Benutzeranleitung / Produktwartung DL785 des Produzenten HP (Hewlett-Packard)
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HP Pr oL ian t DL7 8 5 Se r v er Maint enance and Se r v i ce Gui de Gener ati on 5 and Ge ner ati on 6 Maint enance and Se r v ice Gui de HP P art Number : AH2 3 3-900 2A_ed7 P ublished: January 20 1.
© Copyright 2008–2010 Hewlett-P ackard Development Company , L.P . The information contained herein is subject to change without notice. The only w arranties for HP products and services are set forth in the express warranty statements accompanying such products and services.
T a ble of C on ten ts 1 C usto mer self r epair ....................................................................................................... 7 R ép ar a ti o n pa r l e cl i en t ( CS R )...................................................
R e- en te ri ng t he s er v er s er ia l nu mb er a nd p ro du ct I D....................................................................4 8 S ys te m ba tt er y.........................................................................................
8 T echni cal support ......................................................................................................... 83 B ef or e y ou c o nt ac t HP ..........................................................................................
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1 C ust omer se lf r epair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement.
Les pièces CSR sont livrées le jour ouvré suiv ant, dans la limite des stocks disponibles et selon votre situation géographique. Si v otre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée.
• Z wingend T eile, für die das Customer Self Repair-V erfahren zwingend vorgegeben ist. W enn Sie den Austausch dieser T eile von HP v ornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet. • Optional T eile, für die das Customer Self Repair-V erfahren optional ist.
normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío.
• Obrigatória P eças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. • Opcional Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente.
12 Customer self repair.
2 Illus tr ated P ar ts Cat alog In this section • “Mechanical components” (page 13) • “System components” (page 16) Mec hanical co mponen ts IMPORT ANT: The list of part numbers is current and correct as of the publication of the document.
Customer self repair ( Chapter 1 (page 7) ) Spare part number Assembly part number Description Item Mandatory 1 491911-001 AH233-3417A Filler , memory air blocker (DIMM filler) * Optional 2 491102-001.
3 No: Kein—Einige T eile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das T eil von einem HP Servicepartner ersetzt w erden. Im illustrierten T eilekatalog sind diese T eile mit „No“ bzw .
S y stem com ponents 16 Illustrated P arts Catalog.
IMPORT ANT: The list of part numbers is current and correct as of the publication of the document. P art numbers change often. Check the HP Partsurfer w ebsite, http://partsurfer .hp.com/ , to ensure you hav e the latest part numbers associated with this server .
Customer self repair ( Chapter 1 (page 7) ) Spare part number Assembly part number Description Item Optional 2 448405-001 448208-001 AMD Opteron 8356 2.3 GHz 75W replacement kit (G5) Optional 2 448404-001 448208-002 AMD Opteron 8354 2.2 GHz 75W replacement kit (G5) Optional 2 508593-001 509498-001 AMD Opteron 8384 2.
Customer self repair ( Chapter 1 (page 7) ) Spare part number Assembly part number Description Item Mandatory 1 404785-001 375861-B21 72 GB 10k SAS single port hard drive Mandatory 1 432321-001 418373.
2 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
1 Mandatory: Obrigatória—P eças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. 2 Optional: Opcional—P eças cujo reparo feito pelo cliente é opcional.
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3 R emo val and r eplacemen t pr ocedur es In this section • “Required tools” (page 23) • “Safety considerations” (page 23) • “Preparation procedures” (page 24) • “Media module (.
T o prevent electrostatic damage: • A void hand contact by transporting and storing products in static-safe containers. • Keep electrostatic-sensitiv e parts in their containers until they arrive at static-free workstations. • Place parts on a grounded surface before removing them from their containers.
P ow er do wn the se r v er IMPORT ANT: If installing a hot-plug device, it is not necessary to pow er down the server . T o power down the server: 1. Shut down the OS as directed by the OS documentation. 2. Press the P ower On/Standby button to place the serv er in standby mode.
NO TE: The release latches will lock into place when the rails are fully extended. W ARNI NG! T o reduce the risk of personal injury , be careful when pressing the server rail-release latches and sliding the server into the rack. The sliding rails could pinch y our fingers.
5. Place the server on a sturdy , level surface. R emo v ing the acces s panel W ARNI NG! T o reduce the risk of personal injury from hot surfaces, allow the driv es and the internal system components to cool before touching them. CA UTION: Do not operate the serv er for long periods with the access panel open or removed.
4. After installing hardw are options, replace the access panel. Be sure that the panel is securely locked into place before powering up the serv er . Media module (S ID asse mbly) T o remove the media module: 1. P ower down the serv er ( “Pow er down the server ” (page 25) ).
NO TE: The release latch does not need to be pressed to reinsert the media module. F r ont Bez el T o remove the front bezel: 1. P ower down the serv er ( “Pow er down the server ” (page 25) ).
1. P ower down the serv er ( “Pow er down the server ” (page 25) ). 2. Press the release button. 3. Open the lever . 4. Grasp the lever and slide the processor memory cell from the enclosure. Place a hand under the component to support it as y ou remove it from the enclosure.
CA UTION: The cell filler is required to be place in cells 3 – 6 in a four-processor configuration. CA UTION: Before starting this procedure, read the information about protecting against electrostatic discharge ( “Preventing electrostatic discharge” (page 23) ).
5. Remove the heatsink. 6. Open the processor retaining latch and the processor socket retaining bracket. 32 Remov al and replacement procedures.
7. Using your fingers, remov e the failed processor . 8. If the processor has separated from the installation tool, carefully reinsert the processor in the tool. IMPORT ANT: Be sure the replacement processor remains inside the processor installation tool.
11. Close the processor retaining latch and the processor socket retaining bracket. 34 Remov al and replacement procedures.
12. Clean the old thermal grease from the heatsink with an alcohol sw ab. Allow the alcohol to ev aporate before continuing. 13. Apply all the new grease to the top of the processor in one of the following patterns to ensure even distribution. 14. Install the heatsink.
17. Install the processor memory cell into the serv er . 18. P ower up the serv er . DIMMs Each processor memory cell can hold two to eight DIMMs, At least one pair of DIMMs must be installed in slots 1A and 2A on each processor memory cell to operate the serv er .
S A S har d dri v e blank T o remove a SAS hard driv e blank: 1. Squeeze the tabs on the front of the filler to release it from the slot in the driv e bay .
T o replace the component, reverse the remov al procedure. D VD , CD dri v e or blank T o remove a DVD, CD driv e or blank: 1. P ower down the serv er ( “Pow er down the server ” (page 25) ). 2. Extend or remove the serv er from the rack ( “Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26) ).
3. Remove the pow er supply . T o replace the component, reverse the remov al procedure. Hot-plug fans The server supports redundant hot-plug fans, each with tw o individual fans rotors, in a 5+1 configuration to provide proper airflow to the server .
2. Pull on the fan tray release bar , pull the fan housing unit straight out from the rear of the chassis until it stops, and tilt the tray down to expose the fan housing unit. 3. Insert your thumb and forefinger into the openings on the top of the fan and squeeze until the fan releases from the socket.
5. Pull the fan straight up and out of the chassis. IMPORT ANT: Remov e and replace only one fan at a time. If the system detects two fan failures, the server shuts down to av oid thermal damage. 6. Install a new hot-plug fan. CA UTION: T o prevent serv er components from overheating, replace a fan within 20 seconds.
T o replace the component, reverse the remov al procedure. Expansi on boar ds PCIe I/O backplane Description Item PCI Express x8 non-hot-plug expansion slot 11 1 PCI Express x16 non-hot-plug expansion.
PCIe I/O backplane Description Item PCI Express x4 non-hot-plug expansion slot 4 8 PCI Express x4 non-hot-plug expansion slot 3 9 PCI Express x4 non-hot-plug expansion slot 2 10 PCI Express x8 non-hot.
2. Extend or remove the serv er from the rack ( “Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26) ). 3. Remove the access panel ( “Removing the access panel” (page 27) ). 4. Disconnect any internal or external cables attached to the expansion board.
CA UTION: Do not detach the cable that connects the battery pack to the cache module. Detaching the cable causes any unsaved data in the cache module to be lost. R emo v ing the cac he module CA UTION: After the serv er is powered down, w ait 15 seconds and then check the amber LED before unplugging the cable from the cache module.
3. Remove the access panel ( “Removing the access panel” (page 27) ). CA UTION: T o prevent a serv er malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress.
IMPORT ANT: The battery pack might hav e a low charge when installed. In this case, a POST error message displays when the serv er is powered up, indicating that the battery pack is temporarily disabled. No action is necessary . The internal circuitry automatically recharges the batteries and enables the battery pack.
T o replace the component, reverse the remov al procedure. SP I (cor e I/O) boar d The System P eripheral Interconnect (SPI) board implements all the logic to support the internal devices and the standard connectivity of the product. The board includes a RAID5 SAS controller which supports up to eight of the sixteen embedded SAS disk drives.
1. P ower down the serv er ( “Pow er down the server ” (page 25) ). 2. Extend or remove the serv er from the rack ( “Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26) ). 3. Remove the access panel ( “Removing the access panel” (page 27) ).
8. Pull the I/O backplane assembly out of the chassis. T o replace the component, reverse the remov al procedure. Mi dplane boar d CA UTION: Before starting this procedure, read the information about protecting against electrostatic discharge ( “Preventing electrostatic discharge” (page 23) ).
CA UTION: When removing the midplane board do not allow the low er connectors to touch the chassis. Allowing the midplane board connectors to touch the chassis can damage the board. 10. Tilt the board to avoid contact betw een the lower connectors and the chassis, and pull the board out through the front of the serv er .
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4 Di agnos tic tools In this section • “SmartStart softw are” (page 53) • “SmartStart Scripting T oolkit” (page 53) • “HP Instant Support Enterprise Edition” (page 54) • “Option .
server configuration process. This automated serv er configuration process cuts time from each server deploy ed, making it possible to scale server deployments to high volumes in a rapid manner . For more information, and to download the SmartStart Scripting T oolkit, refer to the HP website ( http://www.
R OMP aq utilit y The ROMP aq utility enables you to upgrade the system firmw are (BIOS) or Lights-Out 100 firmw are. T o upgrade the firmware, insert a ROMP aq diskette into the diskette drive or ROMP aq USB Key into an available USB port and boot the system.
access to any authorized network client, sends alerts, and provides other serv er management functions. Using iLO 2, you can: • Remotely power up, pow er down, or reboot the host server . • Send alerts from iLO 2 regardless of the state of the host server .
by default in the system ROM. HP hardw are supports USB version 1.1 or 2.0, depending on the version of the hardw are. Legacy USB support provides USB functionality in environments where USB support is normally not av ailable.
3. Reseat the remaining processors, rebooting after each installation to identify any failed processors. 4. Replace the processor in socket 1. 5. Replace the processor board, if applicable.
2. Bring the server to base configuration by removing all components that are not required by the server to complete POST . This process can include removing all: • “Expansion boards” (page 42) .
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5 C ompo nent i dentif i catio n In this section • “Front panel components” (page 61) • “Front panel LEDs and buttons” (page 63) • “System Insight Display LEDs” (page 64) • “SAS .
Description Item Hard drive bay 3 right 8 Hard drive bay 4 right 9 Hard drive bay 5 right 10 Hard drive bay 6 right 11 Hard drive bay 7 right 12 Hard drive bay 8 right 13 Hard drive bay 1 left (option.
F r ont panel LEDs and buttons Status Color Description Item UID button is not activated Off UID button and LED 1 UID button is activated for serv er identification Solid blue Server is being remotely.
Status Color Description Item NIC not used NO TE: Rear panel NIC can show link or activity while in standby mode. Off NIC 2 LED 5 Linked to the network Solid green Linked with activity on the network .
system attributes. The System Insight Display LEDs identify components experiencing an error , event, or failure. CA UTION: Do not block airflow by pushing the SID flush against the serv er while it is in the down position. IMPORT ANT: When removing the access panel to view the Systems Insight Display LEDs, leav e the server pow ered on.
Component LED Processor PROCESSOR/MEMOR Y BOARD X PROC X Processor DIMM board PROCESSOR/MEMOR Y BOARD X BOARD X S A S and S A T A hard dr i ve LEDs Status Color Des cription Item Drive failure Amber F.
Interpretation Fault/UID LED (amber/blue) Online/activity LED (green) The drive is online, but is not currently activ e. Off On CAUT I ON: Do not remov e the drive.
Description Item DIMM slot 6C 6 DIMM slot 7D 7 DIMM slot 8D 8 Processor socket 9 R ear panel com ponents Description Item NIC connector 1 1 Keyboard connector 2 USB connector 3 Video connector 4 Seria.
Description Item Fan 5 18 Fan 6 19 R ear panel LEDs and buttons Status LED Color Des cription Item Activ ated Solid blue UID 1 Server remotely managed Flashing blue Deactiv ated Off Linked to network .
P o w er suppl y LED Status Color No ac power Off ac power; standby pow er on Blinking green Full power on; normal operation Solid green P ower supply failure Blinking amber Inte rnal co mponen ts Des.
Description Item Fan 1 4 System maintenance switch SW6 5 System maintenance switch SW1 6 SPI Board 7 PCI Express x8 non-hot-plug expansion slot 11 8 PCI Express x16 non-hot-plug expansion slot 10 9 PC.
Combo PCIe/HTx I/O backplane Description Item Blank slot 3 HyperT ransport non-hot-plug expansion slot 8 4 PCI Express x4 non-hot-plug expansion slot 7 5 PCI Express x4 non-hot-plug expansion slot 6 6.
Function Sw itch Description P osition System configuration can be changed Off Configuration lock 2 System configuration is locked On Reserved — Reserved 3 Reserved — Reserved 4 P assword is enabl.
S y stem maint enance s w itc h (S W1 ) CA UTION: All supported AMD Opteron quad-core processors 3.1 GHz or greater and all supported AMD Opteron six-core processors require the system maintenance switch, located on the I/O backplane, (SW1) position 5 to be in the On position.
T able 5- 2 Batter y health and BBW C status LED patterns (continued) Interpretation LED 4 pattern LED 3 pattern The battery pack is below the minimum charge level and is being charged.
Description Item Fan 1 1 Fan 2 2 Fan 3 3 Fan 4 4 Fan 5 5 Fan 6 6 76 Component identification.
6 C abling In this section • “Cabling overview” (page 77) • “BBWC cabling” (page 77) • “SAS and SA T A hard drive cabling” (page 78) • “SAS expander cabling” (page 78) • “H.
S A S and S A T A hard dr i ve ca bling CA UTION: When routing cables, alw ays be sure that the cables are not in a position where they can be pinched or crimped. S A S e xpander cabling T o install a SAS expander: 1. P ower down the serv er ( “Pow er down the server ” (page 25) ).
6. Install together the Smart Array Controller into slot 1 and the SAS expander into slot 2 ( “Expansion boards” (page 42) ). 7. Route and connect the cables from the SAS expander to the SAS backplanes.
TIP: For best cable management route the cable to SAS backplane 1 under the pow er cable at the power supply backplane and the cable to SAS backplane 2 under other cables in the center cable routing channel. Hi gh po w er gr aphic s car d cabling IMPORT ANT: Install high pow ered graphics cards in PCIe 16x slots for optimum performance.
7 S pec if i catio ns In this section • “Environmental specification” (page 81) • “Server specifications” (page 81) En vir onmental s pec ifi cation V alue Specification T emperature range 10°C to 35°C (50°F to 95°F) 1 Operating -30°C to 60°C (-22°F to 140°F) 2 Non-operating 28°C (82.
V alue Specification 47- 63 Hz 47- 63 Hz Rated input frequency 14A at 200 V ac 24A at100 V ac Rated input current 2800 W 2400 W Rated input power 9554 8189 BTUs per hour High line 3 Low line Power supply output 1200 W per P .S.U. at 3 P .S.U. active 800 W per P .
8 T echni cal support In this section • “Before you contact HP” (page 83) • “HP contact information” (page 83) Bef or e yo u contac t HP Be sure to have the following information av ailabl.
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A A c r on y ms and abbr e v iati ons ABEND abnormal end ACU Array Configuration Utility ADU Array Diagnostics Utility AMD Adv anced Micro Devices ASR Automatic Server Recov ery BBWR battery-backed wr.
TMRA recommended ambient operating temperature UID unit identification UPS uninterruptible pow er system USB univ ersal serial bus VCA V ersion Control Agent 86 Acronyms and abbreviations.
Inde x A access panel, 27 ASR ( see Automatic Server Recov ery (ASR)) Automatic Server Recov ery (ASR), 56 B battery-backed write cache battery pack, 45 data recovery , 47 battery-backed write cache (.
R rack extending server from, 25 removing server from, 26 RBSU (HP ROM-Based Setup Utility), 54 remov al and replacement procedures, 23 required tools, 23 ROM updating, 55 ROMP aq Utility , 55 S safet.
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*AH233-9002A_ed7* Prin ted in the US.
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