape pad, sheets, light guide, bottom cover (B), and lamp assembly 1. Remove the board assembly (Board Ass’y) (1). Perform this work in a clean room and be careful not to scratch or get dirt on the polarized plate and B/L assembly.
4.18 Fluorescent Lamp 4 Replacement Procedures Installing the double-sided tape, lamp assembl y, bottom cover (B), sheets, light guide, adhesive tape, and board assembly 1. Install the lamp assembly using the double-si ded tape (install the lamp housing) (1).
4 Replacement Procedures 4.18 Fluorescent Lamp Installing the source PCB and the gate PCB 1. Install the source PCB (1). Be careful not to apply excessive force to the TCP. 2. Install the gate PCB (2). Be careful not to apply ex cessive force to the TCP.
4.18 Fluorescent Lamp 4 Replacement Procedures Installing the bottom cover (A), sc rews , top case, LCD controller, and FPC 1. Install the bottom cover (A) and screws (1). Be careful not to apply excessive force to the source TCP. 2. Install the top case (3 ).
4 Replacement Procedures 4.18 Fluorescent Lamp 4-100 S atellite A10/TECRA A1/Satellite Pro A10 Maintenance Man ual (960-445) Installing the tape a nd the cover shield 1. Stick the adhesive tape for fixing the B/L cab le (1). Be careful not to apply excessive force to the B/L cable.
4 Replacement Procedures 4.18 Fluorescent Lamp 4 4.18.6 Replacing the 15.0 Inch XGA LG.Philips Fluorescent Lamp CAUTION : When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module.
4.18 Fluorescent Lamp 4 Replacement Procedures Cover sh ield (C) T ape shield A dhesive tape Cover s hield (G) A dhesive tape Figure 4-90 Replacing 15.0 Inch LG.Philips fluorescent lamp (XGA) (1) 2. Remove the top case. Be careful not to apply excessive force to the top case and gate TCP.
4 Replacement Procedures 4.18 Fluorescent Lamp 3. Remove the source PCB and gate PCB. 1) Remove the source PCB. Be careful not to apply excessive force to the PCB or TCP when removing the double-sided tape. 2) Remove the gate PCB. Be careful not to apply excessive force to the PCB or TCP when removing the double-sided tape.
4.18 Fluorescent Lamp 4 Replacement Procedures Board as sembly Dou ble- side d tape A dhesive ta pe Sheets and LGP Dou ble- side d tape A dhesive t ape Dou ble- side d tape A dhesive t ape Double-sided tape A dhesive ta pe Screw Cover ass embly bottom (L) Screw Figure 4-93 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp Assembling the 15.0-inch XG A LG.Philips Fluorescent Lamp To assemble the 15.0-inch XGA LG.Philips fluorescent lamp, follow the steps below and refer to figures 4-94 to 4-97. 1. Install the cover assembly bottom (L), sheets, light guide, adhesive tape and board assembly.
4.18 Fluorescent Lamp 4 Replacement Procedures 2. Install the source PCB and gate PCB. 1) Install the source PCB. Be careful not to apply excessive force to the TCP. 2) Install the gate PCB. Be careful not to apply excessive force to the TCP. Source PCB Gate PCB Figure 4-95 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 4. Stick the outside tape and install the cover shield. 1) Stick the tape shield and adhesive tape to fix the top case. NOTE: Be careful not to apply excessive force to the top case. 2) Install the cover shield (C).
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.7 Replacing the 15.0 Inch XGA Samsung Fluorescent Lamp Disassembling the 15.0 Inch XGA Samsung Fluorescent Lamp To disassemble the 15.0 inch XGA Samsung fluorescent lam p, follow the steps below and refer to figures4-98 to 4-106.
4 Replacement Procedures 4.18 Fluorescent Lamp 2. Remove the two screws. Screw Screw Figure 4-99 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (2) 3.
4.18 Fluorescent Lamp 4 Replacement Procedures 4. Remove the four bottom hooks and four side hooks (left and right). Then remove the top chassis from the mold fram e. Side hook Si de hoo k B ott om h ook Figure 4-101 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (4) 5.
4 Replacement Procedures 4.18 Fluorescent Lamp 6. Remove the sheets and clips. 1) Remove the two clips fixing the sheets. 2) Remove the sheets (protection sheet, prism sheet (L, U), diffusion sheet, LGP and reflection sheet). C lip C lip She et s Figure 4-103 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 8. Remove the lamp wire from the wire guide of the m old frame. Lamp wi r e Figure 4-105 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (8) 9. Remove the lamp assembly from the mold frame. L am p assem bly Mo ld f r ame Figure 4-106 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 4-112 Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445) Assembling the 15.0-inch XG A Samsumg Fluorescent Lamp The assembly procedure of the 15.0-inch XGA Samsung fluorescent lam p is the reverse of the above disassembly procedure.
4.18 Fluorescent Lamp 4 Replacement Procedures 4 4.18.8 Replacing the 15.0 Inch XGA Sharp Fluorescent Lamp Disassembling the 15.0 Inch XGA Sharp Fluorescent Lamp To disassemble the 15.0-inch XGA Sharp fluorescent lamp, follow the steps below and refer to figures 4-107 to 4-116.
4 Replacement Procedures 4.18 Fluorescent Lamp 2. Remove the four screws on the sides. Scre w loosening t orque: 1.2kg • cm Screw Screw Screw Screw Figure 4-108 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (2) 3. Turn the LCD module face up and remove the bezel (E).
4.18 Fluorescent Lamp 4 Replacement Procedures 4. Turn the LCD module face down and remove the two screws fixing the board. Then open the bent portion of the TCP of the board and remove the backlight. Screw Screw Screw loosening tor que: 1.2kg • cm Figure 4-110 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 5. Turn the LCD module face up and remove the LCD panel (I) from the backlight unit (H). CAUTION: Wear finger sacks or gloves during the work not to soil or scratch the LCD panel or backlight unit. (H) Back light unit (I) LCD panel Figure 4-112 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 6. Turn the backlight unit (H) removed face down and remove the two screws (D) and lamp cover (J). NOTE: Be careful not to scratch or soil the sheets. Screw loosen ing t orque: 1.2k g • cm (H) Backlight unit (J) Lamp cover (D) Scre w (D) Scre w Figure 4-113 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 7. Turn the backlight unit face up and remove the upper diffusion sheet (K), lens sheet (L) and light guide (M). NOTE: Be careful not to scratch or soil the removed sheets or light guide to reuse them. Do not remove the reflectio n sheet under the light guide.
4.18 Fluorescent Lamp 4 Replacement Procedures 9. Turn the backlight unit face down and remove the lamp unit (R) from the P-chassis. CAUTION: When removing the lamp unit, be careful not to break the lamp, or bend the reflection sheet. P-chassis Lamp unit Figure 4-116 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp Assembling the 15.0 Inch XGA Sharp Fluorescent Lamp To assemble the 15.0 Inch Sharp XGA fluorescent lamp, follow the steps below and refer to figures 4-117 to 4-129. 1. Stick the four double-sided tapes (N, O, P, Q) on the P-chassis.
4.18 Fluorescent Lamp 4 Replacement Procedures 2. Turn the backlight unit face down and install a new lamp unit (R) on the P-chassis. NOTE: When install the lamp unit (R), be careful not to bend or damage the reflection sheet. P-chassis (R) Lamp unit Figure 4-118 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 3. Install the lamp cover (J) on the backlight unit and secure it with the two screws (D). (J) Lamp cover (D) Screw (D) Screw Screw tightening torque: 1.0kg • cm Figure 4-120 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (14) 4.
4.18 Fluorescent Lamp 4 Replacement Procedures 5. Place the lens sheet (L) and upper diffusion sheet (K) on the backlight unit with light guide. (K) Upp er diffu sion sh eet (L) Len s sheet (M) Light guide Make sure there is no dust or scratch. Do not mak e any sheet ov er the edge of P-ch assi s.
4 Replacement Procedures 4.18 Fluorescent Lamp 7. Bend the TCP attaching to the source board and secure it with the two screws. Do not hold the ed g e. Do not hold the ed g e. Figure 4-124 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (18) Screw Screw Figure 4-125 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 8. Install the bezel (E) on the lamp cover and hook the four latches on the lamp cover and two latches on the P-chassis. (E) Bezel (2) Lean the bezel on the l amp cover withou t interfere nce with the TCP .
4 Replacement Procedures 4.18 Fluorescent Lamp 9. Secure the sides of the unit with the four screws. Screw Screw Screw Screw Figure 4-128 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 10. Stick the protection cover G (B), protecti on cover S (A), fixing tape (C) and fixing tape for lead wire (C). Fit the cover according t o the outl ine of the screw . Stick t he tape according to the out line of the LCD module .
4 Replacement Procedures 4.18 Fluorescent Lamp 4.18.9 Replacing the 15.0 Inch XGA CHIMEI Fluorescent Lamp Disassembling the 15.0 Inch XGA CHIMEI Fluorescent Lamp To disassemble the 15.0 inch XGA CHIMEI fluorescent lamp, follow the steps below and refer to figures4-130 to 4-135.
4.18 Fluorescent Lamp 4 Replacement Procedures 2. Remove the two screws (B) fixing the X-PCB. Then remove the eight screws (C) fixing the metal frame. Release the two hooks (A). (B) Screw Screw (B ) Detail (A) (A) hook (A) hook (C) (C) (C) (C) (C) Screw (C) (C) (C) Figure 4-131 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 3. Release the latch. NOTE: Remove the metal frame parallel no to damage it. Latch Backlight Metal frame Figure 4-132 Replacing 15.0 Inch CHIMEI fluorescent lamp (XGA) (3) 4. Remove the X-PCB. When rem oving the X-PCB, be careful not to damage the TCP.
4.18 Fluorescent Lamp 4 Replacement Procedures 5. Remove the three spacers from the BEFIII-M diffuser sheet. Rem ove the DEFIII-M diffuser sheet, BEFIII-T diffuser sheet and two tapes from the backlight unit in order. When removing the sheets, be careful not to dam age them.
4 Replacement Procedures 4.18 Fluorescent Lamp 4-132 Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445) Assembling the 15.0 Inch XGA CHIMEI fluorescent lamp To assemble procedure of the 15.0 inch XGA CHIMEI fluorescent lamp, follow the reverse steps of the disassembling steps above.
4.18 Fluorescent Lamp 4 Replacement Procedures 4 4.18.10 Replacing the 15.0 Inch SXGA+ LG.Philips Fluorescent Lamp CAUTION : When you replace the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD module. Be careful not to let dust or other foreign substances into the LCD module.
4 Replacement Procedures 4.18 Fluorescent Lamp 2. Remove the top case. Be careful not to apply excessive force to the top case or gate TCP. T op case Figure 4-137 Replacing 15.0 Inch LG.Philips fluorescent lamp (SXGA+) (2) 3. Remove the source PCB and gate PCB.
4.18 Fluorescent Lamp 4 Replacement Procedures 4. Remove the board assembly, adhesive tape, light guide and cover assem bly bottom (L). 1) Remove the board assembly. NOTE: This process should be made in a clean room to prevent scratch or particle on polarizer or B/L assembly.
4 Replacement Procedures 4.18 Fluorescent Lamp Assembling the 15.0 Inch SXGA+ LG.Philips Fluorescent Lamp To assembling the 15.0 inch SXGA+ LG.Philips fluorescent lamp, follow the steps below and refer to figures 4-100 to 4-103. 1. Install the cover assembly bottom (L), sheets, light guide, adhesive tape and board assembly.
4.18 Fluorescent Lamp 4 Replacement Procedures 2. Install the source PCB and gate PCB. 1) Install the source PCB. Be careful not to apply excessive force to the TCP. 2) Install the gate PCB. Be careful not to apply excessive force to the TCP. Source PCB Gate PCB Figure 4-141 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 4. Stick the out side tape and cover shield. 1) Install the tape shield and adhesive tape to fix the top case. Be careful not to apply excessive force to the top case. 2) Install the cover shield (C). Be careful not to apply excessive force to the control PCB.
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.11 Replacing the 15.0 Inch SXGA+ Samsung Fluorescent Lamp Disassembling the 15.0 Inch SXG A+ Samsung Fluorescent Lamp CAUTION: When you replace the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD module.
4 Replacement Procedures 4.18 Fluorescent Lamp 2. Remove the two screws securing the PCB. Screw Screw Figure 4-145 Replacing 15.0 Inch Samsung fluorescent lamp (SXGA+) (2) 3. Rem ove the four screws from the top side of the chassis. Screw Screw Screw Screw Figure 4-146 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 4. Remove the four bottom hooks and five hooks (left and right). Then remove the top chassis from the mold fram e. CAUTION: When you release hooks on the top chassis, be careful not to apply excessive force to the FL.
4 Replacement Procedures 4.18 Fluorescent Lamp 6. Rem ove the two clips. Then remove the five sheets (prism sheet (L, U), diffusion sheet, LGP and reflection sheet). Clip Clip Sheets Figure 4-149 Replacing 15.0 Inch Samsung fluorescent lamp (SXGA+) (6) 7.
4.18 Fluorescent Lamp 4 Replacement Procedures 8. Rem ove the lamp wire from the wire guide of the m old frame. Lamp wire Figure 4-151 Replacing 15.0 Inch Samsung fluorescent lamp (SXGA+) (8) 9. Remove the lamp assem bly from the mold frame. Lamp assembly Mold frame Figure 4-152 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 4-144 Satellite A10/TECRA A1/Satelitte Pro A10 Maintenance Manual (960-445) Assembling the 15.0 Inch SXGA+Samsung Fluorescent Lamp The assembly procedure is the reverse of the above disassembly procedure.
4.18 Fluorescent Lamp 4 Replacement Procedures 4 4.18.12 Replacing the 15.0 Inch SXGA+ Sharp Fluorescent Lamp CAUTION: When you replace the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD module. Be careful not to let dust or other foreign substances into the LCD module.
4 Replacement Procedures 4.18 Fluorescent Lamp 2. Remove the four screws on the sides. Screw loosening torque: 1.1kg • cm Screw Screw Screw Screw Figure 4-154 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (2) 3. Turn the LCD module face up and remove the bezel (E).
4.18 Fluorescent Lamp 4 Replacement Procedures 4. Turn the LCD module face down. Remove four screws fixing the board and remove the FPC (G). Open the bent portion of the TCP of the board and remove the backlight. Screw Screw Screw Screw (G) FPC Screw loosening torque: 0.
4 Replacement Procedures 4.18 Fluorescent Lamp 5. Turn the LCD module face up and remove the LCD panel (I) from the backlight unit (H). NOTE: Wear finger sacks or gloves during the work not to soil or scratch the LCD panel or backlight unit. (H) Backlight unit (I) LCD panel Figure 4-158 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 7. Turn the backlight unit face up and remove the upper diffusion sheet (K), lens sheet (L) and light guide (M). NOTE: The light guide and sheets are reused. Be careful not to scratch or soil them. Do not remove the reflection sheet under the light guide.
4 Replacement Procedures 4.18 Fluorescent Lamp 9. Turn the backlight unit face down and remove the lamp unit (R) from the P-chassis. CAUTION: When removing the lamp unit, be careful not to break the lamp, or bend the reflection sheet. P-chassis (R) Lamp unit Figure 4-162 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures Assembling the 15.0 Inch SXG A+ Sharp Fluorescent Lamp To assemble the 15.0 inch SXGA+ Sharp fluorescent lamp, follow the steps below and refer to Figures 4-163 to 4-177. 1. Stick four double-sided tapes (N, O, P, Q) on the P-chassis.
4 Replacement Procedures 4.18 Fluorescent Lamp P-chassis (R) Lamp unit Figure 4-164 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (12) NOTE: When install the lamp unit, be careful not to bend or damage the reflection sheet. Z Z Cross-sec tion drawing of Z-Z Install the le ad wire into t h is groove.
4.18 Fluorescent Lamp 4 Replacement Procedures 3. Install the lamp cover (J) on the backlight unit and secure it with the two screws. (J) Lamp cover (D) Scre w (D) Screw Screw tightening torque: 0.
4 Replacement Procedures 4.18 Fluorescent Lamp 4. Install the light guide (M) on the backlight unit. Insert the light guide s traight not to deform the reflec tor . (M) Light guide Backlight unit Figure 4-167 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (15) 5.
4.18 Fluorescent Lamp 4 Replacement Procedures 6. Place the LCD panel (I) on the backlight unit (H). NOTE: Make sure there is no dust between the LCD panel and backlight unit. If any dust is found, remove it with crepe tape or others which has no remaining of paste.
4 Replacement Procedures 4.18 Fluorescent Lamp 7. Bend the TCP attaching to the source board and secure it with two screws. Then bend the TCP attaching to the gate board with two screws and insert the FPC (G) into the connector of the source board. Do not hold the ed g e.
4.18 Fluorescent Lamp 4 Replacement Procedures 8. Install the bezel (E) on the lamp cover. Attach four latches on the lamp cover and two latches on the P-chassis. (E) Bezel (2) Lean the b ezel on the lamp cover without interfere nce with the TC P . (1) Hitch the hook of the bezel on the ri b of th e P-chass is.
4 Replacement Procedures 4.18 Fluorescent Lamp 9. Secure the sides of the unit with the four screws. Screw Screw Screw Screw Figure 4-174 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (22) 10. Stick the protection cover G (B). (B) Protection cover G Outline standard for the gate board Figure 4-175 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 11. Stick the protection cover S (A), fixing tape (C), fixing tape for lead wire (D). Fit the cov er acco rdin g to the outl ine of th e screw . Stick t he tape accor ding to the outli ne of the module. Make sure the tape does not appear on the si de of the module.
4 Replacement Procedures 4.18 Fluorescent Lamp 4-160 Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445) 0 to 1 mm 0 to 1 mm Standard for the outline of screw (left and right) Standard for the outline of bo ard Make sure the edge o f pl astic re sin is betw een ± 0.
Appendices.
Appendices App-ii Satellite A10/TECRA A1/Satellite Pro A10 Mainten ance Manual (960-445).
Appendices Appendix Contents Appendix A Handling the LCD Module......................................................................... A-1 Appendix B Board Layout ......................................................................................
Appendices C.22 PJ8790 RTC Battery Connector (3-pin) .................................................... C-21 C.23 PJ8770 FAN I/F Connector (3-pin) ........................................................... C-21 C.24 PJ8800 DC-IN Connector (4-pin) .
Appendices Figures Figure B-1 System board layout (front) ...........................................................................B-1 Figure B-2 System board layout (back) ...........................................................................B-3 Figure E-1 Keyboard layout .
Appendices App-vi Satellite A10/TECRA A1/Satellite Pro A1 0 Maintenance Manual (960-445 ) Table C-19 Speaker connector pin assignment (Right) (2-pin) ......................................C-20 Table C-20 Headphone connector pin assignment (6-pin) ....
Apx. A Handling the LCD Module Appendices Apx. A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged duri ng assembly or disassembly. Observe the following precautions when handling the LCD module: 1.
Appendices Apx. A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with co tton or a soft cloth. If it is still dirty, try breathing on the surface to create a light cond ensate and wipe it again. If the surface is very dirty, we recomme nd a CRT cleaning agent.
Apx. A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge.
Appendices Apx. A Handling the LCD Module 7. Do not expose the m odule to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
Apx. A Handling the LCD Module Appendices 10. If you transport the module, do not use pack ing material that c ontains epoxy resin (amine) or silicon glue (alcohol or oxime). These m aterials can release gas that can damage the panel’s polarization.
Appendices Apx. A Handling the LCD Module A-6 Satellite A10 /TECRA A1/Satellite Pro A10 Main tenance Manual (960-445).
Apx. B Board Layout Appendices Apx. B Appendix B Board Layout B.1 System Board Front View (A) (B) (C) (D) (E) (F) (G) (H) ( I ) (J) (K) (L) (M) (N) (O) (P) (Q) Figure B-1 System board layout (front) S.
Appendices Apx. B Board Layout Table B-1 System board ICs and connectors (front) Mark Number Name (A) S3201 Sensor Switch (B) PJ5600 LCD I/F connector (C) PJ3200 Keyboard I/F connector (D) PJ3201 Touc.
Apx. B Board Layout Appendices B.2 System Board Back View (A) (B) (C) (D) (E) (F) (G) (H) ( I ) (J) (K) (L) (M) (N) (O) (P) (Q) (R) (S) (T) (U) (V) (W) (X) (Y) Figure B-2 System board layout (back) Sa.
Appendices Apx. B Board Layout B-4 Satellite A10 /TECRA A1/Satellite Pro A10 Main tenance Manual (960-445) Table B-2 System board ICs and connectors (back) Mark Number Name (A) PJ5620 CRT I/F connecto.
Apx. C Pin Assignment Appendices Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) C-1 Apx. C Appendix C Pin Assignment System Board C.1 PJ1420 Memor y 0 Connector (200-pin) Table C-1 Memory 0 connector pin assignment (200-pin) (1/4) Pin No.
Appendices Apx. C Pin Assignment C-2 Sa tellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ) Table C-1 Memory 0 connector pin assignment (200-pin) (2/4) Pin No.
Apx. C Pin Assignment Appendices Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) C-3 Table C-1 Memory 0 connector pin assignment (200-pin) (3/4) Pin No. Signal name I/O Pin No. Signal Name I/O 121 SCS0-B2N I 122 SCS1-B2N I 123 N.
Appendices Apx. C Pin Assignment C-4 Sa tellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ) Table C-1 Memory 0 connector pin assignment (200-pin) (4/4) Pin No.
Apx. C Pin Assignment Appendices Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) C-5 C.2 PJ1440 Memor y 1 Connector (200-pin) Table C-2 Memory 1 connector pin assignment (200-pin) (1/4) Pin No.
Appendices Apx. C Pin Assignment C-6 Sa tellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ) Table C-2 Memory 1 connector pin assignment (200-pin) (2/4) Pin No.
Apx. C Pin Assignment Appendices Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) C-7 Table C-2 Memory 1 connector pin assignment (200-pin) (3/4) Pin No. Signal name I/O Pin No. Signal Name I/O 121 SCS2-B2N I 122 SCS3-B2N I 123 N.
Appendices Apx. C Pin Assignment C-8 Sa tellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ) Table C-2 Memory 1 connector pin assignment (200-pin) (4/4) Pin No.
Apx. C Pin Assignment Appendices Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) C-9 C.3 PJ1800 Optical Drive I/F Connector (50-pin) Table C-3 Optical drive I/F conne ctor pin assignment (50-pin) Pin No. Signal name I/O Pin No. Signal Name I/O 1 CDAUDL-PXP I 2 CDAUDR-PXP I 3 CD-GND - 4 N.
Appendices Apx. C Pin Assignment C-10 Satellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ) C.4 PJ1801 HDD I/F Connector (44-pin) Table C-4 HDD I/F connector pin assignment (44-pin) Pin No.
Apx. C Pin Assignment Appendices Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) C-11 C.5 PJ2001 PC Card I/F Connector (68-pin) Table C-5 PC card I/F connector pin assignment (68-pin) (1/2) Pin No.
Appendices Apx. C Pin Assignment C-12 Satellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ) Table C-5 PC Card slot connect or pin assignment (68-pin)(2/2) Pin No.
Apx. C Pin Assignment Appendices Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) C-13 C.6 PJ2200 Mini PCI I/F Connector (124-pin) Table C-6 Mini PCI I/F connector pin assignment (124-pin) (1/2) Pin No. Signal name I/O Pin No. Signal Name I/O 1 N.
Appendices Apx. C Pin Assignment C-14 Satellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ) Table C-5 Mini PCI I/F connector pin assignment (124-pin) (2/2) Pin No.
Apx. C Pin Assignment Appendices Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) C-15 C.7 PJ3000 MDC I/F Connector (30-pin) Table C-7 MDC I/F connector pin assignment (30-pin) Pin No. Signal name I/O Pin No. Signal Name I/O 1 N.
Appendices Apx. C Pin Assignment C-16 Satellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ) C.9 PJ3333 Keyboard Connector (34-pin) Table C-9 Keyboard connector pin assignment (34-pin) Pin No.
Apx. C Pin Assignment Appendices Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) C-17 C.11 PJ3202 Parallel I/F Connector (25-pin) Table C-11 Parallel I/F connect or pin assignment (25-pin) Pin No.
Appendices Apx. C Pin Assignment C-18 Satellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ) C.13 PJ4600 USB I/F Connector (8-pin) Table C-13 USB I/F connector pin assignment (8-pin) Pin No.
Apx. C Pin Assignment Appendices Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) C-19 C.15 PJ5620 CRT I/F Connector (15-pin) Table C-15 CRT I/F connector pin assignment (15-pin) Pin No. Signal name I/O Pin No. Signal Name I/O 1 RED-PXP I 2 GREEN-PXP I 3 BLUE-PXP I 4 N.
Appendices Apx. C Pin Assignment C-20 Satellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ) C.18 PJ6000 Speaker Co nnector (Left) (3-pin) Table C-18 Speaker connector (left) pin assignment (3-pin) Pin No. Signal name I/O Pin No. Signal Name I/O 1 SPOLP-PXP I 2 N.
Apx. C Pin Assignment Appendices Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) C-21 C.22 PJ8790 RTC Battery Connector (3-pin) Table C-22 RTC Battery connector pin assignment (3-pin) Pin No. Signal name I/O Pin No. Signal Name I/O 1 S3V - 2 N.
Appendices Apx. C Pin Assignment C-22 Satellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ).
Apx. D Keyboard Scan/Character Codes Appendices Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) D-1 Apx. D Keyboard Scan/Character Codes Appendix D Display Codes D.
Appendices Apx. D Keyboard Scan/Character Codes D-2 Satellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ).
Apx. E Key Layout Appendices Apx. E K ey Layout Appendix E Key Layout E.1 Keyboard La yout Figure E-1 Keyboard layout (for UK , made by Fujitsu, G83C0001K110) (1/5) Figure E-1 Keyboard layout (for UK .
Appendices Apx. E Key Layout Figure E-1 Keyboard layout (for U S, made by Fujitsu, G83C0001K210) (3/5) Figure E-1 Keyboard layout (for U S, made by ALPS, UE2024P137) (4/5) E-2 Sa tellite A10/TECRA A1/.
Apx. E Key Layout Appendices Figure E-1 Keyboard layout (for U S, made by NMB, G83C0000E510) (5/5) Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (96 0-445) E-3.
Appendices Apx. E Key Layout E-4 Satellite A10 /TECRA A1/Satellite Pro A10 Main tenance Manual (960-445).
Apx. F Wiring Diagrams Appendices Apx. F Appendix F Wiring Diagrams F.1 Parallel Port Wraparound Connector -SELE CT Figure F-1 Parallel port wraparound connector Satellite A10/TECRA A1/Satellite Pro A.
Appendices Apx. F Wiring Diagrams F-2 Sa tellite A10/TECRA A1/Satellite Pro A10 Mainten ance Manual (960-445) F.2 RGB Monitor ID Wraparoun d Connector (15-Pin to 15-Pin) (1) RED (2) GREEN (3) BLUE (4).
Apx. G BIOS/KBC/EC Update Appendices Apx. G BI OS Rewrite Procedures Appendix G BIOS/KBC/EC Update To update the BIOS, KBC or EC, insert the FD for update into the FDD. Then turn on the power of the computer while pressing the following key until the power LED blinks.
Appendices Apx. G BIOS/KBC/EC Update G-2 Satellite A10/TECRA A10/Satellite Pro A10 Mainten ance Manual (960-445).
Apx. H Reliability Appendices Apx. H Relia bility Appendix H Reliability The following table shows the MTBF (Mean Tim e Between Failures) of system. Table H-1 MTBF Component Time (hours) System 6,422 .
Appendices Apx. H Reliability H-2 Satellite A10/TECRA A1/Satellite Pro A10 Main tenance Manual (960-445 ).
Ein wichtiger Punkt beim Kauf des Geräts Toshiba A1 (oder sogar vor seinem Kauf) ist das durchlesen seiner Bedienungsanleitung. Dies sollten wir wegen ein paar einfacher Gründe machen:
Wenn Sie Toshiba A1 noch nicht gekauft haben, ist jetzt ein guter Moment, um sich mit den grundliegenden Daten des Produkts bekannt zu machen. Schauen Sie zuerst die ersten Seiten der Anleitung durch, die Sie oben finden. Dort finden Sie die wichtigsten technischen Daten für Toshiba A1 - auf diese Weise prüfen Sie, ob das Gerät Ihren Wünschen entspricht. Wenn Sie tiefer in die Benutzeranleitung von Toshiba A1 reinschauen, lernen Sie alle zugänglichen Produktfunktionen kennen, sowie erhalten Informationen über die Nutzung. Die Informationen, die Sie über Toshiba A1 erhalten, werden Ihnen bestimmt bei der Kaufentscheidung helfen.
Wenn Sie aber schon Toshiba A1 besitzen, und noch keine Gelegenheit dazu hatten, die Bedienungsanleitung zu lesen, sollten Sie es aufgrund der oben beschriebenen Gründe machen. Sie erfahren dann, ob Sie die zugänglichen Funktionen richtig genutzt haben, aber auch, ob Sie keine Fehler begangen haben, die den Nutzungszeitraum von Toshiba A1 verkürzen könnten.
Jedoch ist die eine der wichtigsten Rollen, die eine Bedienungsanleitung für den Nutzer spielt, die Hilfe bei der Lösung von Problemen mit Toshiba A1. Sie finden dort fast immer Troubleshooting, also die am häufigsten auftauchenden Störungen und Mängel bei Toshiba A1 gemeinsam mit Hinweisen bezüglich der Arten ihrer Lösung. Sogar wenn es Ihnen nicht gelingen sollte das Problem alleine zu bewältigen, die Anleitung zeigt Ihnen die weitere Vorgehensweise – den Kontakt zur Kundenberatung oder dem naheliegenden Service.
