Benutzeranleitung / Produktwartung 4-216-840-0 des Produzenten Sony
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MICROFILM SERVICE MANUAL MINIDISC DECK US Model Canadian Model AEP Model UK Model E Model SPECIFICA TIONS MDS-M100 Model Name Using Similar Mechanism MDS-JE520 MD Mechanism T ype MDM-5A Optical Pick-up T ype KMS-260A/J1N U.S. and foreign patents licensed form Dolby Laboratories Licensing Corporation.
– 2 – SELF-DIA GNOSIS FUNCTION The self-diagnosis function consists of error codes for customers whic h are displayed automatically when errors occur, and error codes which show the err or history in the test mode during servicing. For details on ho w to view error codes for the customer , refer to the follo wing box in the instruction manual.
– 3 – Items of Err or Histor y Mode Items and Contents Selecting the T est Mode Display Details of History E00 No error E01 Disc error . PT OC cannot be read (DISC ejected) E02 Disc error .
– 4 – SECTION 1 SER VICING NO TES T ABLE OF CONTENTS SELF-DIA GNOSIS FUNCTION .................................... 2 1. SER VICING NO TES ............................................... 4 2. GENERAL ................................................
– 5 – Flexible Cir cuit Board Repairing • Keep the temperature of the soldering iron around 270 ˚C dur - ing repairing. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering.
– 6 – JIG FOR CHECKING BD BO ARD W A VEFORM The special jig (J-2501-149-A) is useful for checking the wa v eform of the BD board. The names of terminals and the checking items to be performed are sho wn as follows.
– 7 – IOP DA T A RECORDING AND DISPLA Y WHEN OPTICAL PICK-UP AND NON-V OLA TILE MEMOR Y (IC171 OF BD BO ARD) ARE REPLA CED The IOP value labeled on the optical pick-up can be r ecorded in the non-volatile memory . By r ecording the value, it will eliminate the need to look at the value on the label of the optical pick-up.
– 8 – CHECKS PRIOR T O PARTS REPLA CEMENT AND ADJUSTMENTS Before performing repairs, perform the follo wing checks to determine the faulty locations up to a certain e xtent. Details of the procedures are described in “5 Electrical Adjustments”.
– 9 – [] RETR Y CA USE DISPLA Y MODE • In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tube. During playback, the “track mode” for obtaining track information will be set.
– 10 – Reading the Retry Cause Display 84218421 b7 b6 b5 b4 b3 b2 b1 b0 00000001 00000010 00000100 00001000 00010000 00100000 01000000 10000000 He xa- decimal Details 01 02 04 08 10 20 40 80 Higher Bits Lo wer Bits Hexadecimal Bit Binar y When 0 Emphasis OFF Monaural This is 2-bit display .
– 11 – SECTION 2 GENERAL This section is extracted from instruction manual..
– 12 – CO VER FRONT P ANEL SECTION Note: Follo w the disassembly procedure in the numerical order giv en. SECTION 3 DISASSEMBL Y 3 cov er 1 two screws (CASE 3 TP2) 1 two screws (CASE 3 TP2) 2 2 1 .
– 13 – MAIN BO ARD MECHANISM DECK SECTION (MDM-5A) 3 two screws (BVTP3 × 8) 3 two screws (BVTP3 × 8) 4 two PC board holders 2 connector (CNP920) 2 connector (CNP911) 5 MAIN board 1 wire (flat ty.
– 14 – SLIDER (CAM) B ASE UNIT (MBU-5A), BD BO ARD 1 two screws (P2.6 × 6) 4 bracket (Guide L) 3 leaf spring 2 harnes 6 bracket (Guide R) 7 slider (Cam) 5 two screws (P2.6 × 6) Set the shaft of Lev er (O/C) to be at the position in the figure. Set the shaft of Cam gear to be at the position in the figure.
– 15 – SW BO ARD , LO ADING MO T OR (M103) 5 three screws (BTP2.6 × 6) 6 SW board 4 loading motor (M103) 3 two screws (PWH1.7 × 4) 1 screw (PTPWH M2.
– 16 – SECTION 4 TEST MODE 1. PRECA UTIONS FOR USE OF TEST MODE • As loading related operations will be performed r egardless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it.
– 17 – Mark (X) (X) (X) (X) (!) (X) (X) (X) (X) (X) (X) (X) (X) 5. SELECTING THE TEST MODE There are 31 types of test modes as sho wn below . The groups can be switched by turn the = AMS + knob . After selecting the group to be used, press the [YES] button.
– 18 – “CPLAY MID” n “CPLAY OUT” n “CPLAY IN” § “CREC MID” n “CREC OUT” n “CREC IN” § 5-1. Operating the Continuous Pla yback Mode 1. Entering the continuous playback mode (1) Set the disc in the unit. (Whiche ver recordable discs or discs for playback only are av ailable.
– 19 – 6. FUNCTIONS OF O THER BUTT ONS 7. TEST MODE DISPLA YS Each time the [DISPLA Y/CHAR] button is pressed, the display changes in the following order . 1. Mode display Displays “TEMP ADJUST”, “CPLA YMODE”, etc. 2. Error rate display Displays the error rate in the follo wing way .
– 20 – ( P REC SYNC L.SYNC OVER B A- TRACK DISC SLEEP MONO When Off Contents Display When Lit During continuous playback (CL V : ON) Tracking serv o OFF Recording mode ON CL V low speed mode ABCD .
– 21 – SECTION 5 ELECTRICAL ADJUSTMENTS 1. P ARTS REPLA CEMENT AND ADJUSTMENT • Check and adjust the MDM and MBU as follo ws. The procedure changes according to the part replaced • Abbreviatio.
– 22 – 2. PRECA UTIONS FOR CHECKING LASER DIODE EMISSION T o check the emission of the laser diode during adjustments, nev er vie w directly from the top as this may lose your eye-sight.
– 23 – 6. CHECK PRIOR T O REP AIRS These checks are performed before replacing parts according to “approximate specifications” to determine the faulty locations. For details, refer to “Checks Prior to Parts Re placement and Adjust- ments” (See page 8).
– 24 – 9. Press the [YES] button display “EFB = MO-P”. Then, the optical pick-up mov es to the pit area automatically and servo is imposed. 10. Observe the wa v eform of the oscilloscope, and check that the specified v alue is satisfied. Do not turn the = AMS + knob .
– 25 – 7. INITIAL SETTING OF ADJUSTMENT V ALUE Note: Mode which sets the adjustment results recorded in the non-volatile memory to the initial setting value. Ho we ver the results of the tempera- ture compensation offset adjustment will not c hange to the initial setting value.
– 26 – 7. Then, turn the = AMS + knob and display “LDPWR CHECK” (C02). 8. Press the [YES] button once and display “LD 0.9 mW $ ”. Check that the reading of the laser pow er meter become 0.85 to 0.91 mW . 9. Press the [YES] button once more and display “LD 7.
– 27 – 8. T urn the = AMS + knob so that the waveform of the oscilloscope becomes the specified v alue. (When the = AMS + knob is turned, the of “EFB- ” changes and the wav eform changes.) In this adjustment, wa veform var ies at intervals of approx.
– 28 – 13. ERROR RA TE CHECK 13-1. CD Err or Rate Check Checking Procedur e : 1. Load the check disc (MD) TD YS-1. 2. T urn the = AMS + knob and display “CPLA Y MODE” (C30). 3. Press the [YES] button twice and display “CPLA Y MID”. 4. The display changes to “C1 = AD = ”.
– 29 – CN110 NO TE D101 I+3V IOP TEO RF VC GND IC171 IC121 IC101 IC192 CN101 Note: It is useful to use the jig. for checking the wav eform. (Refer to Servicing Notes on page 6) – BD BO ARD (Side.
– 30 – 6-1. IC PIN FUNCTION DESCRIPTION SECTION 6 DIA GRAMS • BD BOARD IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP) Pin No. Pin Name I/O Description 1I I I-V converted RF signal I input from the optical pick-up block detector 2J I I-V converted RF signal J input from the optical pick-up block detector 3V C O Middle point voltage (+1.
– 31 – • BD BOARD IC121 CXD2654R Pin No. Pin Name I/O Description 1 MNT0 (FOK) O Focus OK signal output to the system controller (IC501) “H” is output when focus is on (“L”: NG) 2 MNT1 (.
– 32 – Pin No. Pin Name I/O Description 45 A09 O Address signal output to the D-RAM (IC124) 46 XRAS O Row address strobe signal output to the D-RAM (IC124) “L” active 47 XWE O Write enable sig.
– 33 – Pin No. Pin Name I/O Description 90 FS4 O Clock signal (176.4 kHz) output terminal (X’tal system) Not used (open) 91 SRDR O Sled servo drive PWM signal (–) output to the BH6511FS (IC152.
– 34 – • MAIN BOARD IC501 M30620MC-400FP (SYSTEM CONTROLLER) Pin No. Pin Name I/O Description 1, 2 NC O Not used (open) 3C 1 O Monitor output terminal for the test C1 error rate is output when t.
– 35 – – 36 – Pin No. Pin Name I/O Description 50 STB O Relay drive signal output for the power on/off “L”: standby mode, “H”: relay on 51 CHACK IN I Detection input from the disc chuc.
MDS-M100 – 37 – – 38 – 6-2. BLOCK DIA GRAM – MD SER V O Section – F C B D A E I J J I B A C D E F DETECTOR 1 2 J I 4 5 6 7 A B C D 8 9 E F LD PD LASER DIODE ILCC PD OPTICAL PICK-UP (KMS-26.
MDS-M100 – 39 – – 40 – 6-3. BLOCK DIA GRAM – MAIN Section – 05 X351 22.5792MHz LED DRIVE Q751 ROTARY ENCODER FL DRIVE Q767 D751 I/ u A/D, D/A CONVERTER IC301 DATAO ADDT DADT, BCK, LRCK DAT.
– 41 – – 42 – 6-4. NO TE FOR PRINTED WIRING BO ARDS AND SCHEMA TIC DIA GRAMS • Circuit Boar ds Location Note on Schematic Diagram: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except f or electrolytics and tantalums.
MDS-M100 – 43 – – 44 – 6-5. PRINTED WIRING BO ARD – BD Board – • See pag e 41 for Circuit Boar ds Location. • Semiconductor Location Ref . No. Location D101 A-1 D181 D-3 D183 D-3 IC103 B-1 IC123 D-2 IC171 D-1 Q102 B-1 Q103 C-1 Q104 B-1 • Semiconductor Location Ref .
MDS-M100 – 45 – – 46 – 6-6. SCHEMA TIC DIA GRAM – BD Board (1/2) – • See pa ge 65 for W a veforms. • See pa ge 70 for IC Block Dia grams.
MDS-M100 – 47 – – 48 – 6-7. SCHEMA TIC DIA GRAM – BD Boar d (2/2) – • See page 65 for W aveforms. • See page 51 for IC Bloc k Diagram. • V oltages and w av eforms are dc with respect to ground under no-signal conditions.
MDS-M100 – 49 – – 50 – 6-8. SCHEMA TIC DIA GRAM – SW Boar d – • IC Block Dia grams – BD Board – IC101 CXA2523AR 6-9. PRINTED WIRING BO ARD – SW Board – • See page 41 for Cir cuit Boards Location.
– 51 – – 52 – IC121 CXD2654R 100 99 98 97 96 95 94 93 EFMO DVSS TEST3 TEST2 TEST1 FGIN SPFD SPRD 92 SFDR 91 SRDR 90 FS4 89 FRDR 88 FFDR 87 DVDD 86 TFDR 85 TRDR 84 LDDR 83 APCREF 82 DTRF 81 CKR.
MDS-M100 – 53 – – 54 – 6-10. PRINTED WIRING BO ARDS – TRANS Board – • See page 41 f or Circuit Boar ds Location. (Page 53) (Page 55) (Page 54) (Page 55).
MDS-M100 – 55 – – 56 – 6-11. PRINTED WIRING BO ARD – MAIN Boar d – • See page 41 for Circuit Boar ds Location. IC301 B-10 IC351 A-10 IC381 C-10 IC386 D-10 IC401 A-2 IC406 B-2 IC411 B-4 IC421 D-3 IC441 B-9 IC501 C-7 IC601 D-9 IC611 D-9 Q191 D-9 Q291 D-9 Q390 D-4 Q441 B-9 Q442 B-9 Q911 A-1 Ref.
MDS-M100 – 57 – – 58 – 6-12. SCHEMA TIC DIA GRAM – MAIN Board (1/2) – • See page 65 f or Wavef orm. • V oltages and wav eforms are dc with respect to ground under no-signal conditions.
MDS-M100 – 59 – – 60 – 6-13. SCHEMA TIC DIA GRAM – MAIN Boar d (2/2), TRANS Board – • See page 65 for W avef orms. • See page 52 for IC Bloc k Diagrams. • V oltages and wav eforms are dc with respect to ground under no-signal conditions.
MDS-M100 – 61 – – 62 – 6-14. PRINTED WIRING BO ARDS – P ANEL/P ANEL 2 Boards – • See page 41 for Cir cuit Boards Location. • Semiconductor Location Ref .
MDS-M100 – 63 – – 64 – 6-15. SCHEMA TIC DIA GRAM – P ANEL/P ANEL 2 Boards – • See page 65 f or W avef orm. • V oltages and wav eforms are dc with respect to ground under no-signal conditions.
12 11 11 8 10 2 3 4 5 1 6 7 8 9 #1 3.8 Vp-p 2.8224 MHz – 65 – – 66 – • W aveforms – BD Board – 1 IC101 1 , 2 (I, J) (Play mode) 5 IC121 @¶ (LRCK) 2 IC101 4 (A) (Play mode) 3 IC101 8 , 9.
– 67 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark (2) CHASSIS SECTION * 51 X-4951-211-1 CHASSIS ASSY 52 4-965-822-01 FOOT 53 4-999-839-01 SCREW (+BVTTWH M3), STEP * .
– 68 – (3) MECHANISM SECTION (MDM-5A) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 201 1-668-111-11 SW BOARD * 202 4-996-217-01 CHASSIS 203 4-996-223-11 INSULA TOR (.
– 69 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 251 A-4724-063-A BD BOARD, COMPLETE 252 3-372-761-01 SCREW (M1.7), T APPING * 253 4-996-267-01 BASE (BU-D) * 254 4-.
– 70 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 1-673-307-11 AC SELECT BOARD (SP) *************** < SWITCH > ! S951 1-771-474-11 SWITCH, POWER (VOL TAGE SE.
– 71 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < IC/TRANSISTOR > IC101 8-752-080-95 IC CXA2523AR IC103 8-729-903-10 TRANSISTOR FMW1 IC121 8-752-389-44 IC CX.
– 72 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * A-4724-589-A MAIN BOARD, COMPLETE (US, CND) * A-4724-628-A MAIN BOARD, COMPLETE (SP) * A-4724-631-A MAIN BOARD, C.
– 73 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark D466 8-719-024-99 DIODE 11ES2-NT A2B D467 8-719-024-99 DIODE 11ES2-NT A2B D911 8-719-911-19 DIODE 1SS119 < INDUC.
– 74 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R581 1-249-441-11 CARBON 100K 5% 1/4W (EXCEPT US, CND) R582 1-249-441-11 CARBON 100K 5% 1/4W (US, CND) R592 1-249-4.
– 75 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < IC > IC781 8-749-013-92 IC GP1UC7X ( g ) < TRANSISTOR > Q751 8-729-422-57 TRANSISTOR UN4111 < RESI.
– 76 – Sony Corporation Home A&V Products Compan y 9-928-837-11 99C0586-1 Printed in Japan © 1999. 3 Published by Quality Assurance Dept. (Shinagawa) MDS-M100.
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