Benutzeranleitung / Produktwartung BL465C des Produzenten HP (Hewlett-Packard)
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HP Pr oL iant BL4 6 5c S erv er Blade Maintenance and S erv i ce Guid e Part Number 418192- 006 May 2008 (Sixth Editio n).
© Copyright 2006, 2008 Hewlett-Pa ckard Development Company, L.P. The in formati on con taine d here in is subject to chan ge with out n otice. The on ly war ranti es for H P produ cts and serv ices ar e set forth in th e ex press warrant y stat ements accom panyin g such produ cts and serv ices.
Contents 3 Con t e n t s Custom er self re pair ........................................................................................................... ........... 5 Parts only warra nty se rvice ...................................................
Contents 4 Open Servic es Even t Mana ger .................................................................................................... ................ 53 USB supp ort a nd fun ctiona lity ......................................................
Customer self repair 5 C ust omer self r epair HP products are designed with many Customer Self Repair (CSR) parts to minimize r epair time and allow for greater flexibility in performing defective parts re placement.
Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vou s demandez à HP de remplacer ces pièces, les coûts de déplacement et main d' œuv re du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative.
Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste par ti siano sostituit e da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR- Ersatzteil geliefert werden, k önnen Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss.
Customer self repair 9 Centro de asistencia técnica de HP y recibirá ay uda telefónica por parte de un técni co. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectu osos deberán devolverse a HP.
Customer self repair 10 periode, gewoonlijk vijf (5) we rkdagen, retourneren aan HP. Het defecte on derdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen.
Customer self repair 11 Se r v iço de gar anti a apen as par a peças A garantia limitada da HP pode incluir um serviço de garantia apenas para pe ças. Segundo os termos do serviço de garantia apenas para peças, a HP fo rne ce as peças de reposição sem cobrar nenhuma taxa.
Customer self repair 12.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Illustrated parts catalog 16 Illus tr ated par ts cata log Server blade components Item Description Spare part number Customer self repai r (on page 5 ) 1 Access panel 418273-001 Mandatory 1 2 Hard drive blan k 392613-001 Mandatory 1 3 Front panel/hard dri ve cage assembly with front panel LED/board 418271- 001 Optional 2 4 Processors — — a) 3.
Illustrated parts catalog 17 Item Description Spare part number Customer self repai r (on page 5 ) f) 2.4-GH z AMD Opteron™ Model 2216 HE* ** 419479-001 Optional 2 g) 2.2-GH z AMD Opteron™ Model 2214 HE* ** 419477-001 Optional 2 h) 2.0-GH z AMD Opteron™ Model 2212 HE* ** 419475-001 Optional 2 i) 1.
Illustrated parts catalog 18 Item Description Spare part number Customer self repai r (on page 5 ) 11 System battery* 234556-001 Mandatory 1 12 HP c -Class Blade SUV Cable* 416003-001 Mandatory 1 13 M.
Illustrated parts catalog 19 3 No: Non— Certaines pièces HP n e sont pas conçues pour per mettre au cli ent d'effectuer lui- même la réparation . Pour que la garantie pui sse s'appliquer, HP ex ige que le remplacemen t de la pièce soit effec tué par un Mainteneur Ag réé.
Illustrated parts catalog 20.
Removal and replac ement procedures 21 R emo val and r e placement pr ocedur es Required tools You need the following items for some pro cedures: • T-15 Torx screwdriver (provided inside the access .
Removal and replac ement procedures 22 CAUTION: When performing non-hot-plug operatio ns, you must power down the serv er blade and/or the system. However, it may be necessary to leave the server blade powered up when performing other operations , such as hot-plug installatio ns or troubleshooting.
Removal and replac ement procedures 23 Power down the server blade Before powering down the server blade for any up grade or maintenance procedure s, perform a backup of critical server data and programs.
Removal and replac ement procedures 24 4. Place the server blade on a flat, level work surface. WARNING: To reduce the risk of personal injury from hot surfaces, allow the dr ives and the internal system components to cool before touch ing them.
Removal and replac ement procedures 25 Remove the component as indicated. To replace the blank, slide the blank into the bay until it locks into pla ce.
Removal and replac ement procedures 26 To replace the component: 1. Prepare the hard drive. 2. Install the hard drive. DIMM baffle To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ).
Removal and replac ement procedures 27 4. Remove the DIMM baffles. To replace the component, reve rse the removal procedure. DIMMs To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ).
Removal and replac ement procedures 28 Hard drive backplane To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ). 4. Remove all hard drives (" Hard drive " on page 25 ).
Removal and replac ement procedures 29 7. Remove the front panel/hard drive cage assembly. To replace the component, reve rse the removal procedure. Mezzanine card Optional mezzanine cards enable network connectivity and provide Fibre Channel support.
Removal and replac ement procedures 30 To replace the component: 1. Install the mezzanine card. Press down above the back side of the connector to seat the card. 2. Install the access panel (" Access panel " on page 24 ). 3. Install the server blade.
Removal and replac ement procedures 31 9. Remove the HP Smart Array E200i Controller cach e module. To replace the component, reve rse the removal procedure.
Removal and replac ement procedures 32 10. Remove the HP Smart Array E200i Controller battery pac k. To replace the component, reve rse the removal procedure. Server blade handle To remove the component: 1. Power down the server blade (on page 23 ). 2.
Removal and replac ement procedures 33 8. Remove the server blade handle. To replace the component, reve rse the removal procedure. Release button To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ).
Removal and replac ement procedures 34 8. Remove the release button. To replace the component, reve rse the removal procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the dr ives and the internal system components to cool before touch ing them.
Removal and replac ement procedures 35 To replace the component: 1. Clean the old thermal grease from the proc esso r with the alcohol swab. Allow the a lcohol to evaporate before continuing. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the proc essor after it has been installed.
Removal and replac ement procedures 36 4. Install the heatsink. 5. Install the access panel (" Access panel " on page 24 ). 6. Install the server blade. Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow the dr ives and the internal system components to cool before touch ing them.
Removal and replac ement procedures 37 5. Open the processor retaining latch and th e processor socket retaining bracket. 6. Using your fingers, remove the failed proc essor. To replace the component: CAUTION: The pins on the processor socket ar e very fragile.
Removal and replac ement procedures 38 1. If the processor has separated from the installation to ol, carefully re-insert the processor in the tool. 2. Align the processor installation tool with the socket and install the processor. CAUTION: The processor is designed to fit o ne wa y into the socket.
Removal and replac ement procedures 39 3. Press down firmly until the processor installation t ool clicks and separates from the processor, and then remove the processor installation tool. 4. Close the processor retaining bracke t and the processor retaining latch.
Removal and replac ement procedures 40 CAUTION: Heatsink retaining screws should be tigh tened in diagonally opposite pairs (in an "X" pattern). NOTE: The T-15 Torx screw driver is attached to the server access panel. 7. Install the heatsink.
Removal and replac ement procedures 41 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ). 4. Remove all hard drive blanks (" Hard drive blank " on page 24 ). 5. Remove all hard drives (" Hard drive " on page 25 ).
Removal and replac ement procedures 42 15. Using your fingers, remove the proc e ssor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover afte r removing the processor from the sock et.
Removal and replac ement procedures 43 1. Install the spare system board assembly. 2. Prepare the processor socket o n the spare system board: a. Remove the processor socket protective cover.
Removal and replac ement procedures 44 b. Open the processor retaining latch and th e processor socket retaining bracket. 3. Install the processor socket cover onto the proc essor socket of the failed sy stem board. 4. Install the processor on th e spare system board.
Removal and replac ement procedures 45 5. Close the processor retaining latch and th e processor socket retaining bracket. 6. Clean the old thermal grease from the heatsink an d the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.
Removal and replac ement procedures 46 1. During the server startup sequ ence, press the F9 ke y to access RBSU. 2. Select the System Options menu. 3. Select Serial Number . The following warning is displayed: WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified.
Removal and replac ement procedures 47 5. Remove the battery. IMPORTA NT: Replacing the system board battery re sets the system ROM to its default configuration. After replacing the battery, reconfigure th e system through RBSU. To replace the component, reve rse the removal procedure.
Cabling 48 Cabl in g Using the HP c-Class Blade SUV Cable The HP c-Class Blade SUV Cable enables the user to perform server blade administration, configuration, and diagnostic procedures by connecting video and US B devices directly to the server blade.
Cabling 49 4. Connect a USB keyboard to the second USB connector. Item Description 1 Monitor 2 USB mouse 3 USB keyboard 4 HP c-Class Blade SUV Cable Accessing local med ia devices Use the following configuration when configuring a serv er blade or loading software updates and patches from a USB CD/DVD-ROM or a USB diskette.
Cabling 50 o USB diskette drive Item Description 1 Monitor 2 USB CD/D VD-ROM drive or diskette driv e 3 USB keyboard 4 USB hub 5 USB mouse 6 HP c-Class Blade SUV Cable.
Diagnostic tools 51 Di agno sti c too ls Troubleshooting resources The HP ProLiant Serve rs Troubleshooting Guide provides procedures for resolving c ommon problems and comprehensive courses of action.
Diagnostic tools 52 This functionality supports operatin g systems that may not be supported by the server blade. For operating systems supported by the server blade, see the HP webs ite ( http://www.
Diagnostic tools 53 HP Instant Support Enterprise Edition ISEE is a proactive remote monitori ng and diagnostic t ool to help ma nage your systems and devices, a feature of HP support. ISEE provides continuous hardwa re event monitoring and automated notification to identify and prevent potential critical problems.
Diagnostic tools 54 • Operating environments whic h do not provide nativ e USB support For more information on Pro Liant US B support, refer to t he HP website ( http://h18004.
Component identification 55 C ompo nent identif icati on Front panel components Item Description 1 Hard drive bay 1 2 Power On/ Standby button 3 SUV connector* 4 Hard drive bay 2 5 Server blade handle.
Component identification 56 Front panel LEDs Item Description Status 1 UID LED Blue = Identified Blue fla shing = A ctive remote manageme nt Off = No act ive remot e manag ement 2 Health LED Green = N.
Component identification 57 SAS and SATA hard drive LEDs Item Description 1 Fault/U ID LED (amber/blue) 2 Onlin e LED (gree n) SAS and SATA hard drive LED combinations Online/activity LED (gr een) Fau.
Component identification 58 Online/activity LED (gr een) Fault/UID LE D (amber/blue) Interpretation Flashing irreg ularly Amber, flashin g regularly (1 Hz) The drive is active, but a predi ctive fai lure alert has been received for th is drive. Replace the drive as soon as possi ble.
Component identification 59 Item Description 13 DIMM slots (Processor 2 mem ory banks C and D) 14 HP Smart Array E200i cach e mo dul e (under har d drive cage) 15 System board thumbscrew The symbols correspond to the sym bols located on the inte rconnec t bays.
Component identification 60 *To access redundan t ROM, set S1, S5, an d S6 to ON. System maintenance switch procedures When you perform troubleshooting steps, this guide ma y instruct you to perform the following procedures: • Clear the system configuration (" C learing the system configuration " on page 60 ).
Component identification 61 9. Repeat steps 5 and 6. If both the current and redundant ROM are corrupted, return the sy stem board for a service replacement.
Specifications 62 Sp e c i fica t io n s Environmental specifications Specification Value Tempera ture rang e* Operat ing 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 60 ° C (-40 ° F.
Acronyms an d abbreviations 63 A c r on y ms and abbr e v i ati ons ADU Array Diagnostics Utility BBWC battery-backed write cache CSR Customer Self Repair DIMM dual inline memory module ESD electrosta.
Acronyms an d abbreviations 64 PCI peripheral component interface PCIe peripheral component interconnect express RBSU ROM-Based S etup Utility ROM read-only memory SAS serial attached SCSI SATA serial.
Index 65 A access panel 24 ADU (Array Diagnostic Utility) 52 Array Diagnostic Utility (ADU) 52 B baffles 26 battery 46 battery-backed write cache (BBWC) 30 battery-backed write cache battery pack 31 b.
Index 66 R release button 33, 55 removing the access panel 24 removing the server blade 23 required tools 21 S safety considerations 21 safety information 21 SAS drives 25, 57 SAS hard dri ve LEDs 57 .
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