Benutzeranleitung / Produktwartung LM P-133ST des Produzenten Dell
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Information in this manual is subject to change without notice. 1994 –1996 Dell Comp uter C orpora tio n. Al l ri ghts reserve d. Printed in the Unit ed State s of America. Repr oduction in any mann er whatsoev er witho ut the written per mission of Del l Comput er Corporati on is strictl y forbidd en.
v Contents Chapter 1 System Ov erv iew . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 System Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Physical Description . . . . . .
vi Chapter 3 Beep Codes an d Err or Me ssages . . . . . . . . . . . . . . . . . . 3-1 POST Beep Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 System Error Messages . . . . . . . . . . . . . . . . .
vii Audio Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-42 Main Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-43 Cache Board . . . . . . . . .
viii Figure 4-29. I/R Device Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-36 Figure 4-30. Power Button Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-37 Figure 4-31. Touch Pad Removal . . . . . . . . . .
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R ead This First W arnings, Cautio ns, and Notes Throughout this manual, there may be blocks of text printed in bold t ype or in italic type. These blocks are warnings, cautions, and notes, and they are used a s follows: NO TE: A NO TE pr o vides helpful information about using the computer sy stem.
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System Over vie w 1-1 Chapter 1 System Overview T he Dell ® Latitude ® LM P-100SD and LM P-133ST are high-performanc e multimedia porta ble computers tha t use the Intel ® Pe ntium ® microprocessor . This chapter provides an overview of the components and subsystems of these computers.
1-2 Dell Lati tude LM Systems Servi ce Manua l warm swapping. However , the CD-ROM must be in the computer before or during boot in order for the drivers to load. • Built-in serial infrared transmitter/receiver , effective to 1 m (3.3 ft). • Support for connecting an external diskette drive to the pa rallel connector on the I/O panel.
System Over vie w 1-3 Status Display . Figure 1- 3. Statu s Displa y Pan el The status display panel is located directly above the keyboard. This panel shows icons that indicate keyboard operation or suspend mode; CD-ROM, hard-disk drive, diskette drive, and PC Card activity; and status of the power source (AC power or batteries) .
1-4 Dell Lati tude LM Systems Servi ce Manua l Diskette-Drive Ac cess Indicator This indicator blinks when data is being transferred to or from the internal diskette drive. PC Card Indicat or This indicator blinks when the computer is accessing data from an installed PC Card or Cards.
System Over vie w 1-5 Battery Charge Gauge There is a battery charge gauge on the main and second- ary battery . When you press the battery test button (labeled “PUSH”), the appropriate indicator lights up for a few seconds to indicate the amount of charge remaining in the batt ery .
1-6 Dell Lati tude LM Systems Servi ce Manua l S ystem Power The power button controls power to the system. The computer receive s power from either the AC adapter c onnected to an AC power source or from up to two batteries. If you use the AC adapter, constant power is available to the computer .
System Over vie w 1-7 I nterrupt Assi g nment s T able 1-1. Int errupt Assignme nts IRQ Line Used/Available IRQ0 Generated by the system timer IRQ1 Generated by the keyboard c ontroller to signal that.
1-8 Dell Lati tude LM Systems Servi ce Manua l T echnic al Specifications T able 1-2. T echnical Spec ificati ons Microprocessor Microprocessor type . . . . . . . . Intel Pentium microprocessor Microprocessor speed . . . . . . . 100 or 133 MHz Internal cache memory .
System Over vie w 1-9 Memory (Continu ed) Memory access time: tRAC . . . . . . . . . . . . . . . . 70 ns tCAC . . . . . . . . . . . . . . . . 20 ns BIOS address . . . . . . . . . . . . . F000:0000 Connectors Serial (DTE) . . . . . . . . . . . . . . one 9-pin connector; 16,550-compatible, 16-byte buf fer Parallel .
1-10 Dell Lati tude LM Systems S ervic e Manua l Vid eo V ideo type . . . . . . . . . . . . . . . . 64-bit (128-bit hardware ac celerated) PCI V ideo controller . . . . . . . . . . . Ne oMagic 2070 V ideo memory . . . . . . . . . . . . 896 KB Active-Matr ix Display T ype .
System Over vie w 1-1 1 Dual-Scan Displa y (Contin ued) Dot pitch . . . . . . . . . . . . . . . . . 0.29 mm Power consumption. . . . . . . . . 3.4 W Controls . . . . . . . . . . . . . . . . . . bright ness and contrast can be controlled through key combinations Keyboard Number of keys .
1-12 Dell Lati tude LM Systems S ervic e Manua l Main Battery T ype . . . . . . . . . . . . . . . . . . . . lithium ion Dimensions: Height . . . . . . . . . . . . . . . . 22.0 mm (0.86 inch) Depth . . . . . . . . . . . . . . . . 219.0 mm (8.62 inches) W idth .
System Over vie w 1-13 AC Adapter Input voltage . . . . . . . . . . . . . . 90 to 264 V AC Input current (maximum) . . . . 1.0 A at 100 V AC, full load Input frequency . . . . . . . . . . . . 47 to 63 Hz Output current . . . . . . . . . . . . . 2.6 A (continuous) Output power .
1-14 Dell Lati tude LM Systems S ervic e Manua l Env iro nm ent al (C om put er ) T em pera tur e: Operating . . . . . . . . . . . . . 5 ° to 35 ° C (41 ° to 95 ° F) Storage . . . . . . . . . . . . . . . -20 ° to 50 ° C (-4 ° to 122 ° F) Relative humidity .
Initia l Proc edures 2 -1 Chapter 2 Initial Procedures T his chapter describes initial procedures that can help you diagnose a com- puter problem. These procedures can often r eveal the source of a proble m or indicate the correct starting point for troubleshooting the computer .
2-2 Dell Lati tude LM Systems Servi ce Manua l components, as instructed in the following procedure, see Chapter 4, “Remov- ing and Replacing Parts.” T o perform a visual inspection, follow these steps: 1. Determine th e power st ate of the comp uter .
Initia l Proc edures 2 -3 12. If an external monitor is connected, verify the f ollowing: a. The monitor’ s interface cable is properly attac hed to the exte rnal- monitor connector on the computer ’ s I/O panel. b. The monitor ’ s power cable is attached to a pow er source and is free of any obvious physical damage.
2-4 Dell Lati tude LM Systems Servi ce Manua l 3. W atch the indicators at the top of the keyboard. Depending on how your computer is configured, after various indicators flash momen- tarily in the status display pan el, some indicators shoul d light up and remain on .
Initia l Proc edures 2 -5 E liminatin g Resource Con flicts Devices within or connected to the computer may require dedica ted memory spaces, interrupt levels, and/or DMA channels. Because dif f erent devices can be configured at dif fe rent times, it is possible the same resource is assigned to two or more devices.
2-6 Dell Lati tude LM Systems Servi ce Manua l.
Beep C odes and E rror Mes sages 3-1 Chapter 3 Beep Codes and Error Messa g es T his chapter describes beep c odes and system error messages that can occur during system start-up or , in the case of some failures, during normal computer operation.
3-2 Dell Lati tude LM Systems Servi ce Manua l T able 3-1. POST Beep Codes Beep Code Error Probable Causes 1-2 Memor y module not bein g p ro p erl y identified or used Fault y memor y module or fault.
Beep C odes and E rror Mes sages 3-3 S ystem Error Messa g es The following table lists (in alphabetical or der) system error messages that may appear on the display during the boot routine or during normal computer operation.
3-4 Dell Lati tude LM Systems Servi ce Manua l Keyboard error Keyboard not respond- ing correctly . Built-in keyboard: Faulty keyboard or key pressed while com- puter booting. External keyboard: Cable or connector loose. Faulty keyboard or key pressed while computer booting.
Beep C odes and E rror Mes sages 3-5 System CMOS checksum bad—run Setup CMOS has been cor- rupted or modified, pos- sibly by an application program that changes data stored in CMOS. BIOS has been updated. System RAM failed at off- set: nnnn Memory not operating correctly .
3-6 Dell Lati tude LM Systems Servi ce Manua l R unnin g the Dell Dia g nostics The Dell diagnostics contains tests that aid in troubleshooting the computer .
Removin g and Re placing Parts 4-1 Chapter 4 Remo vin g and Replacin g Parts T his chapter provides procedures f or removing and replacing components, assemblies, and subassemblies.
4-2 Dell Lati tude LM Systems Servi ce Manua l • Small scribe (or Delrin [plastic] screwdriver) • Nut drivers • Chip removal tool S crew Identification and T i g hte nin g . Figure 4-2. Screw Identificati on Where applicable, information about screw lengths is provided in illustrations.
Removin g and Re placing Parts 4-3 P recautionary Measu res Before performing any of the proc edures in this chapter , rea d the following warning. 1. Determine t he powe r state of the c ompute r .
4-4 Dell Lati tude LM Systems Servi ce Manua l 5. Remove the hard-disk drive assembly . T urn the computer over and remove screws HD 1 and HD2. T urn the com- puter right side up. W ith the computer fac ing you, slide the hard-disk drive cover to the left and away from the computer .
Removin g and Re placing Parts 4-5 Keep holding the latch with one hand while pulling the device (diskette drive, secondary battery , or CD-ROM) straight out of the options bay with the other . Figure 4-6. Diskette Drive, Secondary Battery , or CD-ROM Removal 7.
4-6 Dell Lati tude LM Systems Servi ce Manua l Z IF Connec tors Some of the computer ’ s interf ace connectors are zero insertion force (ZIF) c on- nectors. These connectors are not re movable; they must be released to disconnect a cable from them. T o disconnect an interface cable from a ZIF connector , follow these steps: 1.
Removin g and Re placing Parts 4-7 E xploded V iews of Com ponents an d Assemb lies . Figure 4-9. Exploded V i ew—C omp uter LCD panel assembly keyboard bottom assembly diskette drive, secondary bat.
4-8 Dell Lati tude LM Systems Servi ce Manua l Figure 4-10. Exploded V iew—LCD Assembly front bezel LCD panel power/suspend indicator inverter board inverter board connector microphone lat ch back b.
Removin g and Re placing Parts 4-9 . Figure 4-1 1. Exploded V i ew—Top Assembl y keyboard flex cable keyboard LCD flex- cable cover power button keyboard screw cover (2) hinge cover touch pad button.
4-10 Dell Lati tude LM Systems S ervic e Manua l . Figure 4-12. Exploded V iew—Bottom Assembly main board power board audio board cache board I/O panel door I/O bra cket bot to m assembly memory mo .
Removin g and Re placing Parts 4-1 1 F actory Rep air Parts and Assemblies This section contains a parts list and procedur es for removing and replacing fac- tory components and subassemblies. This information is provided for refer ence only . Dell does not recommend removal and replacement of these parts in the field.
4-12 Dell Lati tude LM Systems S ervic e Manua l Board Assembli es (Continu ed) Board assembly , 133-MHz, service kit SVC,SYS,PLN,LMP133ST Main board SYS,PLN,3.
Removin g and Re placing Parts 4-13 Hard-Disk Drive Ass emblies Hard-disk drive, 540-MB, service kit* CUS,HD,540MB,I,F2,12.5MM ,NBK Hard-disk drive, subassembly , 540-MB SUBASSY ,HD,540MB,LF2, 12.5MM,NBK Hard-disk drive, 540-MB HD,540MB,I,F2,12.5MM,NBK Bracket, hard-disk drive BRKT ,HD,12.
4-14 Dell Lati tude LM Systems S ervic e Manua l LCD Assem bly LCD panel, active-m atrix color display (TF T), 12.1” LCD,TF T ,SVGA,12.1”,LMP ,IBM Board, TF T inverter CRD,INVR TR,TF T ,LMP Cable,.
Removin g and Re placing Parts 4-15 Miscellaneous P arts (Con tinu ed) Cove r , fl ex-cab le CVR,HN G,CT R,LM P Insulator , expansion connector INSUL,CON,DCKG,LMP Insulator , main board INSUL,MYLAR,I/.
4-16 Dell Lati tude LM Systems S ervic e Manua l Service D ocumentat ion (Con tinu ed) T echnical sheet, whole unit replacement TSH,WU E,SVC,LMP T echnical sheet, m emory module TSH,MEM,LMP ,ENG Softwa re Diagnostics diske tte, service kit, U.S. KIT ,DSK,DIAG,V3.
Removin g and Re placing Parts 4-17 T able 4-2. Naming Conventions Name in This Manual Name in Other Documents Main board Mother board assembly Processor board CPU daughter board Heat sink Daughter ca.
4-18 Dell Lati tude LM Systems S ervic e Manua l D eletin g the Password If a user forgets the password and does not have it backed up on diskette, the user must return the computer to the facto r y where a service provider will delete the password using the following pr ocedure.
Removin g and Re placing Parts 4-19 H ard-Disk Drive Figure 4- 14 . Hard-Di sk Dri ve Disas sembly The hard-disk drive resides in a carrier that mounts in the comput er ’ s hard-disk drive compartment on the front of the computer . Four screws secure the dr ive inside the ca rrier .
4-20 Dell Lati tude LM Systems S ervic e Manua l D iskette Drive Figure 4-1 5. Disk ette D ri v e Asse m bly The diskette drive resides in a carrier that slides into the options drive bay on the right side of the computer . T he diskette drive and carrier a re replaced as a unit and are not disassembled.
Removin g and Re placing Parts 4-21 C D-ROM Figure 4- 16. CD-RO M Assem bly The CD-ROM resides in a carrier that slides into the options drive bay on the right side of the computer . The CD-ROM and c arrier are re placed as a unit and are not disassembled.
4-22 Dell Lati tude LM Systems S ervic e Manua l M emory Module . Figure 4-17. Memor y Module Removal T o remove a memor y module, follow these ste p s: 1. T urn the computer over , and r e move the two memory-m odule cover screws. 2. Remove the memory module cover .
Removin g and Re placing Parts 4-23 L CD Assembly The LCD assembly consists of t he display assembly and it s related components. The subsections that follow provide removal and replacement pr ocedures for the components of the LCD assembly . Figure 4-18.
4-24 Dell Lati tude LM Systems S ervic e Manua l Front Bezel NOTE: This fig ure shows the ST N LCD assem b ly , w hic h has t he sa me front beze l as the T FT LCD assem bly . Figure 4-19. Front Bezel Remo val T o remove the front bezel, f ollow these steps: 1.
Removin g and Re placing Parts 4-25 LCD Panel There are two types of LCD panels: t he d ua l- sc an c ol or d is pl a y (S T N) a nd t he active -mat rix colo r di splay (TF T). T he re mov al pro cess for b oth LCD panel s is the same. . Figure 4-20.
4-26 Dell Lati tude LM Systems S ervic e Manua l Inverter Board . Figure 4-21 . Inverter Board Re moval T o remove the inverter board, follow these steps: 1. Remove the front bezel. See “Front Bezel” found ear lier in this section. 2. Remove the LCD panel.
Removin g and Re placing Parts 4-27 LCD Assembly Latches Figure 4-22. LCD Assembly Latches Removal T o remove the LC D assembly lat ches, follow these steps: 1. Remove the fron t bezel. See “Front Bezel” found earlier in this section. 2. Place the back beze l down on a wor k surface.
4-28 Dell Lati tude LM Systems S ervic e Manua l Power/Susp end Indicator Figure 4-23. Power/Suspend Indicator Removal T o remove the power/suspend indicator , follow these steps: 1. Remove the front bezel. See “Front Bezel” found ear lier in this section.
Removin g and Re placing Parts 4-29 Back Bezel Figure 4-24. Back Beze l Removal T o remove the back be zel, follow these steps: 1. Remove the fron t bezel. See “Front Bezel” found earlier in this section. 2. Remove the LCD panel. See “LCD Panel” found earlier in this section.
4-30 Dell Lati tude LM Systems S ervic e Manua l K eyboard This section provides the removal procedure for the keyboard. Also, it includes the removal procedure fo r the heat sink. Figure 4-25. Keyboard Removal T o remove the keyboard, follow these steps: 1.
Removin g and Re placing Parts 4-31 4. Remove heat sink scr ews S3 and S4. Lift of f the heat sink. 5. Disconnect the keyboard cabl e from the main board. Use a small flat-blade screwdriver to releas e the ZIF connector securing the keyboard cable. 6.
4-32 Dell Lati tude LM Systems S ervic e Manua l T op Assemb ly The top assembly consists of the plastic palm rest and its related components. The subsections that follow provide removal and replacement procedures for the components of the top assembly .
Removin g and Re placing Parts 4-33 T o remove the top assembly , follow these steps: 1. Remove the LCD panel. See “LCD Panel” found earlier in this chapter . 2. Remove the keyboard. See the previous section, “Keyboard.” 3. Remove side scr e ws SD1 and SD2.
4-34 Dell Lati tude LM Systems S ervic e Manua l Speakers Figure 4-27 . Speakers Removal T o remove the speakers, follow these ste ps: 1. Remove the top assembly . See the previous section, “T op Assembly .” 2. Remove speaker scr ews S5, S6, S22, and S23.
Removin g and Re placing Parts 4-35 Status Displa y Board Figure 4-2 8. Stat us Di splay Boar d Removal T o remove the status display board, follow these steps: 1. Remove the top assembly . See “T op Assembly” found earlier in this sect ion. 2. Remove status-display board screws S7, S 8, and S9.
4-36 Dell Lati tude LM Systems S ervic e Manua l I/R Device Figure 4-29 . I/R Devi ce Remova l T o remove the infrared ( I/R) device, follow these steps: 1. Remove the top assembly . See “T op Assembly” found earlier in this section. 2. Disconnect the I/R device connector from the status di splay board.
Removin g and Re placing Parts 4-37 Power Button Figure 4-30. Power Button Removal T o remove the power button, follow these steps: 1. Remove the top assembly . See “T op Assembly” found earlier in this sect ion. 2. Remove the status display board.
4-38 Dell Lati tude LM Systems S ervic e Manua l T ouc h Pa d Figure 4-31. T ouch Pad Removal T o remove the touch pad, follow these steps: 1. Remove the top assembly and turn it over . See “T op Assembly” found earlier in this section. 2. Remove touch pad scr ews S1 1, S12, and S13.
Removin g and Re placing Parts 4-39 B ottom Ass embly This bottom assembly consists of a plastic base, the main board, and the main board components. The subsections that follow provide removal and replac e- ment procedures for the components of the bottom assembly .
4-40 Dell Lati tude LM Systems S ervic e Manua l Processor Board Figure 4-33 . Processor Board Removal T o remove the processor boar d, follow these steps: 1. Open the cover . 2. Remove the keyboard. See “Keyboard” f ound earlier in this chapter .
Removin g and Re placing Parts 4-41 Power Supp ly Bo ard Figure 4-34. Power Supply Board Removal T o remove the power supply board, follow these steps: 1. Open the c over . 2. Remove the top assembly . See “T op Assembly” found earlier in this chapter .
4-42 Dell Lati tude LM Systems S ervic e Manua l Audio Boar d Figure 4-35. Audio Board Removal T o remove the audio board, follow these steps: 1. Open the cover . 2. Remove the top assembly . See “T op Assembly” found earlier in this chapter . 3. Remove the cable from the audio board.
Removin g and Re placing Parts 4-43 Main Board Figure 4-36 . Main Boa rd Rem oval T o remove the main board, follow these steps: 1. Open the c over . 2. Remove the top assembly . See “T op Assembly” found earlier in this chapter . 3. Remove the power supply board.
4-44 Dell Lati tude LM Systems S ervic e Manua l 6. T urn the computer arou nd, open the I/O panel cover , and r emove standoff nuts ST1, ST2, ST3, ST4, ST5, ST 6, ST7, and ST8. Use a 3/16 nut driver to remove standof f nuts ST1 through ST6 and a 7/32 nut driver for ST7 and ST8.
Removin g and Re placing Parts 4-45 Cache Board Figure 4-37 . Cache Boa rd Removal T o remove the cache boar d, follow these steps: 1. Open the c over . 2. Remove the main board. See the previous subsection, “Main Board.” 3. T urn the main board over .
4-46 Dell Lati tude LM Systems S ervic e Manua l.
Index 1 Index A AC adapter connector , 1-2 AC Power indicator , 1-4 audio board removal , 4-42 B back bezel illustrated , 4-29 removal , 4-29 battery main, removal , 4-3 optional, removal , 4-4 Batter.
2 Index T empla te E eliminat ing resource conflicts , 2-5 error messages , 3-3, 3-6 ESD , 4-3 expansion connector , 1-2 exploded view bottom assembly , 4 -10 computer , 4-7 LCD assembly , 4-8 top ass.
Index 3 M main battery loca tion , 4-3 removal , 4-3 main-battery comp artment , 1-2 memo ry maximum configuration , 1-1 system me mory , 1-1 memory module capacities supported , 1-1 removal , 4-22 mi.
4 Index T empla te status display board removal , 4- 35 status display panel about , 1-3 loca tion , 1-2 subsystems tes ting , 3-6 suspend mode , 1-6 Suspend Mode indicator , 1-3 suspend-to-disk mode .
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