Benutzeranleitung / Produktwartung BL685C G6 des Produzenten HP (Hewlett-Packard)
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HP Pr oL iant BL6 8 5c G6 Ser v er Blade Maintenance and S erv ice Gui de Part Number 508504-001 April 2009 (First Edition).
© Copyright 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice . The only warranties for HP products and services are set forth in the express warranty statements accompanying such produc ts and services.
Contents 3 Con t en t s Customer self repair ........................................................................................................... ........... 5 Parts only warr anty service .......................................................
Contents 4 HP Insight Remote Support so ftware ............................................................................................. .............. 54 USB support and functionality ..............................................................
Customer self repair 5 C ustome r sel f r e pa ir HP products are designed with many Customer Self Repair (CSR) parts to minimi ze repair time and allow for greater flexibility in performing defe ctive parts re placement.
Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplac ement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative.
Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostitui te da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materiali en, die mit einem CSR- Ersatzteil geliefert werden, könn en Sie entnehmen, ob das defekte Teil an HP zurückgesch ickt werden muss.
Customer self repair 9 Centro de asistencia técnica de HP y reci birá ayu da telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componente s CSR, HP especificará si los comp onentes defectuosos deberán devolverse a HP.
Customer self repair 10 periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegel everde verpakkingsmateriaal. Als u het defecte onderdeel niet t erugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen.
Customer self repair 11 Se r v iço de gar anti a ape nas par a peças A garantia limitada da HP pode incluir um serviço de garantia apenas para pe ças. Segundo os termos do serviço de garantia apenas para peças, a HP fo rnece as peças de reposição sem cobrar nenhuma taxa.
Customer self repair 12.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Illustrated parts catalog 16 Illus tr ated par ts catalog Server blade components Item Description Spare part number Customer self repair (on page 5 ) 1 Access panel 532159-001 Ma ndatory 1 2 Heatsink — — a) Processor 1 and 2 511658-001 Optional 2 b) Processor 3 and 4* 511659-001 Optional 2 3 Processor — — a) 2.
Illustrated parts catalog 17 Item Description Spare part number Customer self repair (on page 5 ) c) 4-GB, PC2-6400, RoHS* 501158-001 Mandatory 1 d) 4-GB, PC2-6400, LP* 504589-001 Mandatory 1 e) 8-GB,.
Illustrated parts catalog 18 Item Description Spare part number Customer self repair (on page 5 ) d) HP NC364m Quad Port 1GbE BL-c Adapter 448066-001 Mandatory 1 e) HP NC382m Dual Port 1GbE Multifunct.
Illustrated parts catalog 19 3 No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider re place the part. These parts are identified as "No" in the Illustrated Parts Catalog.
Illustrated parts catalog 20 2 Optional: Opcional—Peças cujo reparo feito pelo cl ient e é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
Removal and replacement procedures 21 R emo v al and r eplacement pr ocedur es Required tools You need the following item s for some procedures: • T-15 Torx screwdriver (provided inside the access p.
Removal and replacement procedures 22 CAUTION: When performing non-hot-plug operatio ns, you must power down the serv er blade and/or the system. However, it may be necessar y to leave the server blade powered up when performing other operations, such as hot- plug installations or troubleshooting.
Removal and replacement procedures 23 Power down the server blade Before powering down the server blade for any up grade or maintenance procedures, perform a backup of critical server data and programs.
Removal and replacement procedures 24 3. Remove the server blade. 4. Place the server blade on a flat, level work surface. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Removal and replacement procedures 25 CAUTION: To prevent damage to electrical componen ts, properly ground the server blade before beginning any installation procedure. Improper ground ing can cause ESD. To replace the component: 1. Place the access panel on top of the server blade.
Removal and replacement procedures 26 3. Remove the hard drive. To replace the component, reverse the r emoval procedure. Solid state drive WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Removal and replacement procedures 27 To replace the component, reverse the r emoval procedure. DIMM baffle CAUTION: To avoid damage to the server blade and the enclosure, install all DIMM baffles in the proper location after adding or replacin g DIMMs.
Removal and replacement procedures 28 6. Remove the DIMM. When replacing DIMMs for processors 3 and 4, it may be helpful to remove the following items: • Hard drives (" Hard drive " on pag.
Removal and replacement procedures 29 o Mezzanine 1 and 2 o Mezzanine 3 CAUTION: To prevent damage to the server bl ade, apply pressure over the mezzanine connector when installing the mezzanine card. Do not apply pressure to the edges of the c ard. To replace the component, reverse the r emoval procedure.
Removal and replacement procedures 30 4. Remove the controller. To replace the component, reverse the r emoval procedure. Battery-backed write cache procedures Two types of procedures ar e provided fo.
Removal and replacement procedures 31 4. Remove the cache module. To replace the component, reverse the r emoval procedure. Cache module battery pack To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ).
Removal and replacement procedures 32 o Mezzanine card controller option 5. Disconnect the battery pack. To replace the component, reverse the r emoval procedure. Recovering data from the battery-backed write cache If the server fails, use the follow ing procedure to recover data temporarily stored in the BBWC.
Removal and replacement procedures 33 o Find a server that has enough empty drive bays to accommodate all the drives from the failed server and that meets all the other requ irements for drive and array migration. 2. Power down the failed server (" Power down the server blade " on page 23 ).
Removal and replacement procedures 34 Server blade release lever and button To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ).
Removal and replacement procedures 35 To replace the component, reverse the r emoval procedure. Heatsink To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ).
Removal and replacement procedures 36 2. Remove the thermal interface prot ective cover from the heatsink. CAUTION: Heatsink retaining screws sho uld be tigh tened in diagonally o pposite pairs (in an "X" pattern).
Removal and replacement procedures 37 Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent possible serv er malfunction, do not mix processors of different speeds or cache sizes.
Removal and replacement procedures 38 6. Using your fingers, remove the failed pro cessor. To replace the component: CAUTION: The pins on the proces sor socket are very fragile.
Removal and replacement procedures 39 1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. 2. Align the processor installation tool with the socket and install the processor. CAUTION: The processor is design ed to fit one way into the socket.
Removal and replacement procedures 40 3. Press down firmly until the proces sor installation tool clicks and separates from the processor, and then remove the processor installation tool. 4. Close the processor retaining bracket and the processor retaining latch.
Removal and replacement procedures 41 7. Remove the thermal interface prot ective cover from the heatsink. CAUTION: Heatsink retaining screws sho uld be tigh tened in diagonally o pposite pairs (in an "X" pattern).
Removal and replacement procedures 42 8. Install the heatsink. 9. Install the front panel/hard drive cage assembly (" Front panel/hard drive cage assembly " on page 33 ), if removed. 10. Install the SAS controller (" SAS controller " on page 29 ), if removed.
Removal and replacement procedures 43 5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery , reconfigure t he system through RBSU. To replace the component, reverse the r emoval procedure.
Removal and replacement procedures 44 13. Open the processor retaining latch and the processor socket retaining bracket. 14. Using your fingers, remove the proces sor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts.
Removal and replacement procedures 45 o Near mezzanine card connector o Near SD card slot.
Removal and replacement procedures 46 16. Remove the failed system board. To replace the system board: 1. Install the spare system board. 2. Prepare the processor socket on the spare syst em board:.
Removal and replacement procedures 47 a. Remove the processor socket protective cover. b. Open the processor retaining latch and the processor socket retaining bracket. 3. Install the processor socket cove r onto the processor socket of the failed system board.
Removal and replacement procedures 48 5. Close the processor retaining latch and th e processor socket retaini ng bracket. 6. Clean the old thermal grease from the he atsink an d the top of the proc essor with the alcohol swab. Allow the alcohol to evapo rate before continuing.
Removal and replacement procedures 49 IMPORTANT: Heatsinks for processors 1 and 2 are no t interchangeable with the heatsinks for processors 3 and 4. 8. Install the heatsink. IMPORTANT: Install all components with the same co nfiguration that was used on the failed system board.
Cabling 50 Cabl i n g SSD cable routing Using the HP c-Class Blade SUV Cable The HP c-Class Blade SUV Cable enables the user to perform server blade adminis tration, configuration, and diagnostic procedures by connecting video and USB devices directly to the server blade.
Cabling 51 Accessing a server blade with local KVM CAUTION: Before disconnecting the SUV cable from t he connector, always squeeze the release buttons on the sides of the connector. Failure to do so can result in damage to the equipment. NOTE: For this configuration, a USB hub is not nec essary.
Cabling 52 4. Connect the following to the USB hub: o USB CD/DVD-ROM drive o USB keyboard o USB mouse o USB diskette drive NOTE: Use a USB hub when connecting a USB di skette drive and/or USB CD-ROM drive to the server blade. The USB hub pr ovides additional connections.
Diagnostic tools 53 Di agnosti c tools Troubleshooting resources The HP ProLiant Servers Troubleshoot ing Guide provides procedures for resolving common problems and comprehensive courses of action fo.
Diagnostic tools 54 You can view recorded events in the IML in several ways, including t he following: • From within HP SIM • From within operating system-specific IML viewer s: o For NetWare: IML.
Diagnostic tools 55 agreements. Download from the HP website ( http://h20392.www2.hp.com/portal/swdepot/di sp layProductInfo.do? productNumber=ISDVD ). Both HP Insight Remote Support solutions are availabl e at no additional cost to customers with a valid warranty on HP technology, an HP Care Pack Se rvice or HP contractual support agreement.
Component identification 56 C omponen t identif icati on Front panel components Item Description 1 Serial label pull tab 2 HP c-Class Blade SUV Cable connec tor* 3 Power On/Standby button and LED 4 Se.
Component identification 57 Item Description Status 2 Health LED Green = Normal operation Amber flashing = Degraded condition Red flashing = Critica l condition 3 Flex 1 LED Green = Network linked Gre.
Component identification 58 Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) SAS and SATA hard drive LED combinations NOTE: Predictive failure alerts can occur only when the hard drive is connected to a Smart Array controller.
Component identification 59 System board components Item Description 1 Processor 4 DIMM slots 2 Processor socket 4 3 Processor socket 2 (populated) 4 System maintenance switch 5 Processor 2 DIMM slots.
Component identification 60 The symbols correspond to the symbols located on the inte rconnect bays. For more information, see the HP ProLiant BL685c G6 Serve r Blade Installation Instructions that ship with the server blade. Mezzanine connector definitions PCIe x8 mezzanine connec tors support x16 cards at up to x8 speeds.
Component identification 61 • Processor 2 DIMM slots • Processor 3 DIMM slots.
Component identification 62 • Processor 4 DIMM slots System maintenance switch Position Function Default 1* iLO 2 security override Off 2 Configuration lock Off 3 Reserved Off 4 Reserved Off 5* Password disabled Off 6* Reset configuration Off 7 Reserved Off 8 Reserved Off *To access redundant ROM, set S1, S5, and S6 to ON.
Component identification 63 3. Remove the access panel (" Access panel " on page 24 ). 4. Change position 6 of the system maintena nce switch to on. 5. Install the access panel (" Access panel " on page 24 ). 6. Install the server blade in the enclosure and power up the server blade.
Component identification 64 HP c-Class Blade SUV Cable Item Connector Description 1 Server blade For connecting to the SUV connector on the server blade front panel 2 Video For connecting a video moni.
Specifications 65 Sp e c i fic a t io n s Environmental specifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 60 ° C (-40 ° F t.
Acronyms and abbreviations 66 A c r on y ms and abbr e v iati ons ADU Array Diagnostics Utility CSR Customer Self Repair ESD electrostatic discharge FC Fibre Channel HBA host bus adapter iLO 2 Integra.
Acronyms and abbreviations 67 SFF small form-factor SIM Systems Insight Manager TPM trusted platform module UID unit identification USB universal serial bus.
Index 68 A access panel 24 ADU (Array Diagnostic Utility) 54 air baffle 27 B baffles 27 battery 42 battery pack, removing 31 battery-backed write cache battery pack 31 BBWC (battery-backed wri.
Index 69 S safety considerations 21 safety information 21 SAS backplane 29 SAS controller 29 SAS drives 25, 58 SAS hard drive LEDs 57, 58 SAS/SATA LED combinations 58 SATA hard drive 58 SATA hard .
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