Benutzeranleitung / Produktwartung ML350 des Produzenten HP (Hewlett-Packard)
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HP Pr oL iant ML3 5 0 Gener ation 5 S er v er Maint enance and Se r v ic e Guide Part Number 405046-008 J uly 2008 (Ei g hth Edition).
© Copyright 2006, 2008 Hewlett- Packard Development Company, L.P. The information contained herein is subject to chan ge without no tice. The only warranties for HP products and services ar e set forth in the express warranty statements accompanying such produc ts and services.
Contents 3 Con t en t s Customer se lf re pair ...................................................................................................................... 5 Parts only warr anty service ......................................................
Contents 4 Optical driv e cabl ing .......................................................................................................... ..................... 65 Optional ATA or ATAP I device cabling ..............................................
Customer self repair 5 C ust omer self r epair HP products are designed with many Customer Self Repair (CSR) parts to minimi ze repair time and allow for greater flexibility in performing def ective parts re placement.
Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplac ement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative.
Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la ri parazione da parte del cl iente. Pe r rispettare la garanzia, HP richiede che queste parti siano sostituite da un c entro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Ca talogo illustrato dei componenti.
Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materiali en, die mit einem CSR- Ersatzteil geliefert werden, könn en Sie entnehmen, ob das defekte Teil an HP zurückgesc hickt werden muss.
Customer self repair 9 Centro de asistencia técnica de HP y reci birá ayu da telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componente s CSR, HP especificará si los componente s defectuosos deberán devolverse a HP.
Customer self repair 10 periode, gewoonlijk vijf (5) werkdagen, retourne ren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meeg eleverde verpakkingsmateriaal. Als u het defecte onderdeel niet t erugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen.
Customer self repair 11 Se r v iço de gar anti a ape nas par a peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fo rnece as peças de reposição sem cobrar nenhuma taxa.
Customer self repair 12.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Illustrated parts catalog 16 Illus tr ated par ts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5 ) 1 Access panel 413981-001 Mandatory 1 2 Rack bezel .
Illustrated parts catalog 17 Item Description Spare part number Customer self repair (on page 5 ) 6 Hard drive blank, SFF 392613-001 Mandatory 1 7 Hard drive blank, LFF* 389015-001 Mandatory 1 8 Plast.
Illustrated parts catalog 18 HP realice su sustitución, puede o no conllevar costes adi cionales, dependiendo del tipo de servicio de garantía correspondiente al producto. 3 No: No—Algunos componentes no están diseñados para que puedan ser repa rados por el usuario.
Illustrated parts catalog 19 System components Item Description Spare part number Customer self repair (on page 5 ) System components 9 Fan assembly, 92-mm 413978-001 Mandatory 1 10 3-V lithium batter.
Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 5 ) e) Dual-Core, Intel® Xeon® Proc essor 5120 (1.86-GHz, 1066 - MHz FSB, 1x4-MB L2 cache)*† 416794-001 Optiona l 2 f) Dual-Core, Intel® Xeon® Processor 5130 (2.
Illustrated parts catalog 21 Item Description Spare part number Customer self repair (on page 5 ) a) System board with tray and screws, supports Intel® Xeon® 50xx and 51xx processors† 413984-001 O.
Illustrated parts catalog 22 Item Description Spare part number Customer self repair (on page 5 ) j) 500-GB, SATA, 7,200- rpm, LFF* 404654-001 Mandatory 1 k) 1-TB, SATA, 7,200-rp m, LFF* 461289-001 Ma.
Illustrated parts catalog 23 1 Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.
Illustrated parts catalog 24.
Removal and replacement procedures 25 R emo v al and r eplacement pr ocedur es Required tools You need the following item s for some procedures: • T-15 Torx screwdriver • Flathead screwdriver • Diagnostics Utility Safety considerations Before performing service proced ures, review all the safety information.
Removal and replacement procedures 26 This symbol indicates the presence of el ec tric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason. WARNING: To reduce the risk of injury from el ectric shock hazards, do not open this enclosure.
Removal and replacement procedures 27 WARNING: To reduce the risk of personal injury or damage to the equipment, adequately stabilize the rack before extending a componen t outside the rack. Extend only one compon ent at a time. A rack may become unstable if more than one component is extended.
Removal and replacement procedures 28 The system is now without power. Extend the server from the rack 1. Power down the server (on page 27 ). 2. Pull down the quick-release levers on each side of the server to release the server fr om the rack.
Removal and replacement procedures 29 Front bezel This server has a removable bezel that must be un locked and opened before accessin g the front panel components. The bezel should be kept cl osed during normal serv er operations. Use the key provided with the server to unlock the bezel with a clo ckwise turn.
Removal and replacement procedures 30 Tower foot To remove the component: 1. Power down the server (on page 27 ). 2. Remove the tower bezel (" Front bezel " on page 29 ). 3. Place the server on its side. 4. Remove the foot. To replace the component, reverse the r emoval procedure.
Removal and replacement procedures 31 Rack bezel To remove the component: 1. Power down the server (on page 27 ). 2. Extend the server from the rack (on page 28 ). 3. Remove the access panel. 4. Remove the bezel. To replace the component, reverse the r emoval procedure.
Removal and replacement procedures 32 4. Slide the rail forward and remove it from the server. 5. Repeat the steps above to remove the other rail. To replace the component, reverse the r emoval procedure. Power supply blank Remove the blank from the bay.
Removal and replacement procedures 33 CAUTION: Do not attempt to remove and replac e a power supply as a hot-plug procedure unless both bays are populated with power supplies. To remove the component: 1. Disconnect the power cord from the AC source. 2.
Removal and replacement procedures 34 NOTE: Depending on model purchased, the server may look slightly different than shown. To replace the component, reverse the r emoval procedure.
Removal and replacement procedures 35 3. Remove the hard drive. To replace the component, reverse the r emoval procedure. IMPORTANT: When installing a x3/x1 SAS cable in a SFF system, HP recommends that the x3 part of the x3/x1 cable be linked to the SAS ha rd drive backplane connector that corresponds to hard drive slots 1 to 4.
Removal and replacement procedures 36 6. Remove the four T-15 s crews and slide th e hard drive cage out of the chassis. 7. Remove all hard drives. To replace the components, revers e the removal procedure.
Removal and replacement procedures 37 o Unlock and remove the bezel (" Front bezel " on page 29 ). o Extend the server from the rack (on page 28 ). 3. Remove the access panel. 4. Remove the air baffle. To replace the component, reverse the r emoval procedure.
Removal and replacement procedures 38 6. Remove the fan. To replace the component, reverse the r emoval procedure. Expansion slot cover To remove the component: 1. Do one of the following: o Unlock and remove the bezel (" Front bezel " on page 29 ).
Removal and replacement procedures 39 4. Remove the expansion slot cover. CAUTION: To prevent improper cooling and therma l damage, do not operate the server unless all PCI slots have either an expansion slo t c over or an expansion board installed. To replace the component, reverse the r emoval procedure.
Removal and replacement procedures 40 5. Push the release latches on the expansion board retainer and open the retainer. 6. Remove the T-15 Torx screw securing the expansion board, if necessary. 7. Remove the expansion board. To replace the component, reverse the r emoval procedure.
Removal and replacement procedures 41 3. Remove the media bay blank. To replace the component, reverse the r emoval procedure. Battery-backed write cache module To remove the component: 1. Power down the server (on page 27 ). 2. Do one of the following: o Open or remove the tower bezel, as needed (" Front bezel " on page 29 ).
Removal and replacement procedures 42 PCI-X expansion cage CAUTION: To prevent damage to the server or ex pansion boards, power down the server and remove all AC power cords before removing or installing the PCI expansion cage. To remove the component: 1.
Removal and replacement procedures 43 8. Pull the spring-loaded lockin g pin out of its socket. 9. Remove the PCI-X expansion cage..
Removal and replacement procedures 44 10. Remove any expansion boards. To replace the components, revers e the removal procedure. Half-height or full-height media device To remove the component: 1. Power down the server (on page 27 ). 2. Do one of the following: o Unlock and remove the bezel (" Front bezel " on page 29 ).
Removal and replacement procedures 45 o SATA DVD-ROM drive 5. Remove the device. o Half-height.
Removal and replacement procedures 46 o Full-height To replace the component, reverse the r emoval procedure. IMPORTANT: Be sure to connect the right-angle end of the SAT A data cable to the system board. Connecting it to the SATA drive may inte rfere with other installed media bay devices.
Removal and replacement procedures 47 6. Remove the heats ink. To replace the component: 1. Use the alcohol swab to remove all the existing th ermal grease from the processor. Allow the alcohol to evaporate before continuing. 2. Remove the heats ink prot ective co ver.
Removal and replacement procedures 48 3. Install the heatsink. 4. Close the heatsink lockin g levers. 5. Connect the heatsink fan cable to the system board. 6. Install the access panel. 7. Do one of the following: o Close or install the tower bezel, as need ed.
Removal and replacement procedures 49 IMPORTANT: PPM 2 must be installed when processor 2 is install ed. The system fails to boot if the PPM is missing. CAUTION: To prevent possible serv er malfunction, do not mix processors of different speeds or cache sizes.
Removal and replacement procedures 50 7. Using your fingers, remove the failed processor. To replace the component: IMPORTANT: Be sure the processor r emains inside the processor installation tool. 1. If the processor has separated from the in stallation tool, carefully re-insert th e processor in the tool.
Removal and replacement procedures 51 3. Press down firmly until the processor in stallation tool clicks and separates from the processor, and then remove the processor installation tool.
Removal and replacement procedures 52 4. Close the processor retaining latch and th e processor socket retaini ng bracket. 5. Clean the old thermal grease fr om the heatsink with the alcohol swab.
Removal and replacement procedures 53 7. Install the heatsink. 8. Close the heatsink lockin g levers 9. Connect the heatsink fan cable to the system board. 10. Install the access panel. 11. Do one of the following: o Close or install the tower bezel, as need ed.
Removal and replacement procedures 54 To remove the component: 1. Power down the server (on page 27 ). 2. Do one of the following: o Unlock and remove the bezel (" Front bezel " on page 29 ). o Extend the server from the rack (on page 28 ). 3.
Removal and replacement procedures 55 5. Remove the redundant fan, if applicable. 6. Remove the FBDIMM. To replace the component, reverse the r emoval procedure. Parallel and second serial connector bracket To remove the component: 1. Power down the server (on page 27 ).
Removal and replacement procedures 56 5. Remove the T-15 Torx screw securing the para llel and second serial connector bracket. 6. Remove the parallel and second serial connector bracket.
Removal and replacement procedures 57 4. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery , reconfigure t he system through RBSU. To replace the component, reverse the r emoval procedure.
Removal and replacement procedures 58 CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the so cket. • Do not tilt or slide the processor when lowerin g the processor into the socket.
Removal and replacement procedures 59 CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the so cket. • Do not tilt or slide the processor when lowerin g the processor into the socket.
Removal and replacement procedures 60 a. Open the processor retaining latch and the processor socket retaining bracket. b. Remove the processor socket protective cover. 3. Install the processor socket cover onto the pr ocessor socket of the f ailed system board.
Removal and replacement procedures 61 5. Close the processor retaining latch and th e processor socket retaini ng bracket. 6. Clean the old thermal grease fr om the heatsink an d the top of the processor with the alcohol swab. Allow the alcohol to evapo rate before continuing.
Removal and replacement procedures 62 7. Apply all the grease to the top of the processor in one of the foll owing patterns to ensure even distribution: 8.
Removal and replacement procedures 63 9. Close the heatsink lockin g levers. 10. Connect the heatsink fan cable to the system board. IMPORTANT: Install all components with the same co nfiguration that was used on the failed system board. 11. Install all components removed fr om the failed syst em board.
Removal and replacement procedures 64 Power supply backplane To remove the component: 1. Power down the server (on page 27 ). 2. Remove the power supplies (" Hot-plug power supply " on page 32 ). 3. Do one of the following: o Unlock and remove the bezel (" Front bezel " on page 29 ).
Cabling 65 C abling Optional SATA or SAS cabling Many configurations are possible when SATA or SAS controllers are added. When upgrading the storage controller, refer to the Quic kspecs and th e cabling matrix to identify the correct cables ( http://h10010.
Cabling 66 • PATA optical drive cabling • SATA optical drive cabling Optional ATA or ATAPI device cabling This server includes one PATA cable (the Cable Sele ct Cable) that can connect up to two ATA o r ATAPI devices to the system through the integrated PATA controller.
Diagnostic tools 67 Diagno sti c tools Troubleshooting resources The HP ProLiant Servers Troubleshoot ing Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server bl ades.
Diagnostic tools 68 For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or the HP SIM website ( http://www.hp.com/go/hpsim ). Integrated Management Log The IML records hundreds of events and s tores them in an easy-to-view form.
Diagnostic tools 69 For more information regarding array co ntroller configuration, refer to the controll er user guide. For more information regarding the defa ult configurations that ORCA uses, refer to the HP ROM-Based Setup Utility User Guide on the Documentation CD.
Diagnostic tools 70 • Access advanced troubleshooting featur es through the iLO 2 interface. • Diagnose iLO 2 using HP SIM throug h a web browser and SNMP alerting. For more information about iLO 2 features, refer to the iLO 2 documentation on the Documentation CD or on the HP website ( http://www.
Diagnostic tools 71 HP Insight Diagnostics HP Insight Diagnostics is a proactive serv er manage ment tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to a ssist IT administrators who verify server installations, troubles hoot pr oblems, and perform repair validation.
Component identification 72 C omponen t iden tif i cation Front panel components Item Description 1 Removable media bays (4) 2 CD-ROM drive 3 Hot-plug hard drive bays (8-bay drive cage model) 4 Hot-pl.
Component identification 73 Front panel LEDs and buttons Item Description Status 1 Power On/Standby button — 2 System power LED Green = Power on Amber = System shut down, but power still applied Off = No power 3 Internal health LED Green = Normal Amber = System degraded.
Component identification 74 Rear panel components Item Description 1 Video connector 2 Serial connector 3 USB connectors (2) 4 RJ-45 Ethernet connector (iLO 2 management) 5 RJ-45 Ethernet connector (d.
Component identification 75 Rear panel LEDs and buttons Item Description Status 1 Power supply LED Green = Power supply is on and functioning Off = No power or inadequate power supply 2 UID LED and bu.
Component identification 76 System board components NOTE: PPM 1 is embedded in the system board. Item Description 1 Processor 1 heatsink fan connector 2 Processor socket 1 3 Processor socket 2 4 Power.
Component identification 77 Item Description 22 PCI Express x8 slots 4-6 (x4 routed) 23 PPM 2 slot 24 Optional redundant system fa n 4 connector 25 System fan 2 connector 26 Optional redundant system .
Component identification 78 System board LEDs Item Description Status 1 FBDIMM 1-8 Amber = FBDIMM fa iled Off = FBDIMM functioning 2 Processor 1 Amber = Processor 1 failed Off = Processor 1 function i.
Component identification 79 Item Description Status 12 Optional redundant system fan 2 Amber = Redundant fan has failed Off = Redundant fan is functioning 13 System fan 1 Amber = Fa n is not installed.
Component identification 80 System LED and color Internal health LED color Status Overtemperature (amber) Red • The Health Driver has detected a cautionary temperature level. • The server has detected a hardware critical temperature level. Fan (amber) Red The minimum fan requir ements are not being met.
Component identification 81 Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Flashing regularly (1 Hz) Amber, flashing regularly (1 Hz) Do not remove the drive. Removing a drive may terminate the current operation and cause data loss.
Specifications 82 Sp e c i fica tio n s Environmental specifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 70 ° C (- 40 ° F to 158 ° F) Maximum wet bulb temperature 28 ° C (82.
Specifications 83 Specification Value Maximum peak power 1000 W (low line), 1200 W (high line) Rack server specifications Specification Value Dimensions Height 21.7 cm (8.54 in) Depth (with bezel) 55.7 cm (21.9 in) Width (with bezel) 44.5 cm (17.5 in) Weight (no drives installed) 27.
Specifications 84 Specification Value Drive rotation 300 rpm Transfer rate High 500 Kb/s Low 250 Kb/s Bytes/sector 512 Sectors per track (high/low) 18/9 Tracks per side (high/low) 80/80 Access times T.
Specifications 85 Specification Value Height 41 mm (1.6 in) Depth 172 mm (6.7 in) Width 147 mm (5.8 in) Weight 1 kg (2.2 lb) Data transfer rate Sustained 150 KB/s (sustained 1X), 1500/3600 KB/s (10X to 24X) Burst 16.6 MB/s Access times (typical) Full stroke 300 ms Random 140 ms Diameter 12 cm, 8 cm (4.
Specifications 86 Specification Value Width 147 mm (5.8 in) Weight 1 kg (2.2 lb) Data transfer rate Sustained 4463 - 10,800 KB/s (8X CAV DVD mo de), 150 KB/s (sustained 1X CD-ROM), 1500 - 7200 K B/s (.
Acronyms and abbreviations 87 A c r on y ms and abbr e v i ations ABEND abnormal end ASR Automatic Server Recovery ATA Advanced Technology Attachment ATAPI Advanced Technology Atta chment Packet Inter.
Acronyms and abbreviations 88 NMI non-maskable interrupt NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays PATA parallel ATA PCI Express Peripheral Component Interconnect Express PCI-.
Acronyms and abbreviations 89 SIM Systems Insight Manager UID unit identification USB universal serial bus.
Index 90 A air baffle 36 Altiris Deployment Solution 69 Altiris eXpress Deployment Server 69 Autorun menu 70 B battery 56 BIOS upgrade 69 blanks 32, 33, 40 buttons 72, 73 C cables 65, 66 cabling 65, 6.
Index 91 M management tools 67 mechanical components 16 media devices 44, 65 N NIC LEDs 72, 73, 75, 79 NMI jumper 77 O Online ROM Flash Compo nent Utility 70 Option ROM Configuration for Arrays (ORCA).
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Wenn Sie HP (Hewlett-Packard) ML350 noch nicht gekauft haben, ist jetzt ein guter Moment, um sich mit den grundliegenden Daten des Produkts bekannt zu machen. Schauen Sie zuerst die ersten Seiten der Anleitung durch, die Sie oben finden. Dort finden Sie die wichtigsten technischen Daten für HP (Hewlett-Packard) ML350 - auf diese Weise prüfen Sie, ob das Gerät Ihren Wünschen entspricht. Wenn Sie tiefer in die Benutzeranleitung von HP (Hewlett-Packard) ML350 reinschauen, lernen Sie alle zugänglichen Produktfunktionen kennen, sowie erhalten Informationen über die Nutzung. Die Informationen, die Sie über HP (Hewlett-Packard) ML350 erhalten, werden Ihnen bestimmt bei der Kaufentscheidung helfen.
Wenn Sie aber schon HP (Hewlett-Packard) ML350 besitzen, und noch keine Gelegenheit dazu hatten, die Bedienungsanleitung zu lesen, sollten Sie es aufgrund der oben beschriebenen Gründe machen. Sie erfahren dann, ob Sie die zugänglichen Funktionen richtig genutzt haben, aber auch, ob Sie keine Fehler begangen haben, die den Nutzungszeitraum von HP (Hewlett-Packard) ML350 verkürzen könnten.
Jedoch ist die eine der wichtigsten Rollen, die eine Bedienungsanleitung für den Nutzer spielt, die Hilfe bei der Lösung von Problemen mit HP (Hewlett-Packard) ML350. Sie finden dort fast immer Troubleshooting, also die am häufigsten auftauchenden Störungen und Mängel bei HP (Hewlett-Packard) ML350 gemeinsam mit Hinweisen bezüglich der Arten ihrer Lösung. Sogar wenn es Ihnen nicht gelingen sollte das Problem alleine zu bewältigen, die Anleitung zeigt Ihnen die weitere Vorgehensweise – den Kontakt zur Kundenberatung oder dem naheliegenden Service.
