Benutzeranleitung / Produktwartung CY7C1422BV18 des Produzenten Cypress
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36-Mbit DDR-II SIO SRAM 2-W ord Burst Architecture CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Cypress Semiconductor Corpora tion • 198 Champion Court • San Jose , CA 95134-1709 • 408-943-2600 Document #: 001-07035 Rev .
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 2 of 30 Logic Block Diagram (CY7C1422BV18) Logic Block Diagram (CY7C1429BV18) 2M x 8 Array CLK A (20:0) Gen. K K Control Logic Address Register D [7:0] Read Add.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 3 of 30 Logic Block Diagram (CY7C1423BV18) Logic Block Diagram (CY7C1424BV18) 1M x 18 Array CLK A (19:0) Gen. K K Control Logic Address Register D [17:0] Read Add.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 4 of 30 Pin Configuration The pin configuration for CY7C1422BV18, CY7C1429 BV18, CY7C1423BV18, and CY7C1424BV18 follow .
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 5 of 30 CY7C1423BV18 (2M x 18) 123456789 10 11 A CQ NC/144M A R/W BWS 1 K NC/28 8M LD A NC/72M CQ B NC Q9 D9 A.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 6 of 30 Pin Definitions Pin Name IO Pin Descripti on D [x:0] Input- Synchronous Data Input Signals. Sampled on the rising edge of K and K clocks during val id write opera tions.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 7 of 30 CQ Echo Clock CQ Referenced with Respect to C . This is a free-running clock and is synchronized to the input clock for output data (C) of the DDR-II. In the single clock mode, CQ is generated with respect to K.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 8 of 30 Functional Overview The CY7C1422BV18, CY7C1429BV18, CY7C1423 BV18, and CY7C1424BV18 are synchronous pi.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 9 of 30 Echo Clocks Echo clocks are provided on the DDR- II to simplify data capture on high-speed systems. T wo echo clocks ar e generated by the DDR-II. CQ is referenced with respect to C and CQ is referenced with respect to C .
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 10 of 30 T ruth T able The truth table for CY7C1422BV18, CY7C1429BV 18, CY7C1423BV18, and CY7C1424BV18 follo ws. [2, 3, 4, 5, 6, 7] Operation K LD R/W DQ DQ Write Cycle: Load address; wait one cycle; input write data on consecutive K and K rising edges.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 1 1 of 30 Write Cycle Descriptions The write cycle description tabl e for CY7C1429BV18 follows. [2, 8] BWS 0 K K Comments L L–H – During the Data portion of a write sequence, the single byte (D [8:0] ) is writ te n in to the device.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 12 of 30 IEEE 1 149.1 Serial Boundary Scan (JT AG) These SRAMs incorporate a serial boundary scan T est Access Port (T AP) in the FBGA p ackage. This part is fully comp liant with IEEE S tandard #1 149.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 13 of 30 IDCODE The IDCODE instruction loads a vendor-specific, 32-bi t code into the instruction re gister .
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 14 of 30 T AP Controller St ate Diagram The state diagram for the T AP controller follows.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 15 of 30 T AP Controller Block Diagram T AP Electrical Characteristics Over the Operating Range [10, 1 1, 12] Parameter Description T est Conditions Min Max Unit V OH1 Output HIGH V oltage I OH = − 2.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 16 of 30 T AP AC Switching Characteristics Over the Operating Range [13, 14] Parameter Description Min Max Uni.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 17 of 30 Identification R egi ster Definitions Instruction Field Va l u e Description CY7C1422BV18 CY7C1429BV18 CY7 C1423BV18 CY7C1424BV18 Revision Numb er (31:29) 000 000 000 000 V ersion number .
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 18 of 30 Boundary Scan Order Bit # Bump ID Bit # Bump ID Bit # Bump ID Bit # Bum p ID 0 6R 28 10G 56 6A 84 1J .
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 19 of 30 Power Up Sequence in DDR-II SRAM DDR-II SRAMs must be power ed up and initialized in a predefined manner to prevent unde fined operation s. Power Up Sequence ■ Apply power and drive DO FF either HIGH or LOW (All other inputs can be HIGH or LOW).
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 20 of 30 Maximum Ratings Exceeding maximum ratin gs may impair the useful life of the device. These user guidelines are not teste d. S torage T emperature ......
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 21 of 30 I DD V DD Operating Supply V DD = Max, I OUT = 0 mA, f = f MAX = 1/t CYC 200MHz (x8) 600 mA (x9) 600 .
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 22 of 30 Cap acit ance T ested initially and after any design or process change that may affect these parameters. Parameter Description T est Condit ions Max Unit C IN Input Capacitance T A = 25 ° C, f = 1 MHz, V DD = 1.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 23 of 30 Switching Characteristics Over the Operating Range [20, 21] Cypress Parameter Consor tium Parameter D.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 24 of 30 Output T imes t CO t CHQV C/C Clock Rise (or K/K in single clock mode) to Data V alid – 0.45 – 0.45 – 0.45 – 0.45 – 0.50 ns t DOH t CHQX Data Output Hold af ter Output C/C Clock Rise (Active to Active) –0.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 25 of 30 Switching W aveforms Figure 5. Read/Write/Deselect Sequence [2 7, 28, 29 ] K 123 4 5 6 7 8 K LD R/W A.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 26 of 30 Ordering Information Not all of the speed, package and temperature range s are ava ilable. Please contact your local sales representative or visit www .
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 27 of 30 250 CY7C1422BV18-250BZC 51-85195 165-Ball F ine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Commercial CY7C1429BV18-250BZC CY7C1423BV18-250BZC CY7C1424BV18-250BZC CY7C1422BV18-250BZXC 51-85195 165-Ball Fine Pi tch Ball Grid Array (15 x 17 x 1.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 28 of 30 167 CY7C1422BV18-167BZC 51-85195 165-Ball F ine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Commercial CY7C1429BV18-167BZC CY7C1423BV18-167BZC CY7C1424BV18-167BZC CY7C1422BV18-167BZXC 51-85195 165-Ball Fine Pi tch Ball Grid Array (15 x 17 x 1.
CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18 Document #: 001-07035 Rev . *D Page 29 of 30 Package Diagram Figure 6. 165-ball FBGA (15 x 17 x 1.
Document #: 001-07035 Rev . *D Revised June 16, 2008 Page 30 of 30 QDR RAMs an d Quad Data Rate RAMs comp rise a new family of product s developed by Cypress, I DT , NEC, R enesas, and Sa msung. All pr oduct and comp any names mentioned i n this documen t are the tr ad emarks of their resp ectiv e ho lders.
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